Laser-induced modification of diamond
Project/Area Number |
17K18820
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Research Category |
Grant-in-Aid for Challenging Research (Exploratory)
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Allocation Type | Multi-year Fund |
Research Field |
Mechanics of materials, Production engineering, Design engineering, and related fields
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Research Institution | Chiba University |
Principal Investigator |
Morita Noboru 千葉大学, 大学院工学研究院, 教授 (30239660)
|
Co-Investigator(Kenkyū-buntansha) |
松坂 壮太 千葉大学, 大学院工学研究院, 准教授 (30334171)
比田井 洋史 千葉大学, 大学院工学研究院, 教授 (60313334)
|
Project Period (FY) |
2017-06-30 – 2019-03-31
|
Project Status |
Completed (Fiscal Year 2018)
|
Budget Amount *help |
¥6,240,000 (Direct Cost: ¥4,800,000、Indirect Cost: ¥1,440,000)
Fiscal Year 2018: ¥1,300,000 (Direct Cost: ¥1,000,000、Indirect Cost: ¥300,000)
Fiscal Year 2017: ¥4,940,000 (Direct Cost: ¥3,800,000、Indirect Cost: ¥1,140,000)
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Keywords | レーザ / ダイヤモンド / 精密部品加工 |
Outline of Final Research Achievements |
Diamond is expected to be utilized as a semiconductor material because it has excellent dielectric strength and thermal conductivity. Slicing a bulk diamond into wafers with small kerf loss is required. Therefore, a high-yield slicing method by etching laser-induced modified layer inside diamond has been studied. The modified layer was formed by scanning laser focus. However, this method had a problem that only a part of the modified area was etched because it was discontinuous. In this study, modified lines were formed under various processing conditions. Modified lines were evaluated by electric conductivity. As a result, higher electric conductivity modified line was obtained under a higher scanning rate and lower energy and with a higher NA lens and longer pulse duration laser.
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Academic Significance and Societal Importance of the Research Achievements |
ダイヤモンドは硬く脆いため,切断が困難である.そこで,小さい切りしろで切断する方法について,検討した.ダイヤモンドにレーザ光を照射し,照射した部分をグラファイトに変質する.グラファイトはある薬品に溶解するため,レーザを照射した部分のみを溶解できる.レーザ照射条件と変質のメカニズム,変質部分の評価を行った.
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Report
(3 results)
Research Products
(2 results)