Heterophotonics fabricated by ultra-precision cutting and room-temperature bonding

• Project/Area Number: 17H04925
• Research Category: Grant-in-Aid for Young Scientists (A)
• Allocation Type: Single-year Grants
• Research Field: Electron device/Electronic equipment
• Research Institution: Kyushu University
• Principal Investigator: Takigawa Ryo 九州大学, システム情報科学研究院, 助教 (80706846)
• Project Period (FY): 2017-04-01 – 2020-03-31
• Project Status: Completed (Fiscal Year 2019)
• Budget Amount: ¥24,310,000 (Direct Cost: ¥18,700,000、Indirect Cost: ¥5,610,000); Fiscal Year 2019: ¥2,600,000 (Direct Cost: ¥2,000,000、Indirect Cost: ¥600,000); Fiscal Year 2018: ¥5,850,000 (Direct Cost: ¥4,500,000、Indirect Cost: ¥1,350,000); Fiscal Year 2017: ¥15,860,000 (Direct Cost: ¥12,200,000、Indirect Cost: ¥3,660,000)
• Keywords: 常温接合 / 導波路切削加工 / LNOI / 異種材料集積 / LN/Siハイブリッド構造 / LNOI光集積回路 / LNOIリング共振器 / LNOI/Siハイブリッド構造 / 光実装 / ハイブリッド光導波路 / LN/Siフォトニクス / 切削導波路加工 / LiNbO3/Si集積化 / 小型・低消費電力光デバイス / 強誘電体/半導体融合デバイス / ハイブリッド光導波路型デバイス / 常温移載接合 / 大気中接合・加工 / 光マイクロシステム / ナノ切削加工 / 大気中微細加工・接合

Outline of Final Research Achievements

In this study, lithium niobate on insulator (LNOI) waveguide for strong optical confinment intgrated on Si platform was demonstrated by ultra-precision cutting and room-temperature bonding method. These room-temperature bonding and cutting methods are expected to fabricate various heterogenous devices with large coefficient of thermal expansion mismatch between dissimilar materials, not just LNOI waveguide/Si devices.

Academic Significance and Societal Importance of the Research Achievements

本研究成果により、光通信等の幅広い分野で利用されるニオブ酸リチウム(LN)光デバイスの大幅な小型・低消費電力・高効率化とともにこれを常温接合することでSiプラットフォーム上への集積・実装の道を拓いた。LN高速光変調器に展開した場合、将来のLSIチップ間・内の大容量・低消費電力データ伝送に役立つ可能性があり、電子機器の性能向上に繋がる。また、提案する導波路切削加工の確立と常温接合のメカニズム解明は学術的な意義のみならず、将来の広範なマイクロデバイス基盤製造技術としての展開も期待できる。

