Synthesis of mono-dispersed metallic nanoparticles and its application to electronics wiring

• Project/Area Number: 17206077
• Research Category: Grant-in-Aid for Scientific Research (A)
• Allocation Type: Single-year Grants
• Section: 一般
• Research Field: Metal making engineering
• Research Institution: Osaka University
• Principal Investigator: SUGANUMA Katsuaki Osaka University, 産業科学研究所, 教授 (10154444)
• Co-Investigator(Kenkyū-buntansha): INOUE Masahiro 大阪大学, 産業科学研究所, 助手 (60291449) ; KIM Keun-soo 大阪大学, 産業科学研究所, 助手 (90304857) ; 山口 俊郎 大阪大学, 産業科学研究所, 助教 (40167698)
• Project Period (FY): 2005 – 2008
• Project Status: Completed (Fiscal Year 2008)
• Budget Amount: ¥50,050,000 (Direct Cost: ¥38,500,000、Indirect Cost: ¥11,550,000); Fiscal Year 2008: ¥4,940,000 (Direct Cost: ¥3,800,000、Indirect Cost: ¥1,140,000); Fiscal Year 2007: ¥5,720,000 (Direct Cost: ¥4,400,000、Indirect Cost: ¥1,320,000); Fiscal Year 2006: ¥12,870,000 (Direct Cost: ¥9,900,000、Indirect Cost: ¥2,970,000); Fiscal Year 2005: ¥26,520,000 (Direct Cost: ¥20,400,000、Indirect Cost: ¥6,120,000)
• Keywords: 高密度実装 / ナノ材料 / 微細接続 / インクジェット / 配線

Research Abstract

金属ナノ粒子は、その表面の活性さから、低温において焼結が可能になり、ナノ粒子を保護膜で覆い安定インク化することで、プリンテッド・エレクトロニクスの基本的な配線材料になると期待されている。本研究では、当初銀ナノ粒子に集中して開発を行い、ナノ粒子の保護膜としてドデシルアミンを用いたインクの塗布特性を評価したところ、塗布後の配線のアルコール洗浄により、劇的に抵抗値が下がることを見いだした。結果として、ナノ粒子インクを用いた常温配線技術を世界初の成果として達成し、そのアルコール洗浄反応のおよそのメカニズムを明らかにした。また、応用技術として、マイクロカプセル製造、常温接合技術の開発や、銀配線特性評価などへ展開を行った。

Research Products

• [Journal Article] Room Temperature Sintering Process of Ag Nanoparticles Paste and its Conditions (2009)
  • Author(s): D. Wakuda, K.-S. Kim, K. Suganuma
  • Journal Title: Conditions, IEEE Trans.CPMT (in press)
  • Peer Reviewed
• [Journal Article] インクジェット技術の最新動向 (2009)
  • Author(s): 菅沼克昭
  • Journal Title: 電子材料 Vol.48, No.2 Pages: 67-73
• [Journal Article] エレクトロニクス分野の導電性接着剤技術の動向 (2009)
  • Author(s): 菅沼克昭, 進藤大輔, 大塚寛治, 苅谷義治
  • Journal Title: エレクトロニクス実装学会誌 Vol.12, No.1 Pages: 79-85
  • NAID: 110007021785
• [Journal Article] Preparation of Ag nanorods with high yield by polyol process (2009)
  • Author(s): J.T. Jiu, K. Murai, D.-S. Kim, K.-S. Kim, K. Suganuma
  • Journal Title: Materials Chemistry and Physics 114 Pages: 333-338
  • Peer Reviewed
• [Journal Article] Room Temperature Sintering Process of Ag Nanoparticle Paste (2009)
  • Author(s): D. Wakuda, K. -S. Kim, K. Suganuma
  • Journal Title: IEEE Transactions on Components and Packaging Technologies (未定)(印刷中)
  • Peer Reviewed
• [Journal Article] インクジェット技術の最新動向 (2009)
  • Author(s): 菅沼克昭
  • Journal Title: 電子材料 48[2] Pages: 67-73
• [Journal Article] Printed Electronicsの最先端技術動向 (2008)
  • Author(s): 菅沼克昭
  • Journal Title: コンバーテック No.7 Pages: 1-4
• [Journal Article] インクジェット技術による製造革新 (2008)
  • Author(s): 菅沼克昭、和久田大介、金槿銖
  • Journal Title: 月刊ディスプレイ 14[6] Pages: 41-47
• [Journal Article] 常温焼結Ag粒子ペーストの性質と常温接合 (2008)
  • Author(s): 和久田大介, 金槿銖, 菅沼克昭
  • Journal Title: エレクトロニクス実装学会 (MES2008) Pages: 147-150
  • Peer Reviewed
• [Journal Article] Room Temperature Sintering of Ag Nano-scale particles with drying of the solvent (2008)
  • Author(s): D. Wakuda, K.-S. Kim, K. Suganuma
