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Challenge to air-cooling fin for electronic device with exceeding 1MW/m2 of heat flux

Research Project

Project/Area Number 16K14167
Research Category

Grant-in-Aid for Challenging Exploratory Research

Allocation TypeMulti-year Fund
Research Field Thermal engineering
Research InstitutionTohoku University

Principal Investigator

Maruyama Shigenao  東北大学, 流体科学研究所, 名誉教授 (80173962)

Co-Investigator(Kenkyū-buntansha) 小宮 敦樹  東北大学, 流体科学研究所, 准教授 (60371142)
伊賀 由佳  東北大学, 流体科学研究所, 教授 (50375119)
岡島 淳之介  東北大学, 流体科学研究所, 助教 (70610161)
Project Period (FY) 2016-04-01 – 2018-03-31
Project Status Completed (Fiscal Year 2017)
Budget Amount *help
¥3,510,000 (Direct Cost: ¥2,700,000、Indirect Cost: ¥810,000)
Fiscal Year 2017: ¥1,560,000 (Direct Cost: ¥1,200,000、Indirect Cost: ¥360,000)
Fiscal Year 2016: ¥1,950,000 (Direct Cost: ¥1,500,000、Indirect Cost: ¥450,000)
Keywords電子機器冷却 / マイクロチャネル / 超音速流 / 高熱流束冷却 / 空気 / 干渉計
Outline of Final Research Achievements

To realize a high heat flux air cooling system for the electronics cooling, low temperature supersonic flow, which was generated by an adiabatic expansion, and micro-channel were applied to micro-heat exchanger. The boundary layer thickness, which is related with an amount of heat transfer, is decreasing with the downscale. At first, the flow field and heat transfer in the micronozzle which has the suitable shape for manufacturing were evaluated by numerical simulation. Furthermore, the heat sink with micronozzle was manufactured and its cooling performance was evaluated by experiment. The effectiveness of micronozzle was clarified by the comparing experiment with heat sink without micronozzle. The heat sink with micronozzle showed the cooling performance of 0.761MW/m2 in the condition of 0.3MPaG of inlet pressure and 80 degree C of heat transfer surface.

Report

(3 results)
  • 2017 Annual Research Report   Final Research Report ( PDF )
  • 2016 Research-status Report
  • Research Products

    (2 results)

All 2016

All Journal Article (2 results) (of which Int'l Joint Research: 2 results,  Peer Reviewed: 2 results,  Acknowledgement Compliant: 2 results)

  • [Journal Article] Design and Feasibility Analysis of Microscale Bumped Channel with Supersonic Flow for Electronics Cooling2016

    • Author(s)
      Y. Takahashi, L. Chen, J. Okajima, Y. Iga, A. Komiya, W.S. Fu, S. Maruyama
    • Journal Title

      Journal of Microelectromechanical Systems

      Volume: 99 Issue: 6 Pages: 1-8

    • DOI

      10.1109/jmems.2016.2613942

    • Related Report
      2016 Research-status Report
    • Peer Reviewed / Int'l Joint Research / Acknowledgement Compliant
  • [Journal Article] Interferometric Measurement and Numerical Comparisons of Supersonic Heat Transfer Flows in Micro-Channel2016

    • Author(s)
      Y. Takahashi, L. Chen, J. Okajima, Y. Iga, A. Komiya, S. Maruyama
    • Journal Title

      Applied Thermal Engineering

      Volume: 109 Pages: 582-590

    • DOI

      10.1016/j.applthermaleng.2016.08.108

    • Related Report
      2016 Research-status Report
    • Peer Reviewed / Int'l Joint Research / Acknowledgement Compliant

URL: 

Published: 2016-04-21   Modified: 2019-03-29  

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