Establishment of Scientific Basis of the Strength and Reliability of Materials Based on the Order of Atom Arrangement and Its Application to the Explication of the Degradation Process of Materials

• Project/Area Number: 16H06357
• Research Category: Grant-in-Aid for Scientific Research (S)
• Allocation Type: Single-year Grants
• Research Field: Materials/Mechanics of materials
• Research Institution: Tohoku University
• Principal Investigator: Miura Hideo 東北大学, 工学研究科, 教授 (90361112)
• Co-Investigator(Kenkyū-buntansha): 鈴木 研 東北大学, 工学研究科, 准教授 (40396461)
• Project Period (FY): 2016-05-31 – 2021-03-31
• Project Status: Completed (Fiscal Year 2021)
• Budget Amount: ¥105,040,000 (Direct Cost: ¥80,800,000、Indirect Cost: ¥24,240,000); Fiscal Year 2020: ¥12,870,000 (Direct Cost: ¥9,900,000、Indirect Cost: ¥2,970,000); Fiscal Year 2019: ¥14,040,000 (Direct Cost: ¥10,800,000、Indirect Cost: ¥3,240,000); Fiscal Year 2018: ¥30,290,000 (Direct Cost: ¥23,300,000、Indirect Cost: ¥6,990,000); Fiscal Year 2017: ¥23,790,000 (Direct Cost: ¥18,300,000、Indirect Cost: ¥5,490,000); Fiscal Year 2016: ¥24,050,000 (Direct Cost: ¥18,500,000、Indirect Cost: ¥5,550,000)
• Keywords: 高温強度 / 耐熱合金 / 微細強化組織 / 応力依存原子拡散 / マイクロスケール強度試験 / 電子線後方散乱回折 / 可視光反射スペクトル / クリープ疲労損傷 / 微小強度試験 / 非破壊検査 / 機械材料・材料力学 / ナノマイクロ材料力学 / 材料損傷 / 原子拡散 / 結晶粒界品質 / 表面・界面物性 / 解析・評価 / 長寿命化 / 構造・機能材料

Outline of Final Research Achievements

The degradation process of heat-resistant alloys used under large mechanical loads at elevated temperatures was quantitatively visualized by applying a scanning electron microscope. The mechanism of the disappearance of the strengthened micro texture and drastic decrease in the fracture lifetime was successfully analyzed by the mechanical stress-induced anisotropic acceleration of atomic diffusion of component elements at elevated temperatures. The degradation process was quantitatively predicted by using the modified Arrhenius equation. In addition, non-destructive inspection method of the micro texture change was established by applying the fine spectrum analysis of the deflected visible light in the atmosphere.

Academic Significance and Societal Importance of the Research Achievements

連続体の力学に基づく従来の材料定数という概念を用いた「材料強度学」学術分野において、材料の不均一性を原子レベルで繙き、材料中の原子結合状態をナノスケールの空間分布として分析することで、材料強度の発現メカニズムとその劣化消失過程及びその支配因子を科学的合理に基づき解明し、新たな「材料強度科学」学術分野の創成を実現した。劣化損傷の定量的な予測技術、組織変化の大気中非破壊検査技術は安全で安心な電力供給や航空機運航にも資するものである。

Assessment Rating

Verification Result (Rating)

A+

Research Products

• [Int'l Joint Research] 華東理工大学/北京科学技術大学/清華大学(中国)
• [Int'l Joint Research] 北京科学技術大学(中国)
• [Int'l Joint Research] 北京科学技術大学/浙江大学(中国)
• [Int'l Joint Research] 北京科学技術大学/Tsinghua University(中国)
• [Journal Article] Quantitative evaluations of improved surface integrity in ultrasonic rolling process for selective laser melted in-situ TiB2/Al composite (2022)
  • Author(s): Yi-Xin Liu, Cheng-Cheng Zhang, Run-Zi Wang, Kai-Ming Zhang, Ji Wang, Shu-Lei Yao, Hao Chen, Xian-Cheng Zhang, Hideo Miura
  • Journal Title: Journal of Manufacturing Processes Volume: 77 Pages: 412-425
  • DOI: 10.1016/j.jmapro.2022.03.026
  • Peer Reviewed / Open Access / Int'l Joint Research
• [Journal Article] A dual-scale modelling approach for creep-fatigue crack initiation life prediction of holed structure in a nickel-based superalloy (2022)
  • Author(s): Kai-Shang Li, Lv-Yi Cheng, Yilun Xu, Run-Zi Wang, Yong Zhang, Xian-Cheng Zhang, Shan-TungTu, Hideo Miura
  • Journal Title: International Journal of Fatigue Volume: 154 Pages: 106522-106522
  • DOI: 10.1016/j.ijfatigue.2021.106522
  • Peer Reviewed / Open Access / Int'l Joint Research
• [Journal Article] Creep-Fatigue Damage of Heat-Resistant Alloys Caused by the Local Lattice Mismatch-Induced Acceleration of the Generation and Accumulation of Dislocations and Vacancies (2022)
  • Author(s): Yifan Luo, Shogo Tezuka, Koki Nakayama, Ayumi Nakayama, Ken Suzuki, Hideo Miura
  • Journal Title: Mechanics of Solids, Structures, and Fluids Volume: 12 Pages: 1-7
  • DOI: 10.1115/imece2021-68489
  • Peer Reviewed / Open Access
• [Journal Article] Acceleration Mechanism of Intergranular Cracking of SUS316L Under Creep-Fatigue Loading at Elevated Temperatures (2022)
  • Author(s): Yukako Takahashi, Ken Suzuki, Hideo Miura
  • Journal Title: Mechanics of Solids, Structures, and Fluids Volume: 12
  • DOI: 10.1115/imece2021-70108
  • NAID: 130008093349
  • Peer Reviewed / Open Access
• [Journal Article] Molecular Dynamics Analysis of the Acceleration of the Degradation of the Strength of a Grain Boundary Under Creep-Fatigue Loads (2022)
  • Author(s): Shujiroh Suzuki, Shogo Tezuka, Ken Suzuki, Hideo Miura
  • Journal Title: Mechanics of Solids, Structures, and Fluids Volume: 12
  • DOI: 10.1115/imece2021-70628
  • Peer Reviewed / Open Access
• [Journal Article] Cycle-dependent creep-fatigue deformation and life predictions in a nickel-based superalloy at elevated temperature (2021)
  • Author(s): Lv-Yi Cheng, Run-Zi Wang, Ji Wang, Shun-Peng Zhu, Peng-Cheng Zhao, Hideo Miura, Xian-Cheng Zhang, Shan-Tung Tu
  • Journal Title: International Journal of Mechanical Sciences Volume: 206 Pages: 106628-106628
  • DOI: 10.1016/j.ijmecsci.2021.106628
  • Peer Reviewed / Open Access / Int'l Joint Research
• [Journal Article] A crystal plasticity-based approach for creep-fatigue life prediction and damage evaluation in a nickel-based superalloy (2021)
