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Hard and brittle materials 3D ultra-precision machining using laser slicing technology

Research Project

Project/Area Number 16K17991
Research Category

Grant-in-Aid for Young Scientists (B)

Allocation TypeMulti-year Fund
Research Field Production engineering/Processing studies
Research InstitutionSaitama University

Principal Investigator

YAMADA Yohei  埼玉大学, 理工学研究科, 助教 (60756899)

Project Period (FY) 2016-04-01 – 2018-03-31
Project Status Completed (Fiscal Year 2017)
Budget Amount *help
¥2,600,000 (Direct Cost: ¥2,000,000、Indirect Cost: ¥600,000)
Fiscal Year 2017: ¥1,300,000 (Direct Cost: ¥1,000,000、Indirect Cost: ¥300,000)
Fiscal Year 2016: ¥1,300,000 (Direct Cost: ¥1,000,000、Indirect Cost: ¥300,000)
Keywordsレーザスライシング / 半導体 / Si / SiC / 切断加工 / 半導体基板 / 半導体製造 / レーザースライシング / 硬脆材料 / 超精密加工 / レーザ加工
Outline of Final Research Achievements

We proposed laser slicing technology for semiconductor materials cutting. In this technology, micro crack is created inside of the material by focusing pulse laser beam on the inside. Then, each micro crack link by scanning pulse laser. As the result, high-precision and low waste cutting process was realized. In this research, we investigated the shape of micro cracks control by controlling laser energy, clearance of the micro cracks and aberration correction. We found that influence of crystal orientation can be ignored by refinement micro cracks. Therefore, we realized high-precision and high quality cutting for semiconductor materials.

Report

(3 results)
  • 2017 Annual Research Report   Final Research Report ( PDF )
  • 2016 Research-status Report
  • Research Products

    (7 results)

All 2017 2016

All Journal Article (1 results) (of which Peer Reviewed: 1 results,  Open Access: 1 results,  Acknowledgement Compliant: 1 results) Presentation (6 results) (of which Int'l Joint Research: 2 results)

  • [Journal Article] Laser Cutting Out Process for Semiconductor Crystal Material Applying Laser Slicing Method2017

    • Author(s)
      山田洋平,金子洋平,青木陸,池野順一,鈴木秀樹
    • Journal Title

      Journal of the Japan Society for Precision Engineering

      Volume: 83 Issue: 4 Pages: 375-380

    • DOI

      10.2493/jjspe.83.375

    • NAID

      130005548958

    • ISSN
      0912-0289, 1882-675X
    • Related Report
      2017 Annual Research Report 2016 Research-status Report
    • Peer Reviewed / Open Access / Acknowledgement Compliant
  • [Presentation] Laser Cutting Out Process for Semiconductor Substrates Applying Laser Slicing Method2017

    • Author(s)
      Yohei Yamada, and Junichi Ikeno
    • Organizer
      32nd ASPE Annual Meeting
    • Related Report
      2017 Annual Research Report
    • Int'l Joint Research
  • [Presentation] SiCのレーザスライシング加工に関する研究2017

    • Author(s)
      山田洋平,阿部達毅,浅原浩和,富士和則,明田正俊,池野順一
    • Organizer
      2017年度砥粒加工学会学術講演会
    • Related Report
      2017 Annual Research Report
  • [Presentation] SiCのレーザスライシング加工における剥離面形成メカニズム2017

    • Author(s)
      山田洋平,阿部達毅,浅原浩和,富士和則,明田正俊,池野順一
    • Organizer
      2017年度精密工学会秋季大会
    • Related Report
      2017 Annual Research Report
  • [Presentation] Laser Cutting Out Process for Semiconductor Substrates Applying Laser Slicing Method2016

    • Author(s)
      Yohei Yamada, Yohei Kaneko, Riku Aoki and Junichi Ikeno
    • Organizer
      16th International Conference on Precision Engineering
    • Place of Presentation
      浜松アクトシティ(静岡県 浜松市)
    • Year and Date
      2016-11-14
    • Related Report
      2016 Research-status Report
    • Int'l Joint Research
  • [Presentation] レーザスライシング技術による単結晶Siの高品位高速スライス加工2016

    • Author(s)
      山田洋平,金子洋平,阿部達毅,池野順一
    • Organizer
      2016年度精密工学会秋季大会学術講演会
    • Place of Presentation
      茨城大学(茨城県 水戸市)
    • Year and Date
      2016-09-06
    • Related Report
      2016 Research-status Report
  • [Presentation] レーザスライシング技術を応用したレーザ切り抜き加工2016

    • Author(s)
      山田洋平,金子洋平,青木陸,池野順一
    • Organizer
      2016年度砥粒加工学会学術講演会
    • Place of Presentation
      兵庫県立大学 姫路環境人間キャンパス(兵庫県姫路市)
    • Year and Date
      2016-08-31
    • Related Report
      2016 Research-status Report

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Published: 2016-04-21   Modified: 2019-03-29  

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