  • Journal Title: IEEE Polytronic 2008 Conference Garmisch-Partenkirchen, Germany, August Pages: 17-20
  • Peer Reviewed
• [Journal Article] Room temperature sintering of Ag nanoparticles by drying of the solvent (2008)
  • Author(s): D. Wakuda, K.-S. Kim, K. Suganuma
  • Journal Title: Scripta Materialia 59[6] Pages: 649-652
  • Peer Reviewed
• [Journal Article] Room temperature sintering of Ag nanoparticles by drying of the solvent (2008)
  • Author(s): D. Wakuda, K. -S. Kim, K. Suganuma
  • Journal Title: Scripta Materialia 59 Pages: 649-652
  • Peer Reviewed
• [Journal Article] Room Temperature Sintering of Ag Nano-scale particles with drying of the solvent (2008)
  • Author(s): D. Wakuda, K. -S. Kim, K. Suganuma
  • Journal Title: Proc. IEEE Polytronic 2008 Conference, Garmisch-Partenkirchen, Germany Pages: 17-20
• [Journal Article] 常温焼結Ag粒子ペーストの性質と常温接合 (2008)
  • Author(s): 和久田大介, 金槿銖, 菅沼克昭
  • Journal Title: エレクトロニクス実装学会マイクロエレクトロシンポジウム2008論文集 18 Pages: 147-150
  • Peer Reviewed
• [Journal Article] インクジェット技術による製造革新 (2008)
  • Author(s): 菅沼克昭, 和久田大介, 金槿銖
  • Journal Title: 月刊ディスプレイ 14[6] Pages: 41-47
• [Journal Article] Printed Electronicsの最先端技術動向 (2008)
  • Author(s): 菅沼克昭
  • Journal Title: コンバーテツク 7 Pages: 1-4
• [Journal Article] トータルエコデザインによる貴金属ナノ粒子材料のプロセス開発とその応用粉体および粉末冶金 (2007)
  • Author(s): 林大和、石川 大、滝澤博胤、井上雅博、菅沼克昭、新原皓一
  • Journal Title: Vol.54, No.3 Pages: 186-193
  • Peer Reviewed
• [Journal Article] 常温焼結ナノ粒子ペーストの性質及び焼結メカニズム (2007)
  • Author(s): 和久田大介、菅沼克昭
  • Journal Title: MES2007(第17回マイクロエレクトロニクスシンポジウム) Pages: 35-38
  • Peer Reviewed
• [Journal Article] Novel room temperature wiring process of Ag nanoparticle paste, Proc.6th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics(Polytronics 2007) (2007)
  • Author(s): D. Wakuda, K. Suganuma
  • Journal Title: Tokyo, Japan Pages: 110-113
  • Peer Reviewed
• [Journal Article] Conductive Adhesives : Alternative to High Temperature Solders and The Future (2007)
  • Author(s): K. Suganuma
  • Journal Title: 6th International IEEE Conference on Polymer and Adhesives in microelectronics and Photonics(Tokyo) Pages: 30-35
  • Peer Reviewed
• [Journal Article] Thermal stability of poly(vinylidene fluoride) films pre-annealed at various temperatures (2007)
  • Author(s): M. Inoue, Y. Tada, K. Suganuma, H. Ishiguro
  • Journal Title: Polymer Degradation and Stability 92[10] Pages: 1833-1840
  • Peer Reviewed
• [Journal Article] Novel method for room temperature sintering of Ag nanoparticle paste in air (2007)
  • Author(s): D. Wakuda, M. Hatamura, K. Suganuma
  • Journal Title: Chemical Physics Letters 441 Pages: 305-308
  • Peer Reviewed
• [Journal Article] Novel method for room temperature sintering of Ag nanoparticle paste in air (2007)
  • Author(s): Daisuke Wakuda, Mariko Hatamura, Katsuaki Suganuma
  • Journal Title: Chemical Physics Letters 441 Pages: 305-308
  • Peer Reviewed
• [Journal Article] Ink-jet printing of Nano Materials and Processes for Electronics Applications (2007)
  • Author(s): K. Suganuma
  • Journal Title: International Conference on High Density Packaging (HDP2007) IEEE CPMT June 27-28th, Shanghai Pages: 1-4
