Research Project
Grant-in-Aid for Challenging Exploratory Research
We have studied active devices such as transistors and diodes in electronic devices for the purpose of heat. We designed, fabricated and evaluated thermal diodes which are the most fundamental active elements. In this research, a cup stack type three dimensional structure was designed. The reason for adopting this structure is that it can be expected that a change in heat conduction due to a change in structure at low temperature and high temperature can be expected and an anisotropic heat flow is predicted to be observed. Based on the obtained design, a three-dimensional structure was synthesized with a nano-level three-dimensional printer. The thermal diffusivity of the obtained material was measured.
All 2016 Other
All Int'l Joint Research (2 results) Journal Article (3 results) (of which Int'l Joint Research: 3 results, Peer Reviewed: 3 results, Open Access: 1 results, Acknowledgement Compliant: 1 results) Presentation (1 results) (of which Int'l Joint Research: 1 results, Invited: 1 results)
Composites Science and Technology
Volume: 129 Pages: 205-213
10.1016/j.compscitech.2016.04.033
Materials Chemistry and Physics
Volume: 171 Pages: 39-44
10.1016/j.matchemphys.2016.01.027
Journal of the Ceramic Society of Japan
Volume: 124 Issue: 3 Pages: 197-202
10.2109/jcersj2.15215
130005132943