  • Author(s): Kai-Shang Li, Run-Zi Wang, Guang-Jian Yuan, Shun-Peng Zhu, Xian-Cheng Zhang, Shan-Tung Tu, Hideo Miura
  • Journal Title: International Journal of Fatigue Volume: 143 Pages: 106031-106031
  • DOI: 10.1016/j.ijfatigue.2020.106031
  • Peer Reviewed / Open Access / Int'l Joint Research
• [Journal Article] Semi-quantitative creep-fatigue damage analysis based on diffraction-based misorientation mapping and the correlation to macroscopic damage evolutions (2021)
  • Author(s): Run-Zi Wang, Lv-Y iCheng, Shun-Peng Zhu, Peng-Cheng Zhao, Hideo Miura, Xian-Cheng Zhang, Shan-TungTu
  • Journal Title: International Journal of Fatigue Volume: 149 Pages: 106227-106227
  • DOI: 10.1016/j.ijfatigue.2021.106227
  • Peer Reviewed / Open Access / Int'l Joint Research
• [Journal Article] Multi-stage dwell fatigue crack growth behaviors in a nickel-based superalloy at elevated temperature (2021)
  • Author(s): Ji Wang, Run-Zi Wang, Xian-Cheng Zhang, You-Jun Ye, Yan Cui, Hideo Miura, Shan-TungTu
  • Journal Title: Engineering Fracture Mechanics Volume: 253 Pages: 107859-107859
  • DOI: 10.1016/j.engfracmech.2021.107859
  • Peer Reviewed / Open Access / Int'l Joint Research
• [Journal Article] Non-Destructive Evaluation of the Degradation of Ni-Base Superalloy in the Air by Reflectance Spectrum Analysis (2021)
  • Author(s): Shin Kasama, Ken Suzuki, Hideo Miura
  • Journal Title: Mechanics of Solids, Structures, and Fluids Volume: 12
  • DOI: 10.1115/imece2020-23354
  • Peer Reviewed / Open Access
• [Journal Article] Acceleration of Grain Boundary Cracking in Ni-Base Alloy 617 Under Creep-Fatigue Loading at 800°C (2020)
  • Author(s): Ishihara Kenta、Luo Yifan、Miura Hideo
  • Journal Title: International Conference on Theoretical, Applied and Experimental Mechanics, proceeding Volume: NO. IMECE2020-23738 Pages: 1-6
  • DOI: 10.1115/imece2020-23738
  • Peer Reviewed / Open Access
• [Journal Article] Initial Intergranular Cracking of Ni-Base Superalloys Due to the Degradation of the Crystallinity of Grain Boundaries Under Creep-Fatigue Loading (2020)
  • Author(s): Suzuki Wataru、Luo Yifan、Ishihara Kenta、Suzuki Kens、Miura Hideo
  • Journal Title: International Conference on Theoretical, Applied and Experimental Mechanics, proceeding Volume: NO. IMECE2020 Pages: 325-331
  • DOI: 10.1007/978-3-030-47883-4_58
  • ISBN: 9783030478827, 9783030478834
  • Peer Reviewed / Open Access
• [Journal Article] Degradation of the Strength of a Grain Boundary of Ni-Base Superalloys Under Creep-Fatigue Loading at Elevated Temperature (2020)
  • Author(s): Takahashi Yukako、Luo Yifan、Ishihara Kenta、Suzuki Shujiro、Miura Hideo
  • Journal Title: International Conference on Theoretical, Applied and Experimental Mechanics, proceeding Volume: NO. IMECE2020-24473 Pages: 1-6
  • DOI: 10.1115/imece2020-24473
  • Peer Reviewed / Open Access
• [Journal Article] First-principles analysis of the inhibitive effect of interstitial carbon on an active dissolution of martensitic steel (2020)
  • Author(s): Mariko Kadowaki, Arkapol Saengdeejin, Izumi Muto, YingChen, Hiroyuki Masuda, Hideki Katayama, Takashi Doi, Kaori Kawano, Hideo Miura, Yu Sugawara, Nobuyoshi Hara
  • Journal Title: Corrosion Science Volume: 163 Pages: 108251-108251
  • DOI: 10.1016/j.corsci.2019.108251
  • Peer Reviewed / Open Access / Int'l Joint Research
• [Journal Article] Grain Boundary Cracking of Nickel-Based Alloy 625 Under Creep Loadings at Elevated Temperatures (2019)
  • Author(s): Yan Liang , Yifan Luo , Ken Suzuki , Hideo Miura
  • Journal Title: Mechanics of Solids, Structures, and Fluids Volume: 9
  • DOI: 10.1115/imece2019-11186
  • Peer Reviewed / Open Access
• [Journal Article] Strain and Photovoltaic Sensitivities of Dumbbell-Shape GNR-Base Sensors (2019)
  • Author(s): Jowesh Avisheik Goundar , Takuya Kudo , Qinqiang Zhang , Ken Suzuki , Hideo Miura
  • Journal Title: Micro- and Nano-Systems Engineering and Packaging Volume: 10
  • DOI: 10.1115/imece2019-11076
  • Peer Reviewed / Open Access
• [Journal Article] Theoretical Study of the Edge Effect of Dumbbellshape Graphene Nanoribbon with a Dual Electronic Properties by First-principle Calculations (2019)
  • Author(s): Qinqiang Zhang ; Takuya Kudo ; Jowesh Gounder ; Ying Chen ; Ken Suzuki ; Hideo Miura
  • Journal Title: 2019 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) Volume: 2019 Pages: 141-144
  • DOI: 10.1109/sispad.2019.8870398
  • Peer Reviewed / Open Access
• [Journal Article] Change of the Effective Strength of Grain Boundaries in Alloy 617 Under Creep-Fatigue Loadings at 800°C (2019)
  • Author(s): Wataru Suzuki , Kenta Ishihara , Ryo Kikuchi , Ken Suzuki , Hideo Miura
  • Journal Title: Mechanics of Solids, Structures, and Fluids Volume: 10
  • DOI: 10.1115/imece2019-11210
  • Peer Reviewed / Open Access
• [Journal Article] First Principle Analysis of the Effect of Strain on Electronic Transport Properties of Dumbbell-Shape Graphene Nanoribbons (2019)
  • Author(s): Takuya Kudo , Qinqiang Zhang , Ken Suzuki , Hideo Miura
  • Journal Title: Micro- and Nano-Systems Engineering and Packaging Volume: 10
  • DOI: 10.1115/imece2019-11107
  • Peer Reviewed / Open Access
• [Journal Article] Effects of crystallinity on mechanical properties of electroplated gold thin films used for three-dimensional electronic packaging (2019)
  • Author(s): Yutaro Nakoshi, Ken Suzuki and Hideo Miura
