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Development of Fully Implantable and Minimally Invasive Flexible Retina Prosthesis for Reconstruction of Wide Field of Vision

Research Project

Project/Area Number 18H04159
Research Category

Grant-in-Aid for Scientific Research (A)

Allocation TypeSingle-year Grants
Section一般
Review Section Medium-sized Section 90:Biomedical engineering and related fields
Research InstitutionTohoku University

Principal Investigator

TANAKA Tetsu  東北大学, 医工学研究科, 教授 (40417382)

Co-Investigator(Kenkyū-buntansha) 福島 誉史  東北大学, 工学研究科, 准教授 (10374969)
木野 久志  東北大学, 学際科学フロンティア研究所, 助教 (10633406)
富田 浩史  岩手大学, 理工学部, 教授 (40302088)
清山 浩司  長崎総合科学大学, 工学研究科, 准教授 (60412722)
菅野 江里子  岩手大学, 理工学部, 准教授 (70375210)
Project Period (FY) 2018-04-01 – 2021-03-31
Project Status Completed (Fiscal Year 2020)
Budget Amount *help
¥43,940,000 (Direct Cost: ¥33,800,000、Indirect Cost: ¥10,140,000)
Fiscal Year 2020: ¥13,650,000 (Direct Cost: ¥10,500,000、Indirect Cost: ¥3,150,000)
Fiscal Year 2019: ¥13,130,000 (Direct Cost: ¥10,100,000、Indirect Cost: ¥3,030,000)
Fiscal Year 2018: ¥17,160,000 (Direct Cost: ¥13,200,000、Indirect Cost: ¥3,960,000)
Keywords人工網膜 / 三次元集積回路 / 医用システム / 生体医工学 / FOWLP / 生体適合性 / 透明電極 / 人工視覚
Outline of Final Research Achievements

We have succeeded in developing a technology for fabricating a fully implantable, minimally invasive, flexible artificial retina that realizes visual reconstruction with a wide viewing angle by high-density integration of multiple 3D stacked artificial retinal chips on the flexible substrate. We have designed, fabricated, and successfully operated a three-dimensional stacked artificial retinal chip with two layers that realize the human retina's several functions, such as photoelectric conversion, visual information processing, and nerve action potential generation. By placing several 3D stacked artificial retinal chips in the central fossa and its periphery, a viewing angle of more than 40 degrees can be achieved, enabling patients to recognize letters and objects with high accuracy and low burden while using their cornea, lens, and eye movements.

Academic Significance and Societal Importance of the Research Achievements

今回開発に成功した技術は、広視野角の視覚再建を可能にするものであり、患者は自身の角膜や水晶体、眼球運動を利用しながら文字や物体を高精度かつ低負担で認識できる。このような人工網膜は世界にも類例がなく、その独自性と創造性は極めて高い。また、電気刺激された神経節細胞の生体反応機構の解析と新しい電気的細胞刺激技術の創出にも役立ち、視覚以外の感覚再生に利用できる可能性もある。本研究は生体の神経システムへ半導体工学を駆使して迫り、その構造と機能の探究を通して生体と機械を「綜合」した新しい医用システムを創製し、かつ半導体神経工学という新たな学術領域の構築を推し進めるものである。

Report

(4 results)
  • 2020 Annual Research Report   Final Research Report ( PDF )
  • 2019 Annual Research Report
  • 2018 Annual Research Report
  • Research Products

    (42 results)

All 2021 2020 2019 2018 Other

All Int'l Joint Research (1 results) Journal Article (5 results) (of which Int'l Joint Research: 1 results,  Peer Reviewed: 5 results,  Open Access: 2 results) Presentation (33 results) (of which Int'l Joint Research: 22 results,  Invited: 3 results) Remarks (3 results)

  • [Int'l Joint Research] National Chiao Tung University(その他の国・地域 台湾)

    • Related Report
      2019 Annual Research Report
  • [Journal Article] Significant Die-Shift Reduction and μLED Integration Based on Die-First Fan-Out Wafer-Level Packaging for Flexible Hybrid Electronics2020

