• Search Research Projects
  • Search Researchers
  • How to Use
  1. Back to previous page

A STUDY ON CONTACT MECHANISM AND CMP ACTION OF POLISHING PAD

Research Project

Project/Area Number 17560104
Research Category

Grant-in-Aid for Scientific Research (C)

Allocation TypeSingle-year Grants
Section一般
Research Field Production engineering/Processing studies
Research InstitutionSHIBAURA INSTITUTE OF TECHNOLOGY

Principal Investigator

SHIBATA Junji  SHIBAURA INSTITUTE OF TECHNOLOGY, PROFESSOR, 専門職大学院工学マネジメント研究科, 教授 (30052822)

Co-Investigator(Kenkyū-buntansha) OHTA Masato  SHIBAURA INSTITUTE OF TECHNOLOGY, PROFESSOR, 工学部応用化学科, 教授 (50052874)
UEKI Tadahiro  SHIBAURA INSTITUTE OF TECHNOLOGY, LECTURER, 工学部機械工学科, 講師 (50052890)
Project Period (FY) 2005 – 2006
Project Status Completed (Fiscal Year 2006)
Budget Amount *help
¥3,500,000 (Direct Cost: ¥3,500,000)
Fiscal Year 2006: ¥1,000,000 (Direct Cost: ¥1,000,000)
Fiscal Year 2005: ¥2,500,000 (Direct Cost: ¥2,500,000)
KeywordsCMP / POLISHING PAD / CHEMICAL ACTION / PHYSICAL ACTION / GLASS / SLURRY / Si / SOLID CONTACT / 表面トポグラフィ / 微小変形 / ポリウレタン
Research Abstract

Today, the drastic change of our life to the information society has been brought by the rapid popularization of computers, which are associated with highly integrated IC and LSI. The production of IC and LSI depends upon the development of micro-precision processing technologies. Chemical Mechanical Polishing (CMP) is the typical technology necessary for producing multi-layer circuits of IC and LSI by the damascene method on a silicon wafer, where surface of each circuit layer must be made to be perfectly smooth. The required flatness for the surface finished by CMP in production process would be now less than 100 Å.
CMP is polishing technology concerning mainly with the planarization, but the polishing mechanism made by polishing pad and agent manufactured by the sol-gel method has not completely made clear yet. In this study we were using the polishing properties such as stock removal, surface roughness and their correlation as a basis valuation to investigate the polishing acting point. As a result, we estimated that the number of polishing acting point is limited and stable. When the polishing force is increased we estimate the acting point number would increase. We observed the increase of the polishing acting point number which should cause by the amount of material in polishing.
Finally, we get to the conclusion that physical properties of polishing pad such as surface texture, flexibility, etc., would play an important role in CMP process because contact points of the pad with the work surface, which are the action point of CMP, are directly influenced by he physical properties of the pad.

Report

(3 results)
  • 2006 Annual Research Report   Final Research Report Summary
  • 2005 Annual Research Report
  • Research Products

    (5 results)

All 2005

All Journal Article (5 results)

  • [Journal Article] 固体接触面の機密性2005

    • Author(s)
      長谷川, 柴田
    • Journal Title

      2005年度砥粒加工学会学術講演会講演論文集

      Pages: 355-356

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      2006 Final Research Report Summary
  • [Journal Article] ゾルゲル法を利用した固定砥粒工具の開発2005

    • Author(s)
      谷, 宮田, 柴田, 上村
    • Journal Title

      砥粒加工学会誌 49・5

      Pages: 264-268

    • NAID

      10015520160

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      2006 Final Research Report Summary
  • [Journal Article] Development of fixed Abrasive tools utilizing sol-gel method2005

    • Author(s)
      Y.TANI, Y.MIYATA, J.SHIBATA, Y.KAMIMURA
    • Journal Title

      Journal of the Japan Society for Abrasive Technology Vol.49, No.5

      Pages: 264-268

    • NAID

      10015520160

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      2006 Final Research Report Summary
  • [Journal Article] Air tightness at solid contact interface2005

    • Author(s)
      T.HASEGAWA, J.SHIBATA
    • Journal Title

      Proceedings of ABTEC 2005

      Pages: 355-356

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      2006 Final Research Report Summary
  • [Journal Article] 固体接触面の機密性2005

    • Author(s)
      長谷川智之, 柴田順二
    • Journal Title

      砥粒加工学会ABTEC2005講演論文集

      Pages: 99-100

    • Related Report
      2005 Annual Research Report

URL: 

Published: 2005-04-01   Modified: 2016-04-21  

Information User Guide FAQ News Terms of Use Attribution of KAKENHI

Powered by NII kakenhi