  • Journal Title: Japanese Journal of Applied Physics Volume: 58 Issue: SB Pages: SBBC04-SBBC04
  • DOI: 10.7567/1347-4065/ab00f4
  • NAID: 210000135441
  • Peer Reviewed / Open Access
• [Journal Article] Measurement of the Residual Stress Distribution in the 3D-Stacked Electronic Modules by Embedded Strain Sensors (2019)
  • Author(s): Ryota Mizuno , Genta Nakauchi , Ken Suzuki , Hideo Miura
  • Journal Title: Micro- and Nano-Systems Engineering and Packaging Volume: 10
  • DOI: 10.1115/imece2019-11106
  • Peer Reviewed / Open Access
• [Journal Article] Degradation of the Strength of a Grain Boundary in Ni-Base Superalloy Under Creep-Fatigue Loading (2018)
  • Author(s): Wataru Suzuki, Akari Sawase, Ken Suzuki, *Hideo Miura
  • Journal Title: Structural Integrity Volume: 5 Pages: 227-232
  • DOI: 10.1007/978-3-319-91989-8_49
  • ISBN: 9783319919881, 9783319919898
  • Peer Reviewed / Open Access
• [Journal Article] Degradation of the Strength of a Grain and a Grain Boundary due to the Accumulation of the Structural Defects of Crystal (2018)
  • Author(s): Guoxiong Zheng, Yifan Luo and Hideo Miura
  • Journal Title: Mechanics of Solids, Structures, and Fluids Volume: 9
  • DOI: 10.1115/imece2018-87264
  • Peer Reviewed / Open Access
• [Journal Article] Disappearance of Strengthened Micro Texture of Modified 9Cr-1Mo Steel Caused by Stress-Induced Acceleration of Atomic Diffusion at Elevated Temperatures (2018)
  • Author(s): Yifan Luo, Hideo Miura
  • Journal Title: Mechanics of Solids, Structures, and Fluids Volume: 9
  • DOI: 10.1115/imece2018-87368
  • Peer Reviewed / Open Access
• [Journal Article] Disappearance of Martensitic Strengthened-Micro-Texture in Modified 9Cr-1Mo Steel Caused by Stress-Induced Acceleration of Atomic Diffusion at Elevated Temperatures (2018)
  • Author(s): Taichi Shinozaki, Ken Suzuki, and Hideo Miura
  • Journal Title: Key Engineering Materials Volume: 774 Pages: 31-35
  • DOI: 10.4028/www.scientific.net/kem.774.31
  • Peer Reviewed / Open Access
• [Journal Article] Crystallinity-Induced Variation of the Electronic Characteristics of Electroplated Gold Thin Films (2018)
  • Author(s): Yutaro Nakoshi, Hideo Miura
  • Journal Title: Materials: Genetics to Structures Volume: 12
  • DOI: 10.1115/imece2018-87278
  • Peer Reviewed / Open Access
• [Journal Article] Coarsening of nanoscale (Ti,Mo)C precipitates in different ferritic matrixes (2018)
  • Author(s): Lei Cheng, Qingwu Cai, Wei Yu, Jinlong Lv, Hideo Miura,
  • Journal Title: Materials Characterization Volume: 142 Pages: 195-202
  • DOI: 10.1016/j.matchar.2018.05.034
  • Peer Reviewed / Open Access / Int'l Joint Research
• [Journal Article] Area-Arrayed Graphene Nano-Ribbon-Base Strain Sensor (2018)
  • Author(s): Ryohei Nakagawa, Zhi, Wang, Ken Suzuki
  • Journal Title: Micro- and Nano-Systems Engineering and Packaging Volume: 10
  • DOI: 10.1115/imece2018-87277
  • Peer Reviewed / Open Access
• [Journal Article] Development of a Flexible Tactile Sensor Using Area-Arrayed Bundle Structures of Multi-Walled Carbon Nanotubes (2018)
  • Author(s): Ryusaku Osada, Ken Suzuki
  • Journal Title: Micro- and Nano-Systems Engineering and Packaging Volume: 10
  • DOI: 10.1115/imece2018-87275
  • Peer Reviewed / Open Access
• [Journal Article] Superdense microbands strengthening of textured low alloy ferritic steel (2018)
  • Author(s): Lei Cheng, Qingwu Cai, Jinlong Lv, Wei Yu, Hideo Miura,
  • Journal Title: Journal of Alloys and Compounds Volume: 746 Pages: 482-489
  • DOI: 10.1016/j.jallcom.2018.02.297
  • Peer Reviewed / Open Access / Int'l Joint Research
• [Journal Article] Effect of Defects on the Grain and Grain Boundary Strength in Polycrystalline Copper Thin Films (2018)
  • Author(s): Ken Suzuki, Yiqing Fan, Yifan Lio, Hideo Miura
  • Journal Title: Simulation of Semiconductor Processes and Devices Volume: 2018 Pages: 88-91
  • DOI: 10.1109/sispad.2018.8551672
  • Peer Reviewed / Open Access
• [Journal Article] Stress-Induced Change of the Microstructure and Strength of Modified 9Cr-1Mo Steel Under Fatigue and Creep Loadings at Elevated Temperatures (2017)
  • Author(s): Taichi Shinozaki, Ken Suzuki, Hideo Miura
  • Journal Title: ASME 2017 International Mechanical Engineering Congress and Exposition Volume: 9
  • DOI: 10.1115/imece2017-70494
  • NAID: 130006726909
  • Peer Reviewed / Open Access
• [Journal Article] Mechanical Stress Monitoring Sensor for 3-D Module During Manufacturing and Operation (2017)
  • Author(s): Koki Isobe, Ken Suzuki and Hideo Miura
  • Journal Title: ASME 2017 International Mechanical Engineering Congress and Exposition Volume: 10
  • Peer Reviewed / Open Access
• [Journal Article] Crystallinity-Induced Variation of the Yield Strength of Electroplated Copper Thin Films (2017)
  • Author(s): Yifan Luo, Kunio Tei, Ken Suzuki, Hideo Miura
  • Journal Title: ASME 2017 International Mechanical Engineering Congress and Exposition Volume: 9
  • DOI: 10.1115/imece2017-70302
  • Peer Reviewed / Open Access
• [Journal Article] Largely Deformable and Highly Sensitive Strain Sensor Using Carbon Nanomaterials (2017)
  • Author(s): Kanji Yumoto, Ken Suzuki and Hideo Miura
  • Journal Title: ASME 2017 International Mechanical Engineering Congress and Exposition Volume: 10
  • DOI: 10.1115/imece2017-70388
  • Peer Reviewed / Open Access