    • Author(s)
      Takafumi Fukushima , Yuki Susumago, Zhengyang Qian, Chidai Shima, Bang Du, Noriyuki Takahashi, Shuta Nagata, Tomo Odashima, Hisashi Kino, and Tetsu Tanaka,
    • Journal Title

      IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY

      Volume: 10 Issue: 8 Pages: 1419-1422

    • DOI

      10.1109/tcpmt.2020.3009640

    • Related Report
      2020 Annual Research Report
    • Peer Reviewed / Open Access
  • [Journal Article] Investigation of TSV Liner Interface with Multiwell Structured TSV to Suppress Noise Propagation in Mixed-Signal 3D-IC2019

    • Author(s)
      Hisashi Kino, Takafumi Fukushima and Tetsu Tanaka
    • Journal Title

      IEEE Journal of the Electron Devices Society

      Volume: 7 Pages: 1225-1231

    • DOI

      10.1109/jeds.2019.2936180

    • Related Report
      2019 Annual Research Report
    • Peer Reviewed / Open Access
  • [Journal Article] Multichip thinning technology with temporary bonding for multichip-to-wafer 3D integration2019

    • Author(s)
      Sungho Lee, Rui Liang, Yuki Miwa, Hisashi Kino, Takafumi Fukushima and Tetsu Tanaka
    • Journal Title

      Japanese Journal of Applied Physics

      Volume: 59 Issue: SB Pages: SBBA04-SBBA04

    • DOI

      10.7567/1347-4065/ab4f3c

    • NAID

      210000157397

    • Related Report
      2019 Annual Research Report
    • Peer Reviewed
  • [Journal Article] Development of Eccentric Spin Coating of Polymer Liner for Low-Temperature TSV Technology With Ultra-Fine Diameter2019

    • Author(s)
      Miao Xiong, Zhiming Chen, Yingtao Ding , Hisashi Kino , Takafumi Fukushima , and Tetsu Tanaka
    • Journal Title

      IEEE TRANSACTIONS DEVICE LETTERS

      Volume: 40 Issue: 1 Pages: 95-98

    • DOI

      10.1109/led.2018.2884452

    • Related Report
      2018 Annual Research Report
    • Peer Reviewed / Int'l Joint Research
  • [Journal Article] High-Thermoresistant Temporary Bonding Technology for Multichip-to-Wafer 3-D Integration With Via-Last TSVs2019

    • Author(s)
      Hideto Hashiguchi , Takafumi Fukushima , Mariappan Murugesan, Hisashi Kino, Tetsu Tanaka, and Mitsumasa Koyanagi
    • Journal Title

      IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY

      Volume: 9 Issue: 1 Pages: 181-188

    • DOI

      10.1109/tcpmt.2018.2871764

    • Related Report
      2018 Annual Research Report
    • Peer Reviewed
  • [Presentation] 3-Color Micro-LED Integration for Flexible Display Based on Die-First Fan-Out Wafer-Level Packaging Technology2021

    • Author(s)
      Zhe Wang, Ikumi Ozawa, Yuki Susumago, Tomo Odashima, Noriyuki Takahashi, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima
    • Organizer
      第68回応用物理学会春季学術講演会
    • Related Report
      2020 Annual Research Report
  • [Presentation] RDL-first Flexible FOWLP Technology with Dielets Embedded in Hydrogel2020

    • Author(s)
      Noriyuki Takahashi, Yuki Susumago, Sungho Lee, Yuki Miwa, Hisashi Kino, Tetsu Tanaka, Takafumi Fukishima
    • Organizer
      2020 IEEE 70th Electronic Components and Technology Conference Virtual Conference
    • Related Report
      2020 Annual Research Report
    • Int'l Joint Research
  • [Presentation] Low-temperature multichip-to-wafer 3D integration based on via-last TSV with OER-TEOS-CVD and microbump bonding without solder extrusion2020

    • Author(s)
      Kousei Kumahara, Rui Liang, Sungho Lee, Yuki Miwa, Mariappan Murugesan, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
    • Organizer
      2020 IEEE 70th Electronic Components and Technology Conference Virtual Conference
    • Related Report
      2020 Annual Research Report
    • Int'l Joint Research
  • [Presentation] 7-μm-thick NCF technology with low-height solder microbump bonding for 3D integration2020

