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Orientation control applicable Cu interconnect on the cutting edge of 3D devices and 3D-LSI

Research Project

Project/Area Number 18K04223
Research Category

Grant-in-Aid for Scientific Research (C)

Allocation TypeMulti-year Fund
Section一般
Review Section Basic Section 21050:Electric and electronic materials-related
Research InstitutionKitami Institute of Technology

Principal Investigator

Takeyama Mayumi B.  北見工業大学, 工学部, 教授 (80236512)

Co-Investigator(Kenkyū-buntansha) 佐藤 勝  北見工業大学, 工学部, 准教授 (10636682)
Project Period (FY) 2018-04-01 – 2021-03-31
Project Status Completed (Fiscal Year 2020)
Budget Amount *help
¥4,420,000 (Direct Cost: ¥3,400,000、Indirect Cost: ¥1,020,000)
Fiscal Year 2020: ¥910,000 (Direct Cost: ¥700,000、Indirect Cost: ¥210,000)
Fiscal Year 2019: ¥1,040,000 (Direct Cost: ¥800,000、Indirect Cost: ¥240,000)
Fiscal Year 2018: ¥2,470,000 (Direct Cost: ¥1,900,000、Indirect Cost: ¥570,000)
Keywords集積回路 / Cu配線 / 配向制御 / 拡散バリヤ / 下地材料 / 信頼性 / 構造解析 / 熱的安定性 / エレクトロマイグレーション / 拡散バリア / LSI / 3次元集積回路 / 3次元デバイス
Outline of Final Research Achievements

We examine a thin TaWN film as a material candidate that satisfies characteristic of both an underlying material for the Cu(111) preferred orientation and thermally stable barrier against Cu diffusion. It became clear that the 5-nm thick TaWN film has excellent barrier properties of sufficiently suppressing the Cu diffusion even after annealing at 700 degree C for 1 h. Simultaneously, the Cu film on the 5-nm-thick TaWN film shows the (111) highly orientation. It was difficult to elucidate this mechanism, but it was clarified by introducing new measurement system. It was revealed that the structure of this barrier is based on the fcc-TaN with a slightly expand lattice and shows the (111) orientation, resulting in the lattice matching with Cu(111). It was found that the TaWN is useful as a material that has two different properties of the barrier material and underlying material for Cu(111) orientation. These results will be useful for future metallization technology.

Academic Significance and Societal Importance of the Research Achievements

これまでエピタキシャルの関係があるCu/Nbなどごく一部の材料のみがCu(111)配向をもたらす下地材料であり、比較的厚い膜が使われてきた。また、下地材料は拡散バリヤ性に乏しく、拡散バリヤとの2層構造をとることが、微細プロセスと相反することになり、Cu(111)配向の実現は困難を極めた。しかし、我々が実現した5nmの拡散バリヤ上でもCu(111)配向制御が可能であるという発見は、これまでにない新規性、独創性に富む有意義な結果である。同時に、将来配線上に形成されるデバイスの性能向上にとっても極めて有用な結果を示すことが期待され、新たな分野を確立できるほどの学術的意義がある。

Report

(2 results)
  • 2020 Annual Research Report   Final Research Report ( PDF )
  • Research Products

    (6 results)

All 2021 2020

All Journal Article (1 results) (of which Peer Reviewed: 1 results) Presentation (5 results) (of which Int'l Joint Research: 2 results,  Invited: 1 results)

  • [Journal Article] Structural analysis of TaWN ternary alloy film applicable to Cu orientation control2021

    • Author(s)
      M. B. Takeyama, M. Yasuda, and M. Sato
    • Journal Title

      J. J. A. P.

      Volume: 60 Issue: SB Pages: SBBC04-SBBC04

    • DOI

      10.35848/1347-4065/abebbd

    • Related Report
      2020 Annual Research Report
    • Peer Reviewed
  • [Presentation] Low temperature deposition of extremely thin barrier for metallization technology2021

    • Author(s)
      M. B. Takeyama
    • Organizer
      MRS2021 Spring Meeting
    • Related Report
      2020 Annual Research Report
    • Int'l Joint Research / Invited
  • [Presentation] Barrier Properties of thin TaWN films in Cu(111)/TaWN/Si systems2020

    • Author(s)
      M. B. Takeyama, M. Sato, and M. Yasuda
    • Organizer
      The 2020 International Conference on Solid StateDevices and Materials (SSDM2020)
    • Related Report
      2020 Annual Research Report
    • Int'l Joint Research
  • [Presentation] Cu(111)高配向制御が可能な極薄TaWNバリヤの構造解析2020

    • Author(s)
      武山真弓,佐藤 勝,安田光伸
    • Organizer
      応用物理学会秋季大会
    • Related Report
      2020 Annual Research Report
  • [Presentation] Cu(111)配向制御のための極薄バリヤの構造評価2020

    • Author(s)
      武山真弓,佐藤 勝,安田光伸
    • Organizer
      電子情報通信学会ソサイエティ大会
    • Related Report
      2020 Annual Research Report
  • [Presentation] 極薄バリヤ上のCu(111)配向メカニズム2020

    • Author(s)
      武山真弓,安田光伸,佐藤勝
    • Organizer
      電子情報通信学会 電子部品材料研究会(CPM)
    • Related Report
      2020 Annual Research Report

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Published: 2018-04-23   Modified: 2022-01-27  

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