• [Journal Article] Effect of the Crystallinity on the Electromigration Resistance of Electroplated Copper Thin-Film Interconnections (2017)
  • Author(s): Takeru Kato; Ken Suzuki; Hideo Miura
  • Journal Title: Journal of Electronic Packaging Volume: 139(2) Issue: 2
  • DOI: 10.1115/1.4036442
  • Peer Reviewed / Open Access
• [Journal Article] Highly Sensitive Strain Sensor Using Dumbbell-Shape Graphene Nanoribbon (2017)
  • Author(s): Qinqiang Zhang, Meng Yang, Ken Suzuki and Hideo Miura
  • Journal Title: ASME 2017 International Mechanical Engineering Congress and Exposition Volume: 10
  • DOI: 10.1115/imece2017-70318
  • Peer Reviewed / Open Access
• [Journal Article] Degradation of the Strength of Grains and Grain Boundaries of Ni-Base Superalloy under Creep and Creep-Fatigue Loadings (2017)
  • Author(s): Takuya Murakoshi, Hayato Sakamoto, Taichi Shinozaki, Ken Suzuki and Hideo Miura
  • Journal Title: Key Engineering Materials Volume: 754 Pages: 31-34
  • Peer Reviewed / Open Access
• [Journal Article] ATOMIC DIFFUSION CONTROL IN NI-BASE SUPER ALLOY FOR IMPROVING ITS HIGH TEMPERATURE STRENGTH (2016)
  • Author(s): Motoki Takahashi, Ken Suzuki, Hideo Miura
  • Journal Title: ASME2016 International Mechanical Engineering Congress and Exposition IMECE2016, Proceedings Volume: IMECE2016
  • Peer Reviewed / Open Access / Acknowledgement Compliant
• [Journal Article] MICROSCOPIC ANALYSIS OF THE INITIATION OF HIGH-TEMPERATURE DAMAGE OF NI-BASED HEAT-RESISTANT ALLOY (2016)
  • Author(s): Takuya Murakoshi, Ken Suzuki, Isamu Nonaka, Hideo Miura
  • Journal Title: ASME2016 International Mechanical Engineering Congress and Exposition IMECE2016, Proceedings Volume: IMECE2016
  • Peer Reviewed / Open Access / Acknowledgement Compliant
• [Journal Article] Crystallinity-induced Degradation of the Lifetime of Advanced Interconnections (2016)
  • Author(s): Takeru Kato, Ken Suzuki, Hideo Miura
  • Journal Title: ASME2016 International Mechanical Engineering Congress and Exposition IMECE2016, Proceedings Volume: IMECE2016
  • Peer Reviewed / Open Access / Acknowledgement Compliant
• [Journal Article] Crystallinity Control of Electroplated Interconnections for Improving Their Stability and Lifetime (2016)
  • Author(s): Jiatong Liu, Ken Suzuki, Hideo Miura
  • Journal Title: ASME2016 International Mechanical Engineering Congress and Exposition IMECE2016, Proceedings Volume: IMECE2016
  • Peer Reviewed / Open Access / Acknowledgement Compliant
• [Journal Article] Initial Degradation Process of Heat-resistant Materials Based on the Change of Crystallinity of Grains and Grain Boundaries (2016)
  • Author(s): Takuya Murakoshia, Taichi Shinozakia, Ken Suzukib and Hideo Miura
  • Journal Title: Structural Integrity Procedia Volume: 2 Pages: 1383-1390
  • DOI: 10.1016/j.prostr.2016.06.176
  • Peer Reviewed / Open Access / Acknowledgement Compliant
• [Presentation] 可視光反射スペクトルを用いた Ni 基超合金の微細析 出物の大気中検出 (2022)
  • Author(s): 松田颯斗
  • Organizer: 日本機械学会東北支部 東北学生会 第 52 回学生員卒業研究発表講演会
• [Presentation] 構造材料ピーニング処理表面改質層の高温回復挙動と高温強度劣化現象 (2022)
  • Author(s): 笹井達希
  • Organizer: 日本機械学会東北支部 第 57 期総会・講演会
• [Presentation] Acceleration Mechanism of the Degradation of the Strength of Heat-Resistant Alloys under Creep-Fatigue Loading at Elevated Temperatures (2021)
  • Author(s): Hideo Miura
  • Organizer: 2021 International Symposium on Structural Integrity (ISSI2021)
  • Int'l Joint Research / Invited
• [Presentation] Creep-Fatigue Damage of Heat-Resistant Alloys Caused by the Local Lattice Mismatch-Induced Acceleration of the Generation and Accumulation of Dislocations and Vacancies (2021)
  • Author(s): Yifan Luo
  • Organizer: International Mechanical Engineering Congress & Exposition (IMECE 2021)
  • Int'l Joint Research
• [Presentation] Molecular Dynamics Analysis of the Acceleration of the Degradation of the Strength of a Grain Boundary Under Creep Fatigue Loads (2021)
  • Author(s): Shujiroh Suzuki
  • Organizer: International Mechanical Engineering Congress & Exposition (IMECE 2021)
  • Int'l Joint Research
• [Presentation] Acceleration Mechanism of Intergranular Cracking of SUS316L Under Creep-Fatigue Loading at Elevated Temperatures (2021)
  • Author(s): Yukako Takahashi
  • Organizer: ASME International Mechanical Engineering Congress & Exposition (IMECE 2021)
  • Int'l Joint Research
• [Presentation] Ni基超合金GH4169の高温粒界強度に及ぼすDelta相析出の影響 (2021)
  • Author(s): 中山歩美
  • Organizer: 日本機械学会 M&M2021 材料力学カンファレンス
• [Presentation] Ni基耐熱合金の高温クリープ疲労損傷に及ぼすひずみ速度の影響の基礎検討 (2021)
  • Author(s): 中山昴紀
  • Organizer: 日本機械学会 M&M2021 材料力学カンファレンス
• [Presentation] Initial Intergranular Cracking of Ni-base Superalloys due to the Degradation of the Crystallinity of Grain Boundaries under Creep-Fatigue Loading (2020)
  • Author(s): Hideo Miura
  • Organizer: International Conference on Theoretical, Applied, Experimental Mechanics
  • Int'l Joint Research / Invited
• [Presentation] Electro and Stress-Induced Migration of Various Thin Film Interconnections (2020)
  • Author(s): Hideo Miura
  • Organizer: IEEE IMPACT-EMAP 2020
  • Int'l Joint Research / Invited
• [Presentation] Photovoltaic Properties of Dumbbell-shape Graphene Nanoribbons for Solar Cells (2020)
  • Author(s): Hideo Miura
  • Organizer: The International Conference on Smart Energy Systems (SES'20)
  • Int'l Joint Research / Invited
• [Presentation] Degradation of the Strength of a Grain Boundary of Ni-Base Superalloys Under Creep-Fatigue Loading at Elevated Temperature (2020)
