Development of Guidelines on Circuit Design for Longer Lifetime of Electronic Devices Based on Accurate Prediction of Metal Line Damage
| Project/Area Number |
17360045
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| Research Category |
Grant-in-Aid for Scientific Research (B)
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| Allocation Type | Single-year Grants |
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| Section | 一般 |
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| Research Field |
Materials/Mechanics of materials
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| Research Institution | Hirosaki University |
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Principal Investigator |
SASAGAWA Kazuhiko Hirosaki University, Hirosaki University, Graduate School of Science and Technology, Associate Professor (50250676)
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| Co-Investigator(Kenkyū-buntansha) |
SAKA Masumi Tohoku University, Graduate School of Engineering, Professor (20158918)
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| Project Period (FY) |
2005 – 2007
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| Project Status |
Completed (Fiscal Year 2007)
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| Budget Amount *help |
¥15,710,000 (Direct Cost: ¥15,200,000、Indirect Cost: ¥510,000)
Fiscal Year 2007: ¥2,210,000 (Direct Cost: ¥1,700,000、Indirect Cost: ¥510,000)
Fiscal Year 2006: ¥7,500,000 (Direct Cost: ¥7,500,000)
Fiscal Year 2005: ¥6,000,000 (Direct Cost: ¥6,000,000)
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| Keywords | Electromigration / Semiconductor Integrated Circuit / Lifetime Extension / Scaling Down / High Density Integration / Electronic Packaging / Metal Line / Numerical Simulation |
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| Research Abstract |
1. Reliability of electromigration damage was evaluated in the angled and tapered Al lines. It was found that the threshold current density in angled line became larger than that in straight one.
2. Acceleration tests were performed using the same line shape as described in item 1. Dependency of line shape and structure on electromigration damage was verified and the used evaluation method was validated.
3. Relationship between line shape/structure and parameter for damage predicting was derived by changing corner position and tapered direction under the same line length. It was found that macroscopic distribution of electric current density affected threshold current for electromigration damage. Guidelines on line shape and structure for longer lifetime were gotten.
4. Reliability of electromigration damage was evaluated treating Al lines covered with TEOS or polyimide film. The result was obtained that polyimide-passivated line had longer lifetime than TEOS's one under the same passivat
… More
ion thickness.
5. Acceleration tests were performed using the passivated lines described in item 4. The tendency obtained from the evaluation was verified through observation of expected damage morphology.
6. Nano-indentation tests were performed using Al lines covered with TEOS, polyimide or SiN films. It was suggested that elastic modulus became smaller in order of SiN, TEOS and polyimide and adhesive strength became larger in this order.
7. Mechanical properties obtained from nano-indentation were compared with material constants of electromigration damage which were parameters for damage predicting. It was suggested that covering with passivation film having small elastic modulus and large adhesive strength was effective for lifetime extension. Guidelines on passivation material and thickness for longer lifetime were gotten. As future prospect, we are going to more generally discuss the guideline considering a relationship between the mechanical properties and one of the parameter for damage predicting, effective bulk modulus. Less
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Report
(4 results)
Research Products
(56 results)
