| Budget Amount *help |
¥9,750,000 (Direct Cost: ¥7,500,000、Indirect Cost: ¥2,250,000)
Fiscal Year 2019: ¥6,630,000 (Direct Cost: ¥5,100,000、Indirect Cost: ¥1,530,000)
Fiscal Year 2018: ¥1,820,000 (Direct Cost: ¥1,400,000、Indirect Cost: ¥420,000)
Fiscal Year 2017: ¥1,300,000 (Direct Cost: ¥1,000,000、Indirect Cost: ¥300,000)
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| Outline of Final Research Achievements |
A series of prototyping of the monolithic sensor-electronics chips and pixelated analog-to-digital conversion circuit was performed to construct a high-speed X-ray imaging system. In the evaluation testing, a new DAQ electronics, in which a commercial FPGA was on board, was newly developed for effective and general-purpose ASIC testing. The screen-offset print technology was also tested as an alternative approach of the bump bonding technology. This study established a basic design/verification environment to develop the key components of the high-speed X-ray imagers.
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