  • Author(s): Yukako Takahashi,
  • Organizer: ASME International Mechanical Engineering Congress & Exposition (IMECE)2020
  • Int'l Joint Research
• [Presentation] Degradation of the Strength of a Grain Boundary of Ni-Base Superalloys Under Creep-Fatigue Loading at Elevated Temperature (2020)
  • Author(s): Hideo Miura
  • Organizer: ASME International Mechanical Engineering Congress & Exposition (IMECE)2020
  • Int'l Joint Research / Invited
• [Presentation] Quantitative Evaluation of the Dominant Factors of Intergranular Cracking of Ni-Base Superalloys Under Creep-Fatigue Loadings at Elevated Temperature (2020)
  • Author(s): Yifan Luo
  • Organizer: ASME International Mechanical Engineering Congress & Exposition (IMECE)2020
  • Int'l Joint Research
• [Presentation] Molecular Dynamics Analysis of the Acceleration of Intergranular Cracking of Ni-Base Superalloy Caused by Accumulation of Vacancies and Dislocations Around Grain Boundaries (2020)
  • Author(s): Ryo Kikuchi
  • Organizer: ASME International Mechanical Engineering Congress & Exposition (IMECE)2020
  • Int'l Joint Research
• [Presentation] Acceleration of Grain Boundary Cracking in Ni-Base Alloy 617 Under Creep-Fatigue Loading at 800℃ (2020)
  • Author(s): Kenta Ishihara
  • Organizer: ASME International Mechanical Engineering Congress & Exposition (IMECE)2020
  • Int'l Joint Research
• [Presentation] Non-Destructive Evaluation of the Degradation of Ni-Base Superalloy in the Air by Reflectance Spectrum Analysis (2020)
  • Author(s): Shin Kasama
  • Organizer: ASME International Mechanical Engineering Congress & Exposition (IMECE)2020
  • Int'l Joint Research
• [Presentation] Mechano-chemical Degradation Analysis of Heat-resistant Alloys at Elevated Temperatures in Nano-scale (2019)
  • Author(s): Hideo Miura
  • Organizer: International Conference on Chemical Physics and Materials Science
  • Int'l Joint Research / Invited
• [Presentation] Quantitative Visualization of Atomic-Scale Degradation of Heat-resistant Alloys under Creep-Fatigue Loadings at Elevated Temperature (2019)
  • Author(s): Yifan LUO, Wataru SUZUKI, Kenta ISHIHARA, Yan LIANG, Ken SUZUKI, Hideo MIURA
  • Organizer: 2019 Global Research Efforts on Energy and Nanomaterials
  • Int'l Joint Research / Invited
• [Presentation] Initial grain-boundary cracking of Ni-base superalloys under creep-fatigue loadings at 750℃ (2019)
  • Author(s): K.Ishihara, W.Suzuki, Y.Luo, K.Suzuki, and H.Miura
  • Organizer: International Conference on the Mechanical Behavior of Materials
  • Int'l Joint Research / Invited
• [Presentation] Development of a flexible pressure distribution sensor using multi-walled carbon nanotubes (2019)
  • Author(s): K.Suzuki, R.Osada, H.Miura
  • Organizer: 30th International Conference on Diamond and Carbon Materials
  • Int'l Joint Research
• [Presentation] Non-destructive Measurement of the Change of Micro Texture of Alloys Using Reflectance Spectrum Analysis of Visible lights (2019)
  • Author(s): Kasama,S, Suzuki,K, Miura,H
  • Organizer: International Conference of Advanced Technology in Experimental Mechanics 2019
  • Int'l Joint Research
• [Presentation] Grain Boundary Cracking in Ni-base Alloy 617 Under Creep-fatigue Loading at Elevated Temperatures (2019)
  • Author(s): Ishihara,K, Suzuki,W, Luo,Y, Suzuki,K, Miura,H
  • Organizer: International Conference of Advanced Technology in Experimental Mechanics 2019
  • Int'l Joint Research
• [Presentation] Degradation Mechanism of Grain Boundaries in Nickel-Based Alloy 625 Under Creep-Fatigue Loadings at Elevated Temperatures (2019)
  • Author(s): Luo,Y, Suzuki,K, Miura,H
  • Organizer: International Conference of Advanced Technology in Experimental Mechanics 2019
  • Int'l Joint Research
• [Presentation] Multi-Channel Dumb-bell shaped Graphene Nanonribbon Structure to Elucidate Electronic Fluctuations for an Enhanced Performance (2019)
  • Author(s): Jowesh Goundar, Takuya Kudo, Qinqiang Zhang, Ken Suzuki, Hideo Miura
  • Organizer: IEEE 2019 International 3D Systems Integration Conference
  • Int'l Joint Research
• [Presentation] Grain Boundary Cracking of SUS316L under Creep Loading at Elevated Temperatures (2019)
  • Author(s): Yukako Takahasi, Ken Suzuki and Hideo Miura
  • Organizer: 10th Japan-China Bilateral Symposium on High Temperature Strength of Materials
  • Int'l Joint Research
• [Presentation] Clarification of the Degradation Mechanism of Grain Boundaries in Nickel-Based Alloy 625 Under Temperature (2019)
  • Author(s): Yifan Luo, Ken Suzuki and Hideo Miura
  • Organizer: 10th Japan-China Bilateral Symposium on High Temperature Strength of Materials
  • Int'l Joint Research
• [Presentation] Molecular Analysis of Accumulation of Vacancies and Dislocations around a Grain Boundary under Creep Loading at Elevated Temperature (2019)
  • Author(s): Yiqing Fan, Ryo Kikuchi, Ken Suzuki, and Hideo Miura
  • Organizer: 10th Japan-China Bilateral Symposium on High Temperature Strength of Materials
  • Int'l Joint Research
• [Presentation] Molecular Dynamics Analysis of Grain Boundary Cracking Caused by Accumulation of Vacancies and Dislocations (2019)
  • Author(s): Ryo KIKUCHI, Yiqing FAN, Ken SUZUKI and Hideo MIURA
  • Organizer: 10th Japan-China Bilateral Symposium on High Temperature Strength of Materials
  • Int'l Joint Research
