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Depinning of Fermi Level by Interface Structure Control

Research Project

Project/Area Number 18H03830
Research Category

Grant-in-Aid for Scientific Research (A)

Allocation TypeSingle-year Grants
Section一般
Review Section Medium-sized Section 26:Materials engineering and related fields
Research InstitutionTohoku University

Principal Investigator

Koike Junichi  東北大学, 工学研究科, 教授 (10261588)

Project Period (FY) 2018-04-01 – 2021-03-31
Project Status Completed (Fiscal Year 2020)
Budget Amount *help
¥44,330,000 (Direct Cost: ¥34,100,000、Indirect Cost: ¥10,230,000)
Fiscal Year 2020: ¥10,660,000 (Direct Cost: ¥8,200,000、Indirect Cost: ¥2,460,000)
Fiscal Year 2019: ¥17,160,000 (Direct Cost: ¥13,200,000、Indirect Cost: ¥3,960,000)
Fiscal Year 2018: ¥16,510,000 (Direct Cost: ¥12,700,000、Indirect Cost: ¥3,810,000)
Keywords半導体 / 金属 / 界面 / コンタクト / 抵抗 / コンタクト配線 / トランジスタ / ギャップ準位 / ショットキー障壁高さ / 金属半導体界面 / 接触抵抗 / シリサイド / 酸化物
Outline of Final Research Achievements

We found that Co-Ti can decrease the growth rate of Co monosilicide (CoSi) that had an epitaxial relation with Si. By overlaying SiO2, SBH could be decreased from 0.7 to 0.3 eV. When TiO2 or TiNbO2 was used in place of SiO2, their small band offset could bring about a low SBH of 0.3 eV consistently. However, apparent contact resistivity remained high because of their high resistance. We also investigated the contact property of n-GaN. The growth of epitaxial Ga2O3 oxide on GaN could reduce DIGS, while the insulating property of the oxide could reduce MIGS, which brought about a very low SBH of 0.1 eV and three-orders lower contact resistivity than the samples without the oxide.

Academic Significance and Societal Importance of the Research Achievements

金属と半導体の界面を整合界面にすることと、バンドオフセットが小さい酸化物を利用することでショットキー障壁高さが低減できるが、、酸化物の抵抗が高いことによる接触抵抗率の高止まりを明確に示した。また、良導体酸化物を利用することの可能性を示した。さらに、GaNにおいて界面構造欠陥由来(DIGS)と金属由来(MIGS)の界面準位を一挙に低減できる酸化物としてβ-Ga2O3の有効性を示した。このように、界面整合性、金属電子の染み出し、界面層の抵抗がSBHと接触抵抗率に及ぼす影響を一つずつ解明し、今後の超微細高速半導体デバイスのコンタクト材料開発の先鞭をつけた。

Report

(4 results)
  • 2020 Annual Research Report   Final Research Report ( PDF )
  • 2019 Annual Research Report
  • 2018 Annual Research Report
  • Research Products

    (36 results)

All 2021 2020 2019 2018 Other

All Int'l Joint Research (4 results) Journal Article (10 results) (of which Int'l Joint Research: 3 results,  Peer Reviewed: 10 results,  Open Access: 8 results) Presentation (21 results) (of which Int'l Joint Research: 13 results,  Invited: 9 results) Remarks (1 results)

  • [Int'l Joint Research] Rensselaer Polytechnic Institute(米国)

    • Related Report
      2020 Annual Research Report
  • [Int'l Joint Research] Rensselaer Polytechnic Institute(米国)

    • Related Report
      2019 Annual Research Report
  • [Int'l Joint Research] 台湾交通大学(その他の国・地域)

    • Related Report
      2019 Annual Research Report
  • [Int'l Joint Research] Rensselaer Polytechnic Institute(米国)

    • Related Report
      2018 Annual Research Report
  • [Journal Article] Potential of low-resistivity Cu2Mg for highly scaled interconnects and itschallenges2021

    • Author(s)
      Linghan Chen, Qian Chen, Daisuke Ando, Yuji Sutou, Momoji Kubo, Junichi Koike
    • Journal Title

      Applied Surface Science

      Volume: 537 Pages: 148035-148035

    • DOI

      10.1016/j.apsusc.2020.148035

    • Related Report
      2020 Annual Research Report
    • Peer Reviewed
  • [Journal Article] Interdiffusion reliability and resistivity scaling of intermetallic compounds as advanced interconnect materials2021

    • Author(s)
      Linghan Chen, Sushant Kumar, Masataka Yahagi, Daisuke Ando, Yuji Sutou, Daniel Gall, Ravishankar Sundararaman, and Junichi Koike
    • Journal Title

      Journal of Applied Physics

      Volume: 129 Issue: 3

    • DOI

      10.1063/5.0026837

    • Related Report
      2020 Annual Research Report
    • Peer Reviewed / Int'l Joint Research
  • [Journal Article] Liner- and barrier-free NiAl metallization: A perspective from TDDB reliability and interface status2019

