| Budget Amount *help |
¥18,330,000 (Direct Cost: ¥14,100,000、Indirect Cost: ¥4,230,000)
Fiscal Year 2018: ¥2,600,000 (Direct Cost: ¥2,000,000、Indirect Cost: ¥600,000)
Fiscal Year 2017: ¥2,730,000 (Direct Cost: ¥2,100,000、Indirect Cost: ¥630,000)
Fiscal Year 2016: ¥13,000,000 (Direct Cost: ¥10,000,000、Indirect Cost: ¥3,000,000)
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| Outline of Final Research Achievements |
In this work, we succeeded quantitative evaluation of the threshold energy for exothermic reaction in Ti/Si multilayer films by means of mechanical shock test. We found that Ti/Si film with thinner bilayer thickness could react by smaller external energy for exothermic reaction. Differential scanning calorimetry demonstrated that Ti/Si film with thinner bilayer thickness showed the first exothermic peak at lower temperature. Based on these experimental facts, we successfully fabricated reactively-soldered Si chips with Ti/Si exothermic reactive film by only single mechanical shock.
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