• [Presentation] Crystallinity Dependence of Grain and Grain Boundary Strength in Polycrystalline Copper Interconnections (2019)
  • Author(s): Ken Suzuki
  • Organizer: ISMP-EMAP2019
  • Int'l Joint Research / Invited
• [Presentation] A First Principle Study on the Localized Electronic Band Structure of a Single Long Graphene Nanoribbon with Graphene Electrodes (2019)
  • Author(s): Qinqiang Zhang, Ken Suzuki, Hideo Miura
  • Organizer: ISMP-EMAP2019
  • Int'l Joint Research
• [Presentation] Photoresponsivity of a Graphene Nanoribbon based Field Effect Transistor for the Development of a Multi-Junction Solar Cell using a Single Material (2019)
  • Author(s): Jowesh Goundar, Ken Suzuki, Hideo Miura
  • Organizer: ISMP-EMAP2019
  • Int'l Joint Research
• [Presentation] Micro texture Dependence of Mechanical Damage Mechanism of Electroplated Gold Thin Film Used for Semiconductor Device Interconnections (2019)
  • Author(s): Genta Nakauchi, Ken Suzuki, Hideo Miura
  • Organizer: ISMP-EMAP2019
  • Int'l Joint Research
• [Presentation] めっき銅薄膜配線の機械特性とEM耐性の結晶粒界品質依存性 (2019)
  • Author(s): 三浦 英生
  • Organizer: 日本電子情報通信学会シリコン材料・デバイス材料研究会
  • Invited
• [Presentation] Variation of the Lifetime of Interconnections Due to the Crystallinity of Grain Boundaries in Thin-Film Interconnections (2018)
  • Author(s): Hideo Miura
  • Organizer: IEEE 20th International Conference on Electronic Materials And Packaging
  • Int'l Joint Research / Invited
• [Presentation] 原子配列の秩序性に基づく多結晶金属材料強度評価技術の開発とめっき銅薄 膜への応用 (2018)
  • Author(s): 鈴木 研
  • Organizer: 日本電子情報通信学会シリコン材料・デバイス材料研究会
  • Invited
• [Presentation] Quantitative Characterization of the Crystallinity of Polycrystalline Materials by Applying Electron Back-Scatter Diffraction (2018)
  • Author(s): Hideo Miura
  • Organizer: 22nd International Conference on Advanced Materials and Nanotechnology
  • Int'l Joint Research / Invited
• [Presentation] Crystallinity-induced Variation of the Strength of a Grain and a Grain Boundary (2018)
  • Author(s): Hideo Miura
  • Organizer: EUROPEAN ADVANCED MATERIALS CONGRESS
  • Int'l Joint Research / Invited
• [Presentation] Degradation of the strength of a grain boundary in Ni-base superalloy under creep-fatigue loading (2018)
  • Author(s): Hideo Miura
  • Organizer: 1st International Conference on Theoretical, Applied, Experimental
  • Int'l Joint Research / Invited
• [Presentation] Bending Deformation-Induced Drastic Change of the Resistance of Graphene Nano-Ribbons (2018)
  • Author(s): Takuya Kudo, Ken Suzuki, Hideo Miura
  • Organizer: IEEE 20th International Conference on Electronic Materials And Packaging
  • Int'l Joint Research
• [Presentation] Strain-induced Change of Electronic Band Structure of Dumbbell-Shape Graphene Nanoribbon (2018)
  • Author(s): Qinqiang Zhang, Ken Suzuki, Hideo Miura
  • Organizer: IEEE 20th International Conference on Electronic Materials And Packaging
  • Int'l Joint Research
• [Presentation] Development of a Flexible Tactile Sensor Using Area-Arrayed Bundle Structures of Multi-Walled Carbon Nanotubes (2018)
  • Author(s): Ryusaku Osada, Ken Suzuki
  • Organizer: ASME International Mechanical Engineering Congress & Exposition,
  • Int'l Joint Research
• [Presentation] Theoretical Study of Electronic Band Structure of Dumbbell-Shape Graphene Nanoribbons for Highly-Sensitive Strain Sensors (2018)
  • Author(s): Ken Suzuki
  • Organizer: ASME International Mechanical Engineering Congress & Exposition
  • Int'l Joint Research
• [Presentation] rea-Arrayed Graphene Nano-Ribbon-Base Strain Sensor (2018)
  • Author(s): Ryohei Nakagawa, Ken Suzuki
  • Organizer: ASME International Mechanical Engineering Congress & Exposition
  • Int'l Joint Research
• [Presentation] Photosensitivity of Monolayer Graphene-Base Field Effect Transistor (2018)
  • Author(s): Jowesh A. Goundar, Ken Suzuki, Hideo Miura
  • Organizer: ASME International Mechanical Engineering Congress & Exposition
  • Int'l Joint Research
• [Presentation] Disappearance of Strengthened Micro Texture of Modified 9Cr-1Mo Steel Caused by Stress-Induced Acceleration of Atomic Diffusion at Elevated Temperatures (2018)
  • Author(s): Hideo Miura
  • Organizer: ASME International Mechanical Engineering Congress & Exposition
  • Int'l Joint Research
• [Presentation] Crystallinity-Induced Variation of the Electronic Characteristics of Electroplated Gold Thin Films (2018)
  • Author(s): Yutaro Nakoshi, Hideo Miura
  • Organizer: ASME International Mechanical Engineering Congress & Exposition
  • Int'l Joint Research
• [Presentation] Degradation of the Strength of a Grain and a Grain Boundary Due to the Accumulation of the Structural Defects of Crystal (2018)
  • Author(s): Guoxiong Zheng, Hideo Miura
  • Organizer: ASME International Mechanical Engineering Congress & Exposition
  • Int'l Joint Research
• [Presentation] Development of 2D-Graphene-Based Highly Sensitive Flexible Strain Sensor Using Fine Columnar Concentration Structures (2018)
  • Author(s): Zhi Wang, Ken Suzuki, Hideo Miura
  • Organizer: International Microsystems, Packaging, Assembly and Circuits Technology conference
  • Int'l Joint Research
• [Presentation] Variation of the Strength and Fracture Mode of a Grain and a Grain Boundary in Polycrystalline Copper Thin Films (2018)
  • Author(s): Guoxiong Zheng, Ken Suzuki, Hideo Miura
  • Organizer: International Microsystems, Packaging, Assembly and Circuits Technology conference