• [Journal Article] 導電性接着剤の新たな方向〜はんだ代替、さらにPrinted Electronicsへ〜 (2007)
  • Author(s): 菅沼克昭
  • Journal Title: 日本接着剤学会誌 43 Pages: 220-224
• [Journal Article] Conductive Adhesives : Alternative to High Temperature Solders and The Future (2007)
  • Author(s): K.Suganuma
  • Journal Title: 6th International IEEE Conference on Polymer and Adhesives in microelectronics and Photonics Pages: 30-35
• [Journal Article] Novel room temperature wiring process of Ag nanoparticle paste (2007)
  • Author(s): D.Wakuda, K.Suganuma
  • Journal Title: Proc.6th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics Pages: 110-113
• [Journal Article] Tanaami, Low Temperature Printing Wiring with Ag Salt Pastes, 39th International Symposium on Microelectronics(IMAPS2006), Bringing Together the Entire Microelectronics Supply Chain! (2006)
  • Author(s): M. Kawazome, K. Suganuma, M. Hatamura, K.-S. Kim, S. Horie, A. Hirasawa, H. Tanaami
  • Journal Title: San Diego October 8-12 Pages: 1050-1055
  • Peer Reviewed
• [Journal Article] Fabrication and Applications of Nano-metal Particle Composites by Ultrasonic Eco-process (2006)
  • Author(s): Y. Hayashi, H. Takizawa, Y. Saijo, T. Sekino, K. Suganuma, K. Niihara
  • Journal Title: Key Engineering Materials 317-318 Pages: 231-234
• [Journal Article] Degradation by Sn diffusion applied to surface mounting with Ag-epoxy conductive adhesive with joining pressure (2006)
  • Author(s): M. Yamashita, K. Suganuma
  • Journal Title: Microelectronics Reliability 46[7] Pages: 1113-1118
  • Peer Reviewed
• [Journal Article] Effect of curing conditions on the electrical properties of isotropic conductive adhesives composed of an epoxy-based binder (2006)
  • Author(s): M. Inoue, K. Suganuma
  • Journal Title: Soldering & Surface Mount Technology 18[2] Pages: 40-45
  • Peer Reviewed
• [Journal Article] Improvement in high-temperature degradation by isotropic conductive adhesives including Ag-Sn alloy fillers (2006)
  • Author(s): M. Yamashita, K. Suganuma
  • Journal Title: Microelectronics Reliability 46 (5-6) Pages: 850-858
  • Peer Reviewed
• [Journal Article] Differences in heat exposure degradation of Sn alloy platings joined with Ag-epoxy conductive adhesive (2006)
  • Author(s): M. Yamashita, K. Suganuma
  • Journal Title: J. Mater. Sci. 41 (2) Pages: 583-585
  • Peer Reviewed
• [Journal Article] Differences in heat exposure degradation of Sn alloy platings joined with Ag-epoxy conductive adhesive (2006)
  • Author(s): M.Yamashita, K.Suganuma
  • Journal Title: J. Mater. Sci. 41(2) Pages: 583-585
• [Journal Article] Improvement in high-temperature degradation by isotropic conductive adhesives including Ag-Sn alloy fillers (2006)
  • Author(s): M.Yamashita, K.Suganuma
  • Journal Title: Microelectronics Reliability 46(5-6) Pages: 850-858
• [Journal Article] Effect of curing conditions on the electrical properties of isotropic conductive adhesives composed of an epoxy-based binder (2006)
  • Author(s): M.Inoue, K.Suganuma
  • Journal Title: Soldering ＆ Surface Mount Technology 18[2] Pages: 40-45
