| Project/Area Number |
16K14135
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| Research Category |
Grant-in-Aid for Challenging Exploratory Research
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| Allocation Type | Multi-year Fund |
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| Research Field |
Production engineering/Processing studies
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| Research Institution | Kobe University |
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Principal Investigator |
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| Project Period (FY) |
2016-04-01 – 2018-03-31
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| Project Status |
Completed (Fiscal Year 2017)
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| Budget Amount *help |
¥3,640,000 (Direct Cost: ¥2,800,000、Indirect Cost: ¥840,000)
Fiscal Year 2017: ¥1,560,000 (Direct Cost: ¥1,200,000、Indirect Cost: ¥360,000)
Fiscal Year 2016: ¥2,080,000 (Direct Cost: ¥1,600,000、Indirect Cost: ¥480,000)
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| Keywords | 高温パンチクリープ成形 / MEMS / 逆解析 / 触覚センサ / 高温クリープ立体形成 / 高温クリープ立体成形 / ＭＥＭＳ |
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| Outline of Final Research Achievements |
This research has developed a high temperature punch creep forming technique combined with a diffusion process of dopant for a downsizing of 3-axis piezoresistive tactile sensor made of Si film. The punch creep forming for micron-thick Si films was able to realize large out-of-plane deformation in a small area. This research has also estimated the creep coefficient and the creep exponent used in the creep constitutive equation for the Si films by backward analysis. The obtained parameters were quite different from those of bulk Si. As a result, the 3D formed piezoresistive tiny tactile sensor with a diameter of 0.32mm as its sensing area was designed by finite element analyses (FEA) using the creep parameters. Finally, we have succeeded in fabricating the tactile sensor by the punch creep forming. Here, the effect of the creep forming on the resistivity was little. Sensitivities in the horizontal and vertical directions of the tactile sensor roughly agreed with predicted values in FEA.
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