  • Int'l Joint Research
• [Presentation] A Theoretical Study of the Effect of Strain on the Electronic Structure of Dumbbell-shape Graphene Nanoribbons (2018)
  • Author(s): Ken Suzuki
  • Organizer: International Microsystems, Packaging, Assembly and Circuits Technology conference
  • Int'l Joint Research
• [Presentation] Development of an Embedded Micro Scale Stress Sensor for Electronic Devices (2018)
  • Author(s): Ryota Mizuno, Ken Suzuki, Hideo Miura
  • Organizer: 5th Asia-Pacific Conference on Fracture and Strength
  • Int'l Joint Research
• [Presentation] Evaluation of the Degradation of the Strength of Grain Boundaries in Ni-Base Superalloy under Creep-Fatigue Loadings at Elevated Temperatures (2018)
  • Author(s): Wataru Suzuki, Ken Suzuki, Hideo Miura
  • Organizer: 15th Asia-Pacific Conference on Fracture and Strength
  • Int'l Joint Research
• [Presentation] Initial Damage Mechanism of Nickel-Based Alloy 625 Under Creep Loadings at Elevated Temperatures (2018)
  • Author(s): Yan LIANG, Ken Suzuki, Hideo Miura
  • Organizer: 15th Asia-Pacific Conference on Fracture and Strength
  • Int'l Joint Research
• [Presentation] Development of an Evaluation Method of the Strength of a Grain in Polycrystalline Copper Thin Films Based on the Order of Atom Arrangement (2018)
  • Author(s): Yifan Luo, Ken Suzuki, Hideo Miura
  • Organizer: 15th Asia-Pacific Conference on Fracture and Strength
  • Int'l Joint Research
• [Presentation] Effect of Defects on the Grain and Grain Boundary Strength in Polycrystalline Copper Thin Films (2018)
  • Author(s): Ken Suzuki
  • Organizer: 2018 International Conference on Simulation of Semiconductor Processes and Devices
  • Int'l Joint Research
• [Presentation] Crystallinity Dependence of the Strength of electroplated gold thin films Used for Three-Dimensional Electronic Packaging (2018)
  • Author(s): Ken Suzuki
  • Organizer: International Conference on Solid State Devices and Materials
  • Int'l Joint Research
• [Presentation] Evaluation of the Grain and Grain Boundary Strength in Copper Interconnections Based on the Order of Atom Arrangement (2018)
  • Author(s): Y. Luo, Ken Suzuki, Hideo Miura
  • Organizer: International Conference on Solid State Devices and Materials
  • Int'l Joint Research
• [Presentation] Variation of the Strength of a Grain and a Grain Boundary Caused by Atomic-Scale Crystallinity (2018)
  • Author(s): Hideo Miura
  • Organizer: 1st CityU-TU Joint Workshop on Advanced Materials and Manufacture
  • Int'l Joint Research / Invited
• [Presentation] Atomic-scale structural control of Graphene nano-ribbon for smart sensor applications (2017)
  • Author(s): Hideo Miura
  • Organizer: 2nd Inteanational Nanotechnology Conference & Expo
  • Int'l Joint Research / Invited
• [Presentation] Local Crystallinity-Induced Deterioration of the Lifetime of Thin-Film Interconnections (2017)
  • Author(s): Hideo Miura
  • Organizer: IEEE International Interconnect Technology Conference
  • Int'l Joint Research / Invited
• [Presentation] ATOMIC SCALE DEGRADATION OF THE INITIAL STRENGTHENED MICRO TEXTURE OF HEAT-RESISTANT ALLOYS UNDER CREEP AND FATIGUE LOADINGS (2017)
  • Author(s): Miura H
  • Organizer: 14th International Conference on Fracture
  • Int'l Joint Research / Invited
• [Presentation] Evaluation of atomic scale damages of advanced materials based on the order of atom arrangement (2017)
  • Author(s): Hideo Miura
  • Organizer: 11th International Conference on Advanced Materials and Processing, Research & Reviews
  • Int'l Joint Research / Invited
• [Presentation] Lifetime Estimation of Thin-Film Interconnections Based on Their Crystallinity (2017)
  • Author(s): Hideo Miura
  • Organizer: 19th International Conference on Electronics Materials and Packaging
  • Int'l Joint Research / Invited
• [Presentation] Effect of the crystallinity on the grain boundary diffusion of copper atoms in electroplated copper thin-film interconnections (2017)
  • Author(s): K.Suzuki
  • Organizer: SOLID STATE DEVICES AND MATERIALS
  • Int'l Joint Research
• [Presentation] STRESS-INDUCED ACCELERATION OF THE CHANGE OF MICROSTRUCTURE OF NI-BASE SUPERALLOY CM247LC (2017)
  • Author(s): Ken Suzuki
  • Organizer: ASME2017 International Mechanical Engineering Congress and Exposition
  • Int'l Joint Research
• [Presentation] EVALUATION OF DAMAGE EVOLUTION IN NICKEL-BASE HEAT-RESISTANT ALLOY UNDER CREEP-FATIGUE LOADING CONDITIONS (2017)
  • Author(s): Ken Suzuki
  • Organizer: International Mechanical Engineering Congress and Exposition
  • Int'l Joint Research
• [Presentation] Crystallinity-Induced Variation of the Yield Strength of Electroplated Copper Thin Films (2017)
  • Author(s): Yifan Luo
  • Organizer: ASME2017 International Mechanical Engineering Congress and Exposition
  • Int'l Joint Research
• [Presentation] CREEP-DAMAGE-INDUCED DETERIORATION OF THE STRENGTH OF NI-BASE SUPERALLOY DUE TO THE CHANGE OF ITS MICROSTRUCTURE (2017)
  • Author(s): Hayato Sakamoto
  • Organizer: ASME2017 International Mechanical Engineering Congress and Exposition
  • Int'l Joint Research
• [Presentation] HIGHLY SENSITIVE STRAIN SENSOR USING DUMBBELL-SHAPE GRAPHENE NANORIBBON (2017)
  • Author(s): Qinqiang Zhang
  • Organizer: ASME2017 International Mechanical Engineering Congress and Exposition
  • Int'l Joint Research