• [Journal Article] Degradation by Sn diffusion applied to surface mounting with Ag-epoxy conductive adhesive with joining pressure (2006)
  • Author(s): M.Yamashita, K.Suganuma
  • Journal Title: Microelectronics Reliability 46[7] Pages: 1113-1118
• [Journal Article] Fabrication and Applications of Nano-metal Particle Composites by Ultrasonic Eco-process (2006)
  • Author(s): Y.Hayashi, H.Takizawa, Y.Saijo, T.Sekino, K.Suganuma, K.Niihara
  • Journal Title: Key Engineering Materials 317-318 Pages: 231-234
• [Journal Article] Low Temperature Printing Wiring with Ag Salt Pastes (2006)
  • Author(s): M.Kawazome, K.Suganuma, M.Hatamura, K.-S.Kim, S.Horie, A.Hirasawa, H.Tanaami
  • Journal Title: 39th International Symposium on Microelectronics (IMAPS2006) Pages: 1050-1055
• [Journal Article] 導電性接着剤の電気的・熱的特性に及ぽす熱履歴の影響 (2006)
  • Author(s): 井上雅博, 菅沼克昭
  • Journal Title: 第16回マイクロエレクトロニクスシンポジウ Pages: 339-343
• [Journal Article] Printed Electronicsのためのナノ粒子微細配線技術 (2006)
  • Author(s): 河染 満, 金 槿銖, 畑村眞里子, 菅沼克昭
  • Journal Title: 粉砕 50 Pages: 27-31
  • NAID: 130007495280
• [Journal Article] Effect of curing conditions on the interconnect properties of isotropic conductive adhesives composed of an epoxy-based binder (2005)
  • Author(s): M. Inoue, K. Suganuma
  • Journal Title: Proc. 7th IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP'05) Pages: 128-133
  • Peer Reviewed
• [Journal Article] Effect of Curing conditions on the interconnect properties of isotropic conductive adhesives composed of an epoxy-based binder (2005)
  • Author(s): M.Inoue
  • Journal Title: Proceedings of HDP'05 Pages: 128-133
• [Journal Article] Ecodesigns and applications for noble metal nanoparticles by ultrasound process (2005)
  • Author(s): Y.Hayashi
  • Journal Title: IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING 28[4] Pages: 338-343
• [Presentation] 常温焼結Ag粒子ペーストを用いた低温接合の検討 (2009)
  • Author(s): 和久田大介, 金槿銖, 菅沼克昭
  • Organizer: エレクトロニクス実装学会
  • Place of Presentation: 横浜
  • Year and Date: 2009-03-12
• [Presentation] プリンタブルエレクトロニクスの幕開け (2009)
  • Author(s): 菅沼克昭
  • Organizer: インターネプコンショー技術セミナ
  • Place of Presentation: 東京
  • Year and Date: 2009-01-28
• [Presentation] プリンタブルエレクトロニクスのための低温配線技術 (2008)
  • Author(s): 菅沼克昭
  • Organizer: 近畿化学発展協会
  • Place of Presentation: 東京
  • Year and Date: 2008-11-21
• [Presentation] プリンタブルエレクトロニクス技術 (2008)
  • Author(s): 菅沼克昭
  • Organizer: オルガテクノ2008セミナー
  • Place of Presentation: 東京
  • Year and Date: 2008-10-29
• [Presentation] Printed Electronicsと金属ナノインク配線技術 (2008)
  • Author(s): 菅沼克昭
  • Organizer: 高分子同友会
  • Place of Presentation: 東京
  • Year and Date: 2008-09-08
• [Presentation] Synthesis of Ag nanorods and application to soft die attaching (2008)
  • Author(s): J. Jiu, K. Murai, K.S. Kim, K. Suganuma
  • Organizer: 7th IEEE Conference on Polymers & Adhesives in Microelectronics & Photonics
  • Place of Presentation: Germany
• [Presentation] Degradation Mechanism of Ag-Epoxy Conductive Adhesive Joints by Heat and Humidity Exposure (2008)
  • Author(s): S. S. Kim, K.-S. Kim, K. Suganuma, H. Tanaka
  • Organizer: 2nd Electronics System-Integration Technology Conference(ESTC 2008), University of Greenwich
