| Budget Amount *help |
¥18,200,000 (Direct Cost: ¥14,000,000、Indirect Cost: ¥4,200,000)
Fiscal Year 2020: ¥1,690,000 (Direct Cost: ¥1,300,000、Indirect Cost: ¥390,000)
Fiscal Year 2019: ¥1,690,000 (Direct Cost: ¥1,300,000、Indirect Cost: ¥390,000)
Fiscal Year 2018: ¥14,820,000 (Direct Cost: ¥11,400,000、Indirect Cost: ¥3,420,000)
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| Outline of Final Research Achievements |
Ultrashort pulse laser processing of transparent materials has been investigated by considering the thermal-electronic mechanism both experimentally and numerically. Fused silica has been chosen for the sample. Experiments show unique characteristics of the ablation threshold with pulse width dependence and the two stage behavior of the ablation hole depth as a function of fluence. Numerical calculation has been developed by combining the rate eq. of the electron number density, BPM scheme for the electric field, and the two temperature model for the electron and lattice temperature calculation to explain the fluence and the pulse width dependence. Initial target is therefore fulfilled by showing the importance of the combined electronic and thermal modeling on the problem.
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