Design of mesostructured silica materials with a self-healing function
| Project/Area Number |
16K14097
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| Research Category |
Grant-in-Aid for Challenging Exploratory Research
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| Allocation Type | Multi-year Fund |
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| Research Field |
Inorganic industrial materials
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| Research Institution | Waseda University |
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Principal Investigator |
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| Project Period (FY) |
2016-04-01 – 2018-03-31
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| Project Status |
Completed (Fiscal Year 2017)
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| Budget Amount *help |
¥3,770,000 (Direct Cost: ¥2,900,000、Indirect Cost: ¥870,000)
Fiscal Year 2017: ¥2,080,000 (Direct Cost: ¥1,600,000、Indirect Cost: ¥480,000)
Fiscal Year 2016: ¥1,690,000 (Direct Cost: ¥1,300,000、Indirect Cost: ¥390,000)
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| Keywords | 自己修復材料 / シリカ / メソ構造体 / 自己修復 / 有機シロキサン / 自己組織化 / ナノ複合体 |
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| Outline of Final Research Achievements |
Self-healing materials are useful in various applications. In this study, self-healing behaviors of lamellar silica- and organosiloxane-based thin films was investigated. The films were prepared by the self-assembly process using a cationic surfactant. In the case of the lamellar silica-based film prepared using tetraethoxysilane as a silica source, artificial cracks with submicrometer widths were spontaneously healed under humid conditions even at room temperature. Rapid swelling of the lamellar structures under humid condition was found to play a crucial role in the crack closure. A lamellar organosiloxane-based film was prepared using bis(triethoxysilyl)ethane. The film showed an enhanced self-healing ability as compared to the silica-based lamellar film. These findings will lead to the creation of a variety of self-healing siloxane-based materials.
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Report
(3 results)
Research Products
(8 results)
