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Development of high throughput metal nano patterns stacking method

Research Project

Project/Area Number 17K06091
Research Category

Grant-in-Aid for Scientific Research (C)

Allocation TypeMulti-year Fund
Section一般
Research Field Production engineering/Processing studies
Research InstitutionTokyo University of Science

Principal Investigator

Taniguchi Jun  東京理科大学, 基礎工学部電子応用工学科, 教授 (40318225)

Project Period (FY) 2017-04-01 – 2020-03-31
Project Status Completed (Fiscal Year 2019)
Budget Amount *help
¥4,420,000 (Direct Cost: ¥3,400,000、Indirect Cost: ¥1,020,000)
Fiscal Year 2019: ¥650,000 (Direct Cost: ¥500,000、Indirect Cost: ¥150,000)
Fiscal Year 2018: ¥1,430,000 (Direct Cost: ¥1,100,000、Indirect Cost: ¥330,000)
Fiscal Year 2017: ¥2,340,000 (Direct Cost: ¥1,800,000、Indirect Cost: ¥540,000)
Keywordsナノインプリント / 銀インク / 貫通穴電極 / 金型 / フレキシブルデバイス / UV硬化性樹脂 / UV-NIL / X線CT / 積層構造 / 配線積層構造 / ロールトゥロール / 光硬化性樹脂 / アライメント / 貫通穴 / 光硬化樹脂 / プラズモン / メタマテリアル / ナノ金型 / ナノ金属パターン
Outline of Final Research Achievements

Demand for printed electronic devices is increasing, likewise the attention being paid to through-hole electrodes as an integration approach. In comparison with wire bonding integration methods, through-hole electrodes occupy smaller surface areas and have lower power consumption rates. Generally, the diameters of through-holes fabricated in flexible substrates are larger than those developed in rigid substrates. In this study, ultraviolet nanoimprint lithography was used to fabricate microscale through-holes in a flexible substrate, and these holes were subsequently filled with silver ink to form through-hole electrodes. The through-hole electrode for wiring was successfully fabricated using silver ink. The resistance value of the integral lower layer wiring to through-hole electrode to upper layer wiring was measured as 55 kΩ. X-ray CT showed that the three-layer structure was integrated three-dimensionally. Lastly, the TEM image indicates the formation of silver crystals.

Academic Significance and Societal Importance of the Research Achievements

フレキシブルデバイスの上に新たにフレキシブルデバイスを作製し上下間で相互接続させることで1枚の基板に複数の機能を持たせる積層構造が注目されている。しかし、積層構造を作製する際にデバイス間の電気的接続を行う貫通穴電極が必要となるが、貫通穴電極を作製する際に必要な微細な貫通穴をフレキシブルな基板で作製することは困難である。本研究では、銀インクとナノインプリント技術を用いて、大気中で作製できる技術を開発した。大気中で作製できるため、量産性に優れた実用的なプロセスといえる。開発した貫通穴電極作製方法はさまざまなフレキシブルデバイスの積層構造の作製に有用であり、学術的にも社会的にも意義深い。

Report

(4 results)
  • 2019 Annual Research Report   Final Research Report ( PDF )
  • 2018 Research-status Report
  • 2017 Research-status Report
  • Research Products

    (9 results)

All 2020 2019 2018 2017

All Journal Article (3 results) (of which Peer Reviewed: 2 results) Presentation (6 results) (of which Int'l Joint Research: 4 results)

  • [Journal Article] Fabrication of Flexible Fine Through-hole Electrodes for Printed Devices using UV-NIL2020

    • Author(s)
      Kazuki Honjo, Atsuhiro Furuta, and Jun Taniguchi
    • Journal Title

      Journal of Photopolymer Science and Technology

      Volume: 33 Pages: 545-550

    • NAID

      130007867664

    • Related Report
      2019 Annual Research Report
    • Peer Reviewed
  • [Journal Article] Fabrication of multilayered structure of silver nanorod arrays for plasmon memory2018

    • Author(s)
      Wadayama Hisahiro、Okabe Takao、Taniguchi Jun
    • Journal Title

      Microelectronic Engineering

      Volume: 193 Pages: 47-53

    • DOI

      10.1016/j.mee.2018.02.020

    • Related Report
      2017 Research-status Report
    • Peer Reviewed
  • [Journal Article] Fabrication of overlaid nanopattern arrays for plasmon memory2018

    • Author(s)
      Okabe Takao、Wadayama Hisahiro、Taniguchi Jun
    • Journal Title

      Proc. SPIE 10456, Nanophotonics Australasia 2017, 1045655

      Volume: 10456 Pages: 181-181

    • DOI

      10.1117/12.2281591

    • Related Report
      2017 Research-status Report
  • [Presentation] Fine Flexible Through Electrodes for Printed Devices Using Silver Ink2019

    • Author(s)
      Kazuki Honjo, Jun Taniguchi
    • Organizer
      32nd International Microprocesses and Nanotechnology Conference (MNC2019)
    • Related Report
      2019 Annual Research Report
    • Int'l Joint Research
  • [Presentation] Flexible fine through hole electrodes for printed devices2018

    • Author(s)
      Kazuki Honjo, Jun Taniguchi
    • Organizer
      The 44th International Conference on Micro and Nano Engineering (MNE2018)
    • Related Report
      2018 Research-status Report
    • Int'l Joint Research
  • [Presentation] フレキシブルデバイス用の貫通穴電極の作製2018

    • Author(s)
      本庄 一希,谷口 淳
    • Organizer
      第79回応用物理学会秋季学術講演会(2018)
    • Related Report
      2018 Research-status Report
  • [Presentation] 銀インクとアライメ ントマークを用いた 銀ナノロッドパター ンの積層技術の開発2018

    • Author(s)
      和田山久広、岡部貴雄、谷口 淳
    • Organizer
      2 0 1 8 年度精密工学会春季大会学術講演会
    • Related Report
      2017 Research-status Report
  • [Presentation] Fabrication of multilayer structure of silver nanorod arrays for plasmon memory2017

    • Author(s)
      Hisahiro Wadayama, Takao Okabe, Jun Taniguchi
    • Organizer
      43rd Micro and Nano Engineering
    • Related Report
      2017 Research-status Report
    • Int'l Joint Research
  • [Presentation] Fabrication of overlaid nanopattern arrays for plasmon memory2017

    • Author(s)
      Takao Okabe, Hisahiro Wadayama, Jun Taniguchi
    • Organizer
      SPIE NanoPhotonics Australasia 2017
    • Related Report
      2017 Research-status Report
    • Int'l Joint Research

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Published: 2017-04-28   Modified: 2021-02-19  

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