    • Author(s)
      Yuki Miwa, Kousei Kumahara, Sungho Lee, Rui Liang, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
    • Organizer
      2020 IEEE 70th Electronic Components and Technology Conference Virtual Conference
    • Related Report
      2020 Annual Research Report
    • Int'l Joint Research
  • [Presentation] インモールドエレクトロニクス用フレキシブル三次元波状配線の作製2020

    • Author(s)
      永田柊太, 木野久志, 田中徹, 福島誉史
    • Organizer
      第81回応用物理学会秋季学術講演会
    • Related Report
      2020 Annual Research Report
  • [Presentation] Evaluation of the Dopant Effects of ZnO-based Transparent Electrode on Electrochemical Characteristics for Biomedical Applications with Optical Devices2020

    • Author(s)
      Yuki Miwa, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
    • Organizer
      2020 International Conference on Solid State Devices and Materials
    • Related Report
      2020 Annual Research Report
    • Int'l Joint Research
  • [Presentation] Die-Level Cu-CMP Technology in Via-Last TSV Process for Multichip-to-Wafer 3D integration2020

    • Author(s)
      Shuai Liu, Kousei Kumahara, Yuki Miwa , Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
    • Organizer
      2020 International Conference on Solid State Devices and Materials
    • Related Report
      2020 Annual Research Report
    • Int'l Joint Research
  • [Presentation] Mechanical Characterization of FOWLP Based Flexible Hybrid Electronics (FHE) for Biomedical Sensor Application2019

    • Author(s)
      Yuki Susumago, Achille Jacquemond, Noriyuki Takahashi, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima
    • Organizer
      2019 International Conference on Electronics Packaging ICEP 2019
    • Related Report
      2019 Annual Research Report
    • Int'l Joint Research
  • [Presentation] Study of Transparent Electrodes for 3D-Stacked Retinal Prosthesis2019

    • Author(s)
      Michael Proffitt, Tetsu Tanaka, Takafumi Fukushima, Hisashi Kino, Hiroshi Tomita
    • Organizer
      2019 MRS Spring Meeting
    • Related Report
      2019 Annual Research Report
    • Int'l Joint Research
  • [Presentation] Multichip thinning technology with temporary bonding for multichip-to-wafer 3D integration2019

    • Author(s)
      Sungho Lee, Rui Liang, Yuki Miwa, Hisashi Kino, Takafumi Fukushima and Tetsu Tanaka
    • Organizer
      2019 6th International Workshop on Low Temperature Bonding for 3D Integration
    • Related Report
      2019 Annual Research Report
    • Int'l Joint Research
  • [Presentation] Mechanical and Electrical Characterization of FOWLP-Based Flexible Hybrid Electronics (FHE) for Biomedical Sensor Application2019

    • Author(s)
      Yuki Susumago, Qian Zhengyang, Achille Jacquemond, Noriyuki Takahashi, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima
    • Organizer
      The 2019 IEEE 69th Electronic Components and Technology Conference
    • Related Report
      2019 Annual Research Report
    • Int'l Joint Research
  • [Presentation] Room Temperature SiO2 Liner Technology for Multichip-to-Wafer 3D Integration with Via-last TSV2019

    • Author(s)
      Rui Liang, Sungho Lee, Yuki Miwa, Hisashi Kino, Takafumi Fukushima, and Tetsu Tanaka
    • Organizer
      IEEE International Interconnect Technology Conference (IITC 2019)
    • Related Report
      2019 Annual Research Report
    • Int'l Joint Research
  • [Presentation] Annealing Effect on Room-Temperature-Deposited SiO2 Liner for Multichip-to-Wafer 3D Integration Process2019

    • Author(s)
      Rui Liang, Sungho Lee, Yuki Miwa, Kousei Kumahara, Hisashi Kino,Takafumi Fukushima, and Tetsu Tanaka
    • Organizer
      第80回応用物理学会秋季学術講演会
    • Related Report
      2019 Annual Research Report
  • [Presentation] Multichip-to-Wafer三次元集積に向けたマイクロバンプ接合技術2019