Research Products

• [Journal Article] Demonstration of GaN/LiNbO3 Hybrid Wafer Using Room-Temperature Surface Activated Bonding (2020)
  • Author(s): Takigawa Ryo、Matsumae Takashi、Yamamoto Michitaka、Higurashi Eiji、Asano Tanemasa、Kanaya Haruichi
  • Journal Title: ECS Journal of Solid State Science and Technology Volume: 9 Issue: 4 Pages: 045005-045005
  • DOI: 10.1149/2162-8777/ab8369
  • Peer Reviewed
• [Journal Article] Direct bonding of LiNbO3 and SiC wafers at room temperature (2020)
  • Author(s): Takigawa Ryo、Utsumi Jun
  • Journal Title: Scripta Materialia Volume: 174 Pages: 58-61
  • DOI: 10.1016/j.scriptamat.2019.08.027
  • Peer Reviewed
• [Journal Article] Fabrication of a bonded LNOI waveguide structure on Si substrate using ultra-precision cutting (2020)
  • Author(s): Takigawa Ryo、Kamimura Keigo、Asami Kenta、Nakamoto Keiichi、Tomimatsu Toru、Asano Tanemasa
  • Journal Title: Japanese Journal of Applied Physics Volume: 59 Issue: SB Pages: SBBD03-SBBD03
  • DOI: 10.7567/1347-4065/ab514e
  • NAID: 210000157431
  • Peer Reviewed
• [Journal Article] Residual Stress in Lithium Niobate Film Layer of LNOI/Si Hybrid Wafer Fabricated Using Low-Temperature Bonding Method (2019)
  • Author(s): Ryo Takigawa, Toru Tomimatsu, Eiji Higurashi, Tanemasa Asano
  • Journal Title: Micromachine Volume: 10 Issue: 2 Pages: 136-136
  • DOI: 10.3390/mi10020136
  • Peer Reviewed / Open Access
• [Journal Article] Thin-film lithium niobate-on-insulator waveguides fabricated on silicon wafer by room-temperature bonding method with silicon nanoadhesive layer (2018)
  • Author(s): Ryo Takigawa, Tanemasa Asano
  • Journal Title: Optics Express Volume: 26 Issue: 19 Pages: 24413-24421
  • DOI: 10.1364/oe.26.024413
  • Peer Reviewed / Open Access
• [Journal Article] Surface Activated Bonding of LiNbO3 and GaN at Room Temperature (2018)
  • Author(s): Ryo Takigawa, Eiji Higurashi and Tanemasa Asano
  • Journal Title: ECS transactions Volume: 86 Issue: 5 Pages: 207-213
  • DOI: 10.1149/08605.0207ecst
  • Peer Reviewed
• [Journal Article] Room-temperature wafer bonding of LiNbO3 and SiO2 using a modified surface activated bonding method (2018)
  • Author(s): Ryo Takigawa, Eiji Higurashi, and Tanemasa Asano
  • Journal Title: Japanese Journal of Applied Physics Volume: 57
  • NAID: 210000149187
  • Peer Reviewed
• [Journal Article] Auを用いた大気中低温接合によるLiNbO3光デバイス実装 (2018)
  • Author(s): 多喜川良
  • Journal Title: 信学技報 Volume: 117 Pages: 7-11
• [Presentation] Room-temperature direct bonding of LiTaO3 and SiC wafers for future SAW filter (2019)
  • Author(s): Ryo Takigawa, Jun Utsumi
  • Organizer: 45th International Conference on Micro & Nano Engineering
  • Int'l Joint Research
• [Presentation] ニオブ酸リチウムと炭化シリコンの常温ウエハ接合 (2019)
  • Author(s): 多喜川良、内海淳,
  • Organizer: 第29回 マイクロエレクトロニクスシンポジウム（MES2019）
• [Presentation] 常温接合による超高速フォトニクス実装 (2019)
  • Author(s): 多喜川良
  • Organizer: 電子情報通信学会 SDM ICD ITE-IST研究会
  • Invited
• [Presentation] Lithium niobate-on-insulator waveguide on Si substrate fabricated by room temperature bonding (2019)
  • Author(s): Ryo Takigawa, Keigo Kamimura, Keiichi Nakamoto, Tanemasa Asano
  • Organizer: 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)
  • Int'l Joint Research
• [Presentation] 接合中間層がLNOI光導波路特性に及ぼす影響調査 (2019)
  • Author(s): 多喜川良、日暮栄治、浅野種正
  • Organizer: 第33回エレクトロニクス実装学会春季大会
• [Presentation] 超精密切削加工によるLNOI光導波路の作製 (2019)
  • Author(s): 上村啓悟, 多喜川 良, 中本圭一
  • Organizer: 第66回応用物理学会春季学術講演会
• [Presentation] 紫外線洗浄を利用した 大気中Au-Au低温接合の検討 (2019)
  • Author(s): 多喜川良
  • Organizer: The 7th Joint Conference of Research Center for Advanced Biomechanics & Japan Institute of Electronics Packaging Kyushu Branch
• [Presentation] Low-temperature bonding for heterogeneous photonic integration (2019)
  • Author(s): Ryo Takigawa
  • Organizer: 6th K-J Joint Syposium
  • Int'l Joint Research / Invited
• [Presentation] Surface activated bonding of LiNbO3 and Si for optical microsystem (2018)
  • Author(s): Ryo Takigawa
  • Organizer: 31st International Microprocesses and Nanotechnology Conference(MNC)
  • Int'l Joint Research / Invited
• [Presentation] Room-temperature wafer bonding of LiNbO3 and SiO2 using sub-nanometer Fe films (2018)
  • Author(s): Ryo Takigawa, Eiji Higurashi, Tanemasa Asano
  • Organizer: 23rd Microoptics Conference (MOC2018)
  • Int'l Joint Research
• [Presentation] Siナノ密着層を利用したLiNbO3とSiO2の常温ウエハ接合と低損失LNOI光導波路への応用 (2018)
  • Author(s): 多喜川良、浅野種正
  • Organizer: 第７9回応用物理学会秋季学術講演会
• [Presentation] Surface Micromachining Using Ultra-precision Ductile-mode Cutting Method for Strongly Confined Low-loss LiNbO3 Waveguides (2018)
  • Author(s): Ryo Takigawa, Tetsuya Kawanishi, Eiji Higurashi, and Tanemasa Asano
  • Organizer: Progress in Electromagnetics Research Symposium(PIERS) 2018
  • Int'l Joint Research / Invited
• [Presentation] イオンビーム活性化接合法による Si上LNOI導波路の作製と光伝搬特性評価 (2018)
  • Author(s): 多喜川良，日暮栄治，浅野種正
  • Organizer: 第65回応用物理学会春季学術講演会
• [Presentation] LN変調器向け小型0.18μm CMOS高速駆動回路 (2018)
  • Author(s): 久保木猛，多喜川良，加藤和利
  • Organizer: 第65回応用物理学会春季学術講演会
• [Presentation] 切削加工によるSi基板上LNOI光導波路の作製検討 (2018)
  • Author(s): 多喜川良，日暮栄治，川西哲也，浅野種正
  • Organizer: 第32回エレクトロニクス実装学会春季講演大会
• [Presentation] Auを用いた大気中低温接合によるLiNbO3光デバイス実装 (2017)
  • Author(s): 多喜川良
  • Organizer: 電子情報通信学会マイクロ波・ミリ波フォトニクス研究会
  • Invited
• [Presentation] Room-temperature bonding of LiNbO3 and SiO2 usingsurface activated bonding (2017)
  • Author(s): Ryo Takigawa, Eiji Higurashi, Tanemasa Asano
  • Organizer: 30th International of Microprocesses and Nanotechnology Conference
  • Int'l Joint Research
• [Presentation] 表面活性化と低温熱処理を併用したLiNbO3ウェハと SiO2/Si ウェハの直接接合 (2017)
  • Author(s): 多喜川良，日暮栄治，浅野種正
  • Organizer: 第78回応用物理学会秋季学術講演会