    • Author(s)
      Chen, L., Ando, D., Sutou, Y., Yokogawa, S., Koike, J.
    • Journal Title

      Applied Surface Science

      Volume: 497 Pages: 143810-143810

    • DOI

      10.1016/j.apsusc.2019.143810

    • Related Report
      2019 Annual Research Report
    • Peer Reviewed / Open Access
  • [Journal Article] CuAl2 thin films as a low-resistivity interconnect material for advanced semiconductor devices2019

    • Author(s)
      Chen, L., Ando, D., Sutou, Y., Koike, J.
    • Journal Title

      Journal of Vacuum Science and Technology B: Nanotechnology and Microelectronics

      Volume: 37 Issue: 3

    • DOI

      10.1116/1.5094404

    • Related Report
      2019 Annual Research Report
    • Peer Reviewed / Open Access
  • [Journal Article] Electrical transport mechanism of the amorphous phase in Cr2Ge2Te6 phase change material2019

    • Author(s)
      S. Hatayama, Y. Sutou, D. Ando, J. Koike and K. Kobayashi
    • Journal Title

      Journal of Physics D: Applied Physics

      Volume: 52 Issue: 10 Pages: 105103-105109

    • DOI

      10.1088/1361-6463/aafa94

    • Related Report
      2019 Annual Research Report
    • Peer Reviewed / Open Access
  • [Journal Article] Conformal deposition of RuO2 on Cu via a galvanic cementation reaction2019

    • Author(s)
      Lin, C., Chou, S.-C., Tso, K.-C., Koike, J., Wu, P.-W
    • Journal Title

      Journal of the Electrochemical Society

      Volume: 166 Issue: 10 Pages: D476-D482

    • DOI

      10.1149/2.0061912jes

    • Related Report
      2019 Annual Research Report
    • Peer Reviewed / Open Access / Int'l Joint Research
  • [Journal Article] Co and CoTix for contact plug and barrier layer in integrated circuits2018

    • Author(s)
      Maryamsadat Hosseini, Daisuke Ando, Yuji Sutou, Junichi Koike
    • Journal Title

      Microelectronic Engineering

      Volume: 189 Pages: 78-84

    • DOI

      10.1016/j.mee.2017.12.017

    • Related Report
      2018 Annual Research Report
    • Peer Reviewed / Open Access
  • [Journal Article] NiAl as a Potential Material for Liner- and Barrier-Free Interconnect in Ultrasmall Technology Node2018

    • Author(s)
      Linghan Chen, Daisuke Ando, Yuji Sutou, Daniel Gall, Junichi Koike
    • Journal Title

      Applied Physics Letters, 113, 18, 2018, 183503

      Volume: 113 Issue: 18

    • DOI

      10.1063/1.5049620

    • Related Report
      2018 Annual Research Report
    • Peer Reviewed / Open Access / Int'l Joint Research
  • [Journal Article] New Contact Metallization Scheme for FinFET and beyond2018

    • Author(s)
      Junichi Koike, Maryamsadat Hosseini, Daisuke Ando, Yuji Sutou
    • Journal Title

      2018 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2018 - Proceedings

      Volume: 1 Pages: 169-171

    • DOI

      10.1109/edtm.2018.8421448

    • Related Report
      2018 Annual Research Report
    • Peer Reviewed / Open Access
  • [Journal Article] Material innovation for MOL, BEOL, and 3D integration2018

    • Author(s)
      Junichi Koike, Maryamsadat Hosseini, Hoang Tri Hai, Daisuke Ando, Yuji Sutou
    • Journal Title

      Technical Digest - International Electron Devices Meeting, IEDM

      Volume: 1 Pages: 32.3.1-32.3.4

    • DOI

      10.1109/iedm.2017.8268485

    • Related Report
      2018 Annual Research Report
    • Peer Reviewed / Open Access
  • [Presentation] ライナー・バリアフリー次世代配線材料CuAl2の物理的特性2021

    • Author(s)
      久家俊洋
    • Organizer
      第68回応用物理学会春季学術講演会
    • Related Report
      2020 Annual Research Report
  • [Presentation] 金属/GaN界面におけるフェルミレベルピンニング2021

    • Author(s)
      古塲治朗
    • Organizer
      第68回応用物理学会春季学術講演会
    • Related Report
      2020 Annual Research Report
  • [Presentation] LSI 多層配線単層バリア材料としての コバルト合金の可能性2021

    • Author(s)
      山田裕貴
    • Organizer
      第68回応用物理学会春季学術講演会
    • Related Report
      2020 Annual Research Report
  • [Presentation] TaN薄膜のバリア特性の限界2021

    • Author(s)
      久家俊洋
    • Organizer
      電子情報通信学会 シリコン材料・デバイス研究会
    • Related Report
      2020 Annual Research Report
  • [Presentation] 熱力学シミュレーションを用いたCo合金単層バリア材料の探索2021

