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Cuprous complex and via filling electrodeposition

Research Project

Project/Area Number 18K04731
Research Category

Grant-in-Aid for Scientific Research (C)

Allocation TypeMulti-year Fund
Section一般
Review Section Basic Section 26030:Composite materials and interfaces-related
Research InstitutionOsaka Prefecture University

Principal Investigator

Kondo Kazuo  大阪府立大学, 研究推進機構, 客員研究員 (50250478)

Project Period (FY) 2018-04-01 – 2021-03-31
Project Status Completed (Fiscal Year 2020)
Budget Amount *help
¥3,900,000 (Direct Cost: ¥3,000,000、Indirect Cost: ¥900,000)
Fiscal Year 2020: ¥910,000 (Direct Cost: ¥700,000、Indirect Cost: ¥210,000)
Fiscal Year 2019: ¥1,170,000 (Direct Cost: ¥900,000、Indirect Cost: ¥270,000)
Fiscal Year 2018: ¥1,820,000 (Direct Cost: ¥1,400,000、Indirect Cost: ¥420,000)
Keywords銅めっき / モニター / 回転リング-デイスク電極 / 一価銅 / 中間錯体 / CVS / リング電流 / 回転リング-ディスク電極 / CVS / 回転リングーディスク電極 / SPS / 銅ダマシンめっき / 一価銅錯体 / 細孔底 / 促進剤
Outline of Final Research Achievements

By using a rotating disk and a rotating ring-disk electrode, it is possible to monitor the additive concentration of the electrolyte after a long time use. In particular, the cuprous complex is monitored by the ring electrode. By monitoring the additives in the used plating solution containing the 4 additives and adding the insufficinets, it became possible to fill the vias those have not been filled with long time use electrolyte. We also succeeded in monitoring the additive of low thermal expansion coefficient copper plating solution with characteristics different from those of via filling. The electrolyte used for 20 hours has been monitored, and the insufficient of 2M5S additive was monitored and added using the ring electrode of the rotating ring-disk electrode. It has been refreshed by addition and showed almost the same thermal expansion coefficient as that from fresh electrolyte.

Academic Significance and Societal Importance of the Research Achievements

銅は金属のなかで2番目に抵抗が低いため、半導体やその周辺のプリント基板にも配線として多用されている。また電気めっきできるため硫酸銅水溶液から電気めっきする。半導体の配線であるため微細な深い孔を埋める必要がある。この孔を埋めるために用いるのが添加剤である。通常は3種類の高分子と塩素イオンが用いられている。しかしながら長時間電解すると添加剤が分解したり酸化したり電極に取り込まれたりする。そのためこれらの添加剤をモニターして不足分を添加して液を生き返らせる技術が極めて大切である。

Report

(4 results)
  • 2020 Annual Research Report   Final Research Report ( PDF )
  • 2019 Research-status Report
  • 2018 Research-status Report
  • Research Products

    (23 results)

All 2021 2020 2019 2018

All Journal Article (7 results) (of which Peer Reviewed: 2 results) Presentation (16 results) (of which Int'l Joint Research: 4 results)

  • [Journal Article] A Rotating Ring-Disk Study to Monitor the Concentration of 2M5S in Copper Low TEC Electrolyte2021

    • Author(s)
      Anh Van Nhat TRAN, Tetsuji HIRATO, Kazuo KONDO
    • Journal Title

      Journal of The Electrochemical Society

      Volume: Under Review

    • Related Report
      2020 Annual Research Report
    • Peer Reviewed
  • [Journal Article] High TEC Copper to Connect Copper Bond Pads for Low Temperature Wafer Bonding2020

    • Author(s)
      Anh Van Nhat TRAN, Tetsuji HIRATO, Kazuo KONDO
    • Journal Title

      ECS Journal of Solid State Science and Technology

      Volume: 第9巻 第12号 Issue: 12 Pages: 124003-124010

    • DOI

      10.1149/2162-8777/abd14a

    • Related Report
      2020 Annual Research Report
    • Peer Reviewed
  • [Journal Article] Electrochemical Behavior of 2M5S and Its Influence on Reduction of Cu Pumping and Keep-Out Zone2020

    • Author(s)
      V.Q.Dinh, K.Kondo, T.Hirato
    • Journal Title

      J. Electrochem. Soc.

      Volume: 167 Issue: 6 Pages: 062504-062504

    • DOI

      10.1149/1945-7111/ab7d45

    • Related Report
      2019 Research-status Report
  • [Journal Article] Monitoring of SPS Concentraton by the Ring Current Using a Rotating Ring-Disk Electrode with Dissolving Disk Copper to Refresh a Void Free Solution2019

    • Author(s)
      Anh Van Nhat Tran, Ha Van Hoang, Tetsuji Hirato, Kazuo Kondo
    • Journal Title

      Journal of The Electrochemical Society

      Volume: 166 Issue: 14 Pages: D742-D746

    • DOI

      10.1149/2.0841914jes

    • Related Report
      2019 Research-status Report
  • [Journal Article] Bottom-Up TSV Filling Using Sulfonated Diallyl Dimethyl Ammonium Bromide Copolymer as a Leveler2019

    • Author(s)
      V.Q.Dinh, V.H.Hang, K.Kondo, T.Hirato
    • Journal Title

      J. Electrochem. Soc.

      Volume: 166 Issue: 12 Pages: D505-D507

    • DOI

      10.1149/2.1021912jes

    • Related Report
      2019 Research-status Report
  • [Journal Article] A Rotating Ring Disk Study of Accelerators with Cl<sup>-</sup> and Br<sup>-</sup> for Copper Damascene Electrodeposition2018