    • Author(s)
      熊原 宏征、三輪 侑紀、李 晟豪、梁 ザイ、木野 久志、福島 誉史、田中 徹
    • Organizer
      第80回応用物理学会秋季学術講演会
    • Related Report
      2019 Annual Research Report
  • [Presentation] 高密度電極接続を用いた三次元集積のための低背マイクロバンプ接合評価2019

    • Author(s)
      三輪 侑紀, 李 晟豪, 梁 ザイ, 熊原 宏征, 木野 久志, 福島 誉史, 田中 徹
    • Organizer
      第80回応用物理学会秋季学術講演会
    • Related Report
      2019 Annual Research Report
  • [Presentation] RDL-first FOWLPによるハイドロゲル用いたFHEのためのチップ内蔵技術2019

    • Author(s)
      髙橋則之, 煤孫祐樹, 木野久志, 田中徹, 福島誉史
    • Organizer
      第80回応用物理学会秋季学術講演会
    • Related Report
      2019 Annual Research Report
  • [Presentation] Characterization of Low-Height Solder Microbump Bonding for Fine-Pitch Inter-Chip Connection in 3DICs2019

    • Author(s)
      Yuki Miwa, Sungho Lee, Rui Liang, Kousei Kumahara, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
    • Organizer
      2019 International 3D Systems Integration Conference
    • Related Report
      2019 Annual Research Report
    • Int'l Joint Research
  • [Presentation] Development of 3D-IC Embedded Flexible Hybrid System2019

    • Author(s)
      S. Lee, Y. Susumago, Z. Qian, N. Takahashi, H. Kino, T. Tanaka, and T. Fukushima
    • Organizer
      2019 International 3D Systems Integration Conference
    • Related Report
      2019 Annual Research Report
    • Int'l Joint Research
  • [Presentation] Impacts of Deposition Temperature and Annealing Condition on Ozone-Ethylene Radical Generation-TEOS-CVD SiO2 for Low-Temperature TSV Liner Formation2019

    • Author(s)
      Rui Liang, Sungho Lee, Yuki Miwa, Kousei Kumahara,Murugesan Mariappan, Hisashi Kino, Takafumi Fukushima and Tetsu Tanaka
    • Organizer
      2019 International 3D Systems Integration Conference
    • Related Report
      2019 Annual Research Report
    • Int'l Joint Research
  • [Presentation] Investigation of the Underfill with Negative-Thermal- Expansion Material to Suppress Mechanical Stress in 3D Integration System2019

    • Author(s)
      Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
    • Organizer
      2019 International 3D Systems Integration Conference
    • Related Report
      2019 Annual Research Report
    • Int'l Joint Research
  • [Presentation] Integrated Biomedical Micro/Nano Devices with 3D-IC: Fully Implantable Retinal Prosthesis2019

    • Author(s)
      Tetsu Tanaka
    • Organizer
      Future Chips forum 2019
    • Related Report
      2019 Annual Research Report
    • Int'l Joint Research / Invited
  • [Presentation] Development of underfill with negative-CTE material for high-reliable three-dimensional integrated circuit (3DIC)2019

    • Author(s)
      Hisashi Kino
    • Organizer
      3rd International Symposium on Negative Thermal Expansion and Related Materials (ISNTE-3)
    • Related Report
      2019 Annual Research Report
    • Int'l Joint Research / Invited
  • [Presentation] 多段階励起による発光現象を用いた光遺伝学用神経プローブの作製2019

    • Author(s)
      浦山 翔太、島 智大、張 博文、木野 久志、福島 誉史、田中 徹
    • Organizer
      第66回応用物理学会春季学術講演会
    • Related Report
      2018 Annual Research Report
  • [Presentation] マイクロLED埋め込み型フレキシブルオプト神経プローブの開発2019

