Structural material joining utilizing stress migration
| Project/Area Number |
16K14406
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| Research Category |
Grant-in-Aid for Challenging Exploratory Research
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| Allocation Type | Multi-year Fund |
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| Research Field |
Composite materials/Surface and interface engineering
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| Research Institution | Osaka University |
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Principal Investigator |
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| Project Period (FY) |
2016-04-01 – 2018-03-31
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| Project Status |
Completed (Fiscal Year 2017)
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| Budget Amount *help |
¥3,640,000 (Direct Cost: ¥2,800,000、Indirect Cost: ¥840,000)
Fiscal Year 2017: ¥1,690,000 (Direct Cost: ¥1,300,000、Indirect Cost: ¥390,000)
Fiscal Year 2016: ¥1,950,000 (Direct Cost: ¥1,500,000、Indirect Cost: ¥450,000)
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| Keywords | Ag膜 / 接合 / ストレスマイグレーション / 拡散 / ヒロック / 強度 / 固相接合 / 銀 / 材料加工・処理 / 構造・機能材料 |
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| Outline of Final Research Achievements |
A silver (Ag) sputtered film was formed to a thickness of 1 μm on silica (SiO 2) which is a low expansion material and heated at 250℃. to 400℃. for 60 minutes to evaluate the state of formation of Ag hillocks and the bonding between SiO 2 Joining was carried out. In order to clarify the possibility of application to a large area, it was conducted at the following: the SiO 2 block was a 20 mm square bonding surface, the Ti bonding layer was formed under the Ag film, the bonding pressure was 0.4 MPa, the bonding atmosphere was atmospheric pressure. Three-point bending test piece of 3 mm square with 3 mm square was cut out from the bonded body and the dependence of the cutting position of the bonding strength was evaluated in connection with the hillock formation state.
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Report
(3 results)
Research Products
(3 results)
