Hard and brittle materials 3D ultra-precision machining using laser slicing technology
| Project/Area Number |
16K17991
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| Research Category |
Grant-in-Aid for Young Scientists (B)
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| Allocation Type | Multi-year Fund |
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| Research Field |
Production engineering/Processing studies
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| Research Institution | Saitama University |
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Principal Investigator |
YAMADA Yohei 埼玉大学, 理工学研究科, 助教 (60756899)
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| Project Period (FY) |
2016-04-01 – 2018-03-31
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| Project Status |
Completed (Fiscal Year 2017)
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| Budget Amount *help |
¥2,600,000 (Direct Cost: ¥2,000,000、Indirect Cost: ¥600,000)
Fiscal Year 2017: ¥1,300,000 (Direct Cost: ¥1,000,000、Indirect Cost: ¥300,000)
Fiscal Year 2016: ¥1,300,000 (Direct Cost: ¥1,000,000、Indirect Cost: ¥300,000)
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| Keywords | レーザスライシング / 半導体 / Si / SiC / 切断加工 / 半導体基板 / 半導体製造 / レーザースライシング / 硬脆材料 / 超精密加工 / レーザ加工 |
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| Outline of Final Research Achievements |
We proposed laser slicing technology for semiconductor materials cutting. In this technology, micro crack is created inside of the material by focusing pulse laser beam on the inside. Then, each micro crack link by scanning pulse laser. As the result, high-precision and low waste cutting process was realized. In this research, we investigated the shape of micro cracks control by controlling laser energy, clearance of the micro cracks and aberration correction. We found that influence of crystal orientation can be ignored by refinement micro cracks. Therefore, we realized high-precision and high quality cutting for semiconductor materials.
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Report
(3 results)
Research Products
(7 results)