    • Author(s)
      島 智大, 煤孫 裕樹, 張 博文, 浦山 翔太, 木野 久志, 福島 誉史, 田中 徹
    • Organizer
      第66回応用物理学会春季学術講演会
    • Related Report
      2018 Annual Research Report
  • [Presentation] Technology Platform Development of Multichip-to-Wafer 3D Integration (2)- SiO2 Liner Technology for Low Temperature TSV Process -2019

    • Author(s)
      Rui Liang, Sungho Lee, Yuki Miwa, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
    • Organizer
      第66回応用物理学会春季学術講演会
    • Related Report
      2018 Annual Research Report
  • [Presentation] Multichip-to-Wafer三次元集積化基盤技術の開発 (1)-テンポラリ接着剤を用いた一括チップ薄化技術-2019

    • Author(s)
      李 晟豪、梁 ザイ、三輪 侑紀、木野 久志、福島 誉史、田中 徹
    • Organizer
      第66回応用物理学会春季学術講演会
    • Related Report
      2018 Annual Research Report
  • [Presentation] Multichip-to-Wafer 三次元集積化基盤技術の開発 (3) ―異種機能集積化に向けたマイクロバンプ接合技術―2019

    • Author(s)
      三輪 侑紀, 李 晟豪, 梁 ザイ, 木野 久志, 福島 誉史, 田中 徹
    • Organizer
      第66回応用物理学会春季学術講演会
    • Related Report
      2018 Annual Research Report
  • [Presentation] Noise Propagation through TSV in Mixed-Signal 3D-IC and Investigation of Liner Interface with Multi-Well Structured TSV2019

    • Author(s)
      Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
    • Organizer
      The 3rd Electron Devices Technology and Manufacturing (EDTM) Conference 2019
    • Related Report
      2018 Annual Research Report
    • Int'l Joint Research
  • [Presentation] TSV Liner Dielectric Technology with Spin-on Low-k Polymer2018

    • Author(s)
      S. Lee, Y. Sugawara, M. Ito, H. Kino, T. Fukushima, T. Tanaka
    • Organizer
      2018 Japan-Taiwan Workshop on Electronic Interconnection Ⅱ
    • Related Report
      2018 Annual Research Report
    • Int'l Joint Research
  • [Presentation] TSV Liner Dielectric Technology with Spin-on Low-k Polymer2018

    • Author(s)
      S. Lee, Y. Sugawara, M. Ito, H. Kino, T. Fukushima, T. Tanaka
    • Organizer
      2018 International Conference on Electronics Packaging and iMAPS All Asia Conference
    • Related Report
      2018 Annual Research Report
    • Int'l Joint Research
  • [Presentation] Charge-Trap-Free Polymer-Liner Through-Silicon Vias for Reliability Improvement of 3D ICs2018

    • Author(s)
      H. Kino, S. Lee, Y. Sugawara, T. Fukushima, T. Tanaka
    • Organizer
      21st IEEE International Interconnect Technology Conference
    • Related Report
      2018 Annual Research Report
    • Int'l Joint Research
  • [Presentation] Capillary Self-Assembly Based Multichip-to-Wafer System Integration Technologies2018

    • Author(s)
      Takafumi Fukushima
    • Organizer
      International Conference on Manipulation, Automation and Robotics at Small Scales
    • Related Report
      2018 Annual Research Report
    • Int'l Joint Research
  • [Presentation] 医療・ヘルスケア用ウェアラブル/インプランタブルLSIの開発2018

    • Author(s)
      田中 徹
    • Organizer
      SEMICON Japan 2018
    • Related Report
      2018 Annual Research Report
    • Int'l Joint Research / Invited
  • [Remarks] 田中(徹)・木野/福島研究室Homepage

    • URL

      http://www.lbc.mech.tohoku.ac.jp/

    • Related Report
      2020 Annual Research Report
  • [Remarks] 田中(徹)・木野/福島研究室

    • URL

      http://www.lbc.mech.tohoku.ac.jp/

    • Related Report
      2019 Annual Research Report
  • [Remarks] 田中(徹)・木野/福島研究室

    • URL

      http://www.lbc.mech.tohoku.ac.jp/

    • Related Report
      2018 Annual Research Report

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Published: 2018-04-23   Modified: 2025-01-30  

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