    • Author(s)
      山田裕貴
    • Organizer
      電子情報通信学会 シリコン材料・デバイス研究会
    • Related Report
      2020 Annual Research Report
  • [Presentation] Thermodynamic Exploration of Co Alloy Diffusion Barriers for Advanced Cu Interconnect2020

    • Author(s)
      Yuki Yamada
    • Organizer
      IEEE International Interconnect Technology Conference 2020
    • Related Report
      2020 Annual Research Report
    • Int'l Joint Research
  • [Presentation] Possibility of Cu2Mg for Liner-Barrier Free Interconnects2020

    • Author(s)
      Linghan Chen
    • Organizer
      IEEE International Interconnect Technology Conference 2020
    • Related Report
      2020 Annual Research Report
    • Int'l Joint Research
  • [Presentation] The structural origin of the minimum diffusion barrier thickness of ultara-thin TaNx2020

    • Author(s)
      Toshihiro Kuge
    • Organizer
      IEEE International Interconnect Technology Conference 2020
    • Related Report
      2020 Annual Research Report
    • Int'l Joint Research
  • [Presentation] 極微細配線の課題解決に向けた金属間化合物の可能性2019

    • Author(s)
      小池淳一、チェン リンハン、横川慎二
    • Organizer
      応用物理学会分科会 シリコンテクノロジー
    • Related Report
      2019 Annual Research Report
    • Invited
  • [Presentation] NiAl as Cu alternative for ultrasmall feature sizes2019

    • Author(s)
      陳凌寒, 小池淳一, 安藤大輔, 須藤祐司
    • Organizer
      電子情報通信学会 シリコン材料・デバイス研究会
    • Related Report
      2019 Annual Research Report
    • Invited
  • [Presentation] Local interconnections and contact metallization for 3 nm node2019

    • Author(s)
      J. Koike, L. Chen, K. Sato, K. Kido, M. Hosseini, D. Ando, Y. Sutou
    • Organizer
      IEEE IITC/MAM 2019
    • Related Report
      2019 Annual Research Report
    • Int'l Joint Research / Invited
  • [Presentation] Low Resistivity NiAl and CuAl2 Thin Films as Copper Alternatives2019

    • Author(s)
      L. Chen, D. Ando, Y. Sutou, J. Koike
    • Organizer
      IEEE IITC/MAM 2019
    • Related Report
      2019 Annual Research Report
    • Int'l Joint Research
  • [Presentation] Intermetallic compounds as possible Cu alternatives2019

    • Author(s)
      J. Koike, L. Chen, D. Ando, Y. Sutou
    • Organizer
      2019 MRS Spring Meeting & Exhibit
    • Related Report
      2019 Annual Research Report
    • Int'l Joint Research / Invited
  • [Presentation] Material innovation for MOL, BEOL, and 3D integration2018

    • Author(s)
      小池淳一
    • Organizer
      International Electron Device Meeting
    • Related Report
      2018 Annual Research Report
    • Int'l Joint Research / Invited
  • [Presentation] New Contact Metallization Scheme for FinFET and beyond2018

    • Author(s)
      小池淳一
    • Organizer
      Electron Device Technology Meeting
    • Related Report
      2018 Annual Research Report
    • Int'l Joint Research / Invited
  • [Presentation] Co-Ti alloy for BEOL and MOL metallization for advanced technology node2018

    • Author(s)
      小池淳一
    • Organizer
      Advanced Metallization Conference Asian Session
    • Related Report
      2018 Annual Research Report
    • Int'l Joint Research / Invited
  • [Presentation] Co alloy for Middle of Line for Fin FET of sub-7 nm2018

    • Author(s)
      小池淳一
    • Organizer
      Semicon China
    • Related Report
      2018 Annual Research Report
    • Int'l Joint Research / Invited
  • [Presentation] サブ10nm FinFETにおける低接触抵抗の 実現に向けたコバルト合金の特性2018

    • Author(s)
      小池淳一
    • Organizer
      電子情報通信学会
    • Related Report
      2018 Annual Research Report
    • Invited
  • [Presentation] Contact Resistivity of Co and Co/ CoTi0.25 on p-Si2018

    • Author(s)
      城戸光一
    • Organizer
      Advanced Metallization Conference Asian Session
    • Related Report
      2018 Annual Research Report
    • Int'l Joint Research
  • [Presentation] Schottky Barrier Height of Co/CoTi contact on n/p-Si2018

    • Author(s)
      佐藤謙
    • Organizer
      Advanced Metallization Conference Asian Session
    • Related Report
      2018 Annual Research Report
    • Int'l Joint Research
  • [Presentation] NiAl as a Potential Material for Liner- and Barrier-Free Interconnect in Ultrasmall Technology Node2018

    • Author(s)
      Linghan Chen
    • Organizer
      Advanced Metallization Conference Asian Session
    • Related Report
      2018 Annual Research Report
    • Int'l Joint Research
  • [Remarks] 東北大学 小池研究室

    • URL

      http://www.koike-lab.jp/

    • Related Report
      2019 Annual Research Report

URL: 

Published: 2018-04-23   Modified: 2022-01-27  

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