Evaluation technigue of bonding strength for microstructures and anisotropic materials
| Project/Area Number |
17360050
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| Research Category |
Grant-in-Aid for Scientific Research (B)
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| Allocation Type | Single-year Grants |
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| Section | 一般 |
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| Research Field |
Materials/Mechanics of materials
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| Research Institution | Kyoto University |
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Principal Investigator |
IKEDA Toru Kyoto University, School of Engineering, Associate Professor (40243894)
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| Co-Investigator(Kenkyū-buntansha) |
MIYAZAKI Noriyuki Kyoto University, School of Engineering, Professor (10166150)
松本 龍介 京都大学, 工学研究科, 助手 (80363414)
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| Project Period (FY) |
2005 – 2007
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| Project Status |
Completed (Fiscal Year 2007)
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| Budget Amount *help |
¥13,470,000 (Direct Cost: ¥12,600,000、Indirect Cost: ¥870,000)
Fiscal Year 2007: ¥3,770,000 (Direct Cost: ¥2,900,000、Indirect Cost: ¥870,000)
Fiscal Year 2006: ¥4,000,000 (Direct Cost: ¥4,000,000)
Fiscal Year 2005: ¥5,700,000 (Direct Cost: ¥5,700,000)
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| Keywords | Microstructure / Anisotropic / Interface / Interfacial Corner / Stress Intensity Factor / H-integral / Digital Image Correlation Method / Electronic Packaging / 破壊力学 / 微小構造物 |
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| Research Abstract |
In this study, we developed, (1) A numerical method which analyze the fracture mechanics parameters fir interfaces in microstructures, (2) In-situ measurement system of the distribution of strain in microstructures using the digital image correlation method.
We made software to analyze the stress intensity factors of a three-dimensional interfacial crack between dissimilar anisotropic materials under thermal stress last yea, and we added the graphic user interlace (GUI) to this software for the convenience of users this year. A numerical method to analyze the stress intensity factors of a three-dimensional interfacial corner between dissimilar anisotropic materials under thermal stress was also developed this year. This method is the first numerical method which can analyze the stress intensity factors of an interfacial corner between dissimilar anis: topic materials under thermal stress, and useful for the reliability evaluation of interfacial corners in several structures including microstructures.
A laser confocal microscope was used to measure the strain distribution in microstructures. However the image obtained by a laser confocal microscope is distorted by the error of laser scanning. We modified the distorted image obtained by a laser confocal microscope using a couple of images which have orthogonal scanning directions, and improved the accuracy of strain measurement using the digital image correlation method. The strain distribution in a print circuit board including embedded components was successfully measured using the developed method.
These numerical methods and measurement systems are very useful for the reliability of microstructures including several anisotropic materials.
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Report
(4 results)
Research Products
(24 results)
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[Journal Article] Thermal Strain Measurement on Electronic Packages Using Digital Image Correlation Method2008
Author(s)
Nobuyuki, Shishido, Toru, Ikeda, Noriyuki, Miyazaki, Kentaro, Nakamura, Masashi, Miyazaki, Tatsuro, Sawatari
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Journal Title
Journal of the Society of Materials Science Japan Vol.57 No.1
Pages: 83-89
NAID
Description
「研究成果報告書概要(欧文)」より
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