    • Author(s)
      Anh Van Nhat Tran, Ha Van Hoang,Tetsuji Hirato and Kazuo Kondo
    • Journal Title

      Journal of The Surface Finishing Society of Japan

      Volume: 69 Issue: 8 Pages: 352-355

    • DOI

      10.4139/sfj.69.352

    • NAID

      130007587321

    • ISSN
      0915-1869, 1884-3409
    • Year and Date
      2018-08-01
    • Related Report
      2018 Research-status Report
  • [Journal Article] Thermal Stress of Through Silicon Via with Annealing2018

    • Author(s)
      Dinh Van Quy, K.Kondo, Ha Van Hoang, T.Hirato
    • Journal Title

      ECS J. Solid State Sci. Technol.

      Volume: 7(11) Issue: 11 Pages: 689-692

    • DOI

      10.1149/2.0301811jss

    • Related Report
      2018 Research-status Report
  • [Presentation] High TEC copper to connect copper bond pads for low temperature wafer bonding2020

    • Author(s)
      A. V. N. Tran, K. Kondo and T. Hirato
    • Organizer
      PRiME 2020
    • Related Report
      2020 Annual Research Report
    • Int'l Joint Research
  • [Presentation] Reduction of Copper TSV Pumping2019

    • Author(s)
      Dinh Van Quy, Kazuo Kondo, Tetsuji Hirato
    • Organizer
      IEEE 2019 International 3D Systems Integration Conference, Sendai Japan
    • Related Report
      2019 Research-status Report
  • [Presentation] Sulfonated diallyl dimethyl ammonium bromide copolymer as a leveler for high-speed copper TSV filling2019

    • Author(s)
      Van Quy Dinh, Kazuo Kondo, Tetsuji Hirato
    • Organizer
      The Surface Finishing Society of Japan 21th Kansai Branch Forum
    • Related Report
      2019 Research-status Report
  • [Presentation] Monitoring of SPS concentration by RRDE to refresh a void free solution2019

    • Author(s)
      Anh Van Nhat Tran, Kazuo Kondo, Tetsuji Hirato
    • Organizer
      The Surface Finishing Society of Japan 21th Kansai Branch Forum
    • Related Report
      2019 Research-status Report
  • [Presentation] Monitoring of SPS concentration in copper electroplating bath by cyclic voltammetry stripping using a rotating ring-disk electrode2018

    • Author(s)
      Anh Van Nhat Tran, 近藤和夫、平藤哲司
    • Organizer
      表面技術協会
    • Related Report
      2018 Research-status Report
  • [Presentation] Reduction of stress due to annealing of TSV Copper by the low TCE Copper2018

    • Author(s)
      Dinh Van Quy,近藤和夫、平藤哲司
    • Organizer
      表面技術協会
    • Related Report
      2018 Research-status Report
  • [Presentation] 低線膨張銅めっき2018

    • Author(s)
      近藤和夫
    • Organizer
      化学工学会エレクトロニクス部会シンポ
    • Related Report
      2018 Research-status Report
  • [Presentation] What’s happen to low TCE Copper when annealing2018

    • Author(s)
      Kazuo Kondo
    • Organizer
      ECS Meeting in Cancun
    • Related Report
      2018 Research-status Report
    • Int'l Joint Research
  • [Presentation] Reduction of Stress in Copper TSV Due to Annealing By the Low TEC Copper,2018

    • Author(s)
      Q. Dinh, K. Kondo, and T.Hirato
    • Organizer
      ECS Meeting in Cancun
    • Related Report
      2018 Research-status Report
    • Int'l Joint Research
  • [Presentation] ‘What’s happen to low TCE Copper when annealing’2018

    • Author(s)
      Kazuo Kondo
    • Organizer
      IMPACT Taipei
    • Related Report
      2018 Research-status Report
    • Int'l Joint Research
  • [Presentation] 低線膨張銅めっき2018

    • Author(s)
      近藤和夫
    • Organizer
      サポインEXPO
    • Related Report
      2018 Research-status Report
  • [Presentation] 低線膨張銅めっきが解消する熱応力2018

    • Author(s)
      近藤和夫
    • Organizer
      日本溶接学会はんだシンポ
    • Related Report
      2018 Research-status Report
  • [Presentation] 低線膨張銅めっきが解消する熱応力2018

    • Author(s)
      .近藤和夫
    • Organizer
      日本溶接学会電子デバイス実装研究会
    • Related Report
      2018 Research-status Report
  • [Presentation] 低線膨張銅めっき2018

    • Author(s)
      近藤和夫
    • Organizer
      セミコンジャパン
    • Related Report
      2018 Research-status Report
  • [Presentation] Reduction of TSV thermal stress by low TCE electrolyte2018

    • Author(s)
      Dinh Van Quy、近藤和夫、平藤哲司
    • Organizer
      関西表面技術フォーラム
    • Related Report
      2018 Research-status Report
  • [Presentation] Monitoring of SPS concentration during electrodeposition process by rotating ring-disk electrode-22018

    • Author(s)
      Tran Van Nhat Anh, 近藤和夫、平藤哲司
    • Organizer
      関西表面技術フォーラム
    • Related Report
      2018 Research-status Report

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Published: 2018-04-23   Modified: 2022-01-27  

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