| Budget Amount *help |
¥3,770,000 (Direct Cost: ¥2,900,000、Indirect Cost: ¥870,000)
Fiscal Year 2017: ¥2,080,000 (Direct Cost: ¥1,600,000、Indirect Cost: ¥480,000)
Fiscal Year 2016: ¥1,690,000 (Direct Cost: ¥1,300,000、Indirect Cost: ¥390,000)
|
|---|
| Outline of Final Research Achievements |
Self-healing materials are useful in various applications. In this study, self-healing behaviors of lamellar silica- and organosiloxane-based thin films was investigated. The films were prepared by the self-assembly process using a cationic surfactant. In the case of the lamellar silica-based film prepared using tetraethoxysilane as a silica source, artificial cracks with submicrometer widths were spontaneously healed under humid conditions even at room temperature. Rapid swelling of the lamellar structures under humid condition was found to play a crucial role in the crack closure. A lamellar organosiloxane-based film was prepared using bis(triethoxysilyl)ethane. The film showed an enhanced self-healing ability as compared to the silica-based lamellar film. These findings will lead to the creation of a variety of self-healing siloxane-based materials.
|