  • Place of Presentation: London, UK
• [Presentation] Room Temperature Sintering Mechanism of Ag Nanoparticle Paste (2008)
  • Author(s): D. Wakuda, C.-J. Kim, K.-S. Kim, and K. Suganuma
  • Organizer: IEEE 2nd Electronics System-Integration Technology Conference
  • Place of Presentation: Greenwich, UK
• [Presentation] Room Temperature Sintering of Ag Nano-scale particles with drying of the solvent (2008)
  • Author(s): D. Wakuda, K.-S. Kim, K. Suganuma
  • Organizer: IEEE Polytronic 2008 Conference, Garmisch-Partenkirchen
  • Place of Presentation: Germany
• [Presentation] Large-sacel synthesis of micrometer-scale single-crystal gold nanosheets by polyol process (2008)
  • Author(s): J. Jiu, K. Suganuma, K.-S. Kim, T. Nemoto, T. Ogawa, S. Isoda
  • Organizer: 2008 International Materials Research Conference
  • Place of Presentation: Chongqing, China
• [Presentation] Room Temperature Sintering of Ag Nano-scale particles with drying of the solvent (2008)
  • Author(s): D. Wakuda, K. -S. Kim, K. Suganuma
  • Organizer: IEEE Polytronic 2008 Conference
  • Place of Presentation: Garmisch-Partenkirchen
• [Presentation] Room Temperature Sintering Mechanism of Ag Nanoparticle Paste (2008)
  • Author(s): Daisuke Wakuda, Chang-Jae Kim, Keun-Soo Kim, Katsuaki Suganuma
  • Organizer: IEEE 2nd Electronics System-Integration Technology Conference
  • Place of Presentation: ロンドン
• [Presentation] アルコール浸漬処理法を用いたAgナノ粒子の焼結 (2008)
  • Author(s): 和久田大介, 菅沼克昭
  • Organizer: 第22回エレクトロニクス実装学会講演大会
  • Place of Presentation: 東京大学
• [Presentation] Ink-Jet Printing Nanoparticle Pastes for Printed Electronics (2007)
  • Author(s): K. Suganuma
  • Organizer: International Conference on High Density Packaging(HDP2007)
  • Place of Presentation: IEEE CPMT
• [Presentation] Novel room temperature wiring process of Ag nanoparticle paste (2007)
  • Author(s): D. Wakuda, K. Suganuma
  • Organizer: Proc. 6th International Adhesives in Microelectronics and Photonics (Polytronics 2007)
  • Place of Presentation: Tokyo, Japan
• [Presentation] Conductive Adhesives : Alternative to High Temperature Solders and The Future (2007)
  • Author(s): K. Suganuma
  • Organizer: 6th International IEEE Conference on Polymer and Adhesives in microelectronics and Photonics
  • Place of Presentation: Tokyo
• [Presentation] 常温焼結ナノ粒子ペーストの性質および焼結メカニズム (2007)
  • Author(s): 和久田大介, 菅沼克昭
  • Organizer: エレクトロニクス実装学会MES2007
  • Place of Presentation: 甲南大学
• [Presentation] Ag粒子ペーストの常温焼結と接合に関する研究 (2007)
  • Author(s): 和久田大介, 菅沼克昭
  • Organizer: 日本金属学会秋期大会
  • Place of Presentation: 岐阜大学
• [Presentation] Room Temperature Sintering of Ag Nanoparticle Paste and Its Mechanism (2007)
  • Author(s): Daisuke Wakuda, Katsuaki Suganuma
  • Organizer: 2007 MRS Fall Meeting
  • Place of Presentation: Boston
• [Presentation] Low Temperature Printing Wiring with Ag Salt Pastes (2006)
  • Author(s): M. Kawazome, K. Suganuma, M. Hatamura, K.-S. Kim, S. Horie, A. Hirasawa, and H. Tanaami
  • Organizer: 39th International Symposium on Microelectronics (IMAPS2006), Bringing Together the Entire Microelectronics Supply Chain!
