| Project/Area Number |
17360068
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| Research Category |
Grant-in-Aid for Scientific Research (B)
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| Allocation Type | Single-year Grants |
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| Section | 一般 |
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| Research Field |
Design engineering/Machine functional elements/Tribology
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| Research Institution | The University of Tokyo |
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Principal Investigator |
TSUCHIYA Kensuke The University of Tokyo, Institute of Industrial Science, Associate Professor, 生産技術研究所, 助教授 (80345173)
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| Co-Investigator(Kenkyū-buntansha) |
NAKAO Masayuki The University of Tokyo, Graduate School of Engineering, Professor, 大学院工学系研究科, 教授 (90242007)
HAMAGUCHI Tetsuya The University of Tokyo, Graduate School of Engineering, Associate Professor, 大学院工学系研究科, 助教授 (90345083)
大井 健 東京大学, 大学院工学系研究科, 助手 (00345084)
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| Project Period (FY) |
2005 – 2006
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| Project Status |
Completed (Fiscal Year 2006)
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| Budget Amount *help |
¥15,300,000 (Direct Cost: ¥15,300,000)
Fiscal Year 2006: ¥6,100,000 (Direct Cost: ¥6,100,000)
Fiscal Year 2005: ¥9,200,000 (Direct Cost: ¥9,200,000)
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| Keywords | cooling / channel / laminated chip / sealing / welding |
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| Research Abstract |
The objectives of this research are to develop piping technology for cooling and sealing technology between layers, and design and package laminated integration chips with cooling channels and sensors.
At first we target on to prototype a metal laminated chip. We carried out following preliminary tests for the prototyping.
(1)to exam various materials, machining processes, bonding conditions
(2)to develop functional elements like sensors and joint connectors
We evaluated the machining process and welding condition for a material from both of making perspectives such as machinability or bondability and using perspectives such as heat resistance or corrosion resistance. We found it was necessary to select the machining processes according to shape, width and depth of the channels. We found optimal laser power for each thickness of layers. For example, about 50J/mm2 was optimal for bonding 300um stainless sheet on a substrate.
Next, we miniaturized the functional elements such as joint connectors for outer pipes and micro thermal couples, and then designed channels and layout of the functional elements to prototype a laminated chip with three layers. We tested the prototype by an exothermic reaction with acid, which is nitration of benzene. The result showed the efficiency of the micro channels, and cooling channels. It also showed that bonding whole surface of the chip is needed to improve heat exchanger effectiveness, and bonding a lot of layers in one process like diffusion bonding is more effective than laser welding.
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