• [Presentation] MECHANICAL STRESS MONITORING SENSOR FOR 3-D MODULE DURING MANUFACTURING AND OPERATION (2017)
  • Author(s): Koki Isobe
  • Organizer: ASME2017 International Mechanical Engineering Congress and Exposition
  • Int'l Joint Research
• [Presentation] LARGELY DEFORMABLE AND HIGHLY SENSITIVE STRAIN SENSOR USING CARBON NANOMATERIALS (2017)
  • Author(s): Kanji Yumoto
  • Organizer: ASME2017 International Mechanical Engineering Congress and Exposition
  • Int'l Joint Research
• [Presentation] STRESS-INDUCED CHANGE OF THE MICROSTRUCTURE AND STRENGTH OF MODIFIED 9CR-1MO STEEL UNDER FATIGUE AND CREEP LOADINGS AT ELEVATED TEMPERATURES (2017)
  • Author(s): Taichi Shinozaki
  • Organizer: International Mechanical Engineering Congress and Exposition
  • Int'l Joint Research
• [Presentation] Proposal of Highly sensitive pressure sensor using Graphene Nano-Ribbon (2017)
  • Author(s): Zhi Wang
  • Organizer: 19th International Conference on Electronics Materials and Packaging
  • Int'l Joint Research
• [Presentation] Development of a Flexible and Highly Sensitive Tactile Sensor Using Multi-Walled Carbon Nanotubes (2017)
  • Author(s): Ryusaku Osada
  • Organizer: 19th International Conference on Electronics Materials and Packaging
  • Int'l Joint Research
• [Presentation] Electronic band structure analyses of dumbbell-shape graphene nanoribbon for highly sensitive and stable strain sensors (2017)
  • Author(s): Qinqiang Zhang
  • Organizer: 19th International Conference on Electronics Materials and Packaging
  • Int'l Joint Research
• [Presentation] Evaluation of the strength of bicrystal copper structure obtained from electroplated copper thin films (2017)
  • Author(s): Yifan Luo
  • Organizer: 19th International Conference on Electronics Materials and Packaging
  • Int'l Joint Research
• [Presentation] Development of High-Quality Graphene Nano-Ribbon Fabrication Process for High Sensitivity Strain Sensor (2017)
  • Author(s): Ryohei Nakagawa
  • Organizer: 12th International Microsystems, Packaging, Assembly and Circuits Technology conference
  • Int'l Joint Research
• [Presentation] Relationship between mechanical properties and micro texture of electroplated gold thin films (2017)
  • Author(s): Yutaro Nakoshi
  • Organizer: 12th International Microsystems, Packaging, Assembly and Circuits Technology conference
  • Int'l Joint Research
• [Presentation] Crystallinity control of the electroplated copper thin film interconnections for advanced electronic devices (2017)
  • Author(s): Ryota Mizuno
  • Organizer: 2th International Microsystems, Packaging, Assembly and Circuits Technology conference
  • Int'l Joint Research
• [Presentation] Evaluation of the relationship between the tensile strength of a grain boundary in electroplated copper thin films and the crystallinity of the grain boundary using micro tensile test (2017)
  • Author(s): Guoxiong Zheng
  • Organizer: 12th International Microsystems, Packaging, Assembly and Circuits Technology conference
  • Int'l Joint Research
• [Presentation] Observation of the Initial Damage in Ni-base Superalloy under Mechanical Loads at High Temperature (2016)
  • Author(s): Takuya Murakoshi
  • Organizer: Asia-Pacific Conference on Fracture and Strength 2016
  • Place of Presentation: Toyama,国際コンベンションセンター
  • Year and Date: 2016-09-19
  • Int'l Joint Research
• [Presentation] Strain-induced Initial Damage of Mod. 9Cr-1Mo Steel at Elevated Temperatures (2016)
  • Author(s): Motoki Takahashi
  • Organizer: Asia-Pacific Conference on Fracture and Strength 2016
  • Place of Presentation: Toyama, 国際コンベンションセンター
  • Year and Date: 2016-09-19
  • Int'l Joint Research
• [Presentation] Minimization of the Residual Stress Around TSV Structures by Controlling Micro Texture of Electroplated Copper Thin Film (2016)
  • Author(s): Jiatong LIU
  • Organizer: Asia-Pacific Conference on Fracture and Strength 2016
  • Place of Presentation: Toyama, 国際コンベンションセンター
  • Year and Date: 2016-09-19
  • Int'l Joint Research
• [Presentation] Micro-Texture-Controled Highly Reliable Copper Thin-Film Interconnections (2016)
  • Author(s): Takeru Kato
  • Organizer: Asia-Pacific Conference on Fracture and Strength 2016
  • Place of Presentation: Toyama, 国際コンベンションセンター
  • Year and Date: 2016-09-19
  • Int'l Joint Research
• [Presentation] Degradation of crystallinity and properties of advanced functional materials caused by anisotropic local diffusion of component atoms under severe operating conditions (2016)
  • Author(s): Hideo Miura
  • Organizer: 6th International Conference and Exhibition on Materials Science and Engineering
  • Place of Presentation: Atlanta, USA
  • Year and Date: 2016-09-12
  • Int'l Joint Research / Invited
• [Presentation] Initial Degradation Process of Heat-resistant Materials Based on the Change of Crystallinity of Grains and Grain Boundaries (2016)
  • Author(s): Hideo Miura
  • Organizer: 21st European Conference on Fracture
  • Place of Presentation: Catania, Italy
  • Year and Date: 2016-06-20
  • Int'l Joint Research / Invited
• [Remarks] 東北大学 三浦・鈴木研究室
  • URL: http://www.miura.rift.mech.tohoku.ac.jp
• [Remarks] 三浦・鈴木研究室 東北大学工学研究科附属先端材料強度科学研究センター
  • URL: http://www.miura.rift.mech.tohoku.ac.jp
• [Remarks] 東北大学先端材料強度科学研究センター（三浦・鈴木研究室）
  • URL: http://www.miura.rift.mech.tohoku.ac.jp
• [Funded Workshop] 1st CityU-TU Joint Workshop on Advanced Materials and Manufacture (2018)