  • Place of Presentation: San Diego
• [Presentation] Low/high Temperature Lead-free Soldering, Tin Whiskers and Next Steps Towards the Future (2006)
  • Author(s): K. Suganuma
  • Organizer: 1^<st> Electronics Systemintegration Technology Conference(ESTC2006)
  • Place of Presentation: IEEE CPMT, Dresden, Germany
• [Book] プリンテッド・エレクトロニクス技術(共著) (2009)
  • Author(s): 菅沼克昭、棚網宏
  • Publisher: 工業調査会
• [Book] プリンデッド・エレクトロニクス技術 (2009)
  • Author(s): 菅沼克昭, 棚網宏
  • Total Pages: 215
  • Publisher: 工業調査会
• [Book] 電子回路形成への応用(分担執筆)、Electronic Journal別冊「2009インクジェット技術大全」 (2008)
  • Author(s): 菅沼克昭、金 槿銖、和久田大介
  • Publisher: 電子ジャーナル
• [Book] インクジェット技術による金属ナノ粒子インク配線(分担執筆)、インクジェットプリンターの応用と材料II (2007)
  • Author(s): 菅沼克昭、和久田大介、金 槿銖
  • Publisher: CMC出版
• [Book] インクジェット配線技術(分担執筆)、最新導電性材料技術大全集<下巻> (2007)
  • Author(s): 菅沼克昭
  • Publisher: 技術情報協会
• [Book] インクジェット印刷による微細配線技術(分担執筆)、最新インクジェット技術 (2007)
  • Author(s): 菅沼克昭
  • Publisher: 技術情報協会
• [Book] 電子回路形成への応用(分担執筆)、Electronic Journal別冊「2007インクジェット技術大全」 (2007)
  • Author(s): 菅沼克昭、金槿銖、和久田大介
  • Publisher: 電子ジャーナル
• [Book] インクジェット印刷による微細配線技術(分担執筆)、最新エレクトロニクス実装大全集<下巻> (2007)
  • Author(s): 菅沼克昭
  • Publisher: 技術情報協会
• [Book] 金属ナノ粒子インクの合成と微細配線形成(分担執筆)、最新エレクトロニクス実装大全集<下巻> (2007)
  • Author(s): 菅沼克昭
  • Publisher: 技術情報協会
• [Book] インクジェットプリンターの応用と材料II 第17章インクジェット技術による金属ナノ粒子インク配線(分担執筆) (2007)
  • Author(s): 菅沼克昭、和久田大介、金槿銖
  • Publisher: シーエムシー出版
• [Book] 最新導電性材料技術大全集<下巻>インクジェット配線技術(分担執筆) (2007)
  • Author(s): 菅沼克昭
  • Publisher: 技術情報協会
• [Book] 最新インクジェット技術、インクジェット印刷による微細配線技術(分担執筆) (2007)
  • Author(s): 菅沼克昭
  • Publisher: 技術情報協会
• [Book] Electronic Journal別冊「2007インクジェット技術大全」、電子回路形成への応用(分担執筆) (2007)
  • Author(s): 菅沼克昭、和久田大介、金槿銖
  • Publisher: 電子ジャーナル
• [Book] 最新エレクトロニクス実装大全集<下巻>、(分担執筆)金属ナノ粒子インクの合成と微細配線形成インクジェット印刷による微細配線技術 (2007)
  • Author(s): 菅沼克昭
  • Publisher: 技術情報協会
• [Book] Printed Electronicsのためのナノ粒子微細配線技術 (2006)
  • Author(s): 河染 満、金 槿銖、畑村眞里子、菅沼克昭
  • Publisher: 粉砕
• [Book] 金属ナノ粒子ペーストのインクジェット微細配線(監修) (2006)
  • Author(s): 菅沼克昭
  • Publisher: シーエムシー出版
• [Book] 金属ナノペーストと微細配線技術(編集) (2006)
  • Author(s): 菅沼克昭
  • Total Pages: 289
  • Publisher: シーエムシー出版
• [Book] 金属ナノ粒子ペーストと微細配線技術(分担執筆)、導電性ナノフィラーと応用製品 (2005)
  • Author(s): 菅沼克昭、金 槿銖
  • Publisher: CMC出版
• [Book] 図解 プリント配線板材料最前線(分担執筆) (2005)
  • Author(s): 菅沼克昭
  • Total Pages: 304
  • Publisher: 工業調査会
• [Patent(Industrial Property Rights)] 金属ナノ粒子の焼結方法およびその焼結方法を用いた配線 (2006)
  • Inventor(s): 菅沼克昭、畑村眞里子、和久田大介
  • Industrial Property Rights Holder: 財団法人大阪産業振興機構/国立大学法人大阪大学
  • Industrial Property Number: 2006-251329
  • Filing Date: 2006-09-15
• [Patent(Industrial Property Rights)] 金属ナメ粒子の焼結方法およびその焼結方法を用いた配線 (2006)
  • Inventor(s): 菅沼克昭, 畑村眞里子, 久田大介
  • Industrial Property Rights Holder: 財団法人大阪産業振興機構, 国立大学法人大阪大学
  • Industrial Property Number: 2006-251329
  • Filing Date: 2006-09-15