| Project/Area Number |
18360350
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| Research Category |
Grant-in-Aid for Scientific Research (B)
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| Allocation Type | Single-year Grants |
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| Section | 一般 |
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| Research Field |
Material processing/treatments
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| Research Institution | Tokyo Institute of Technology |
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Principal Investigator |
SONE Masato Tokyo Institute of Technology, Precision and Intelligence Laboratory, Associate Professor (30323752)
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| Co-Investigator(Kenkyū-buntansha) |
HIGO Yakichi Tokyo Institute of Technology, Precision and Intelligence Laboratory, Professor (30016802)
ISHIYAMA Chiemi Tokyo Institute of Technology, Precision and Intelligence Laboratory, Assistant Professor (00311663)
SHIBATA Akinobu Tokyo Institute of Technology, Precision and Intelligence Laboratory, Assistant Professor (60451994)
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| Project Period (FY) |
2006 – 2007
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| Project Status |
Completed (Fiscal Year 2007)
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| Budget Amount *help |
¥17,400,000 (Direct Cost: ¥15,600,000、Indirect Cost: ¥1,800,000)
Fiscal Year 2007: ¥7,800,000 (Direct Cost: ¥6,000,000、Indirect Cost: ¥1,800,000)
Fiscal Year 2006: ¥9,600,000 (Direct Cost: ¥9,600,000)
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| Keywords | Plating / Superfine Manufacturing / Superfine Wiring Process / Supercritical Fluid / Surface Finishing |
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| Research Abstract |
An innovative electroplating technology "Supercritical Nanoplating (SNP)", which is a hybrid of supercritical fluid and electroplating technology, has been proposed. In this technology, electroplating reactions are carried out in emulsion of supercritical carbon dioxide (CO_2) and electroplating solution with surfactants. The objective of this study is to develop a novel, superfine wire manufacturing technology by SNP with supercritical CO_2 washing. Firstly, we elucidated the plating reaction by measuring the current values in the emulsion using minute terminals connected to a programmable power supply, while simultaneously observing the dispersion state of the emulsion through a high-pressure view cell. The flow of current values in the emulsion system fluctuated, and the current value decreased together with the amplitude of the fluctuant current when the pressure was increased. The fluctuant current flow in the emulsion was concluded to play an important role in the fabrication of the nano grain nickel structure in the plated film. Secondly, the electroless plating reactions are carried out in an emulsion of sc-CO_2 and an electroless plating solution with surfactant. The Ni-P film obtained by this proposed technique was a uniform and conformal film without the pinholes that form from the hydrogen bubbles produced by the electrolysis of water, and without the nodules that form from the nuclear growth on the electroless plating reaction. Lastly, SNP was applied to the superfine wiring. The superfine Cu wiring by SNP successfully gave uniform, excellent Cu wire without void on the Si substrate with φ120 nm hole. Thus, SNP technology has great possibility to contribute to next generation integrated circuit technology.
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