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Formation mechanism of interface between metal and silicon-based materials via decomposition of silver oxide and its application

Research Project

Project/Area Number 18K14028
Research Category

Grant-in-Aid for Early-Career Scientists

Allocation TypeMulti-year Fund
Review Section Basic Section 26050:Material processing and microstructure control-related
Research InstitutionOsaka University

Principal Investigator

Matsuda Tomoki  大阪大学, 工学研究科, 助教 (30756333)

Project Period (FY) 2018-04-01 – 2021-03-31
Project Status Completed (Fiscal Year 2020)
Budget Amount *help
¥4,030,000 (Direct Cost: ¥3,100,000、Indirect Cost: ¥930,000)
Fiscal Year 2020: ¥910,000 (Direct Cost: ¥700,000、Indirect Cost: ¥210,000)
Fiscal Year 2019: ¥2,600,000 (Direct Cost: ¥2,000,000、Indirect Cost: ¥600,000)
Fiscal Year 2018: ¥520,000 (Direct Cost: ¥400,000、Indirect Cost: ¥120,000)
Keywordsナノ焼結 / 分解反応 / 銀生成 / シリコン / 炭化ケイ素 / 界面構造 / 接合 / ナノ粒子 / 銀 / 焼結 / 酸化銀 / ハイブリッド粒子 / 界面・層制御 / シリコン系材料 / 界面制御
Outline of Final Research Achievements

The purpose of this study was to elucidate the formation mechanism for the interface between Si-based materials and silver generated during the decomposition reaction of silver oxide for the realization of surface functionalization process on Si-based materials.
As a result, it was found that the interface formation on Si-based materials was realized by the atomic-scale silver produced during the decomposition reaction of silver oxide. Based on the interface formation mechanism, author newly proposed several interface formation processes based on the decomposition reaction and compositing sintered layer, and realized the interfacial bonding above 200 °C. Additionally, author proposed a new evaluation approach that enables us to evaluate the relationship between the microstructure and properties of the interface and sintered part on a multi-scale by the coupling the nanomechanical testing with nanoscale X-ray computed tomography.

Academic Significance and Societal Importance of the Research Achievements

本研究では,化学的に生じる物質の分解反応とその後の界面構造形成を材料工学的に捉え,従来困難とされてきたシリコン系材料の直接接合を実現するとともに,その界面形成機構の解明に基づいて,界面機能化のための界面制御プロセスの新規提案を行った.界面形成機構において,原子スケール金属の生成が直接接合に寄与することを新規に見出したことは,金属/シリコン系材料だけでなく,他の多様な材料への応用も可能であることを示唆しており,パワーモジュールやフレキシブルデバイス等の多様な応用も考えられ,学術的・社会的意義を有する.また,新提案の評価アプローチはあらゆる界面に応用可能であり,極めて独創的であると考えられる.

Report

(4 results)
  • 2020 Annual Research Report   Final Research Report ( PDF )
  • 2019 Research-status Report
  • 2018 Research-status Report
  • Research Products

    (21 results)

All 2021 2020 2019 2018

All Journal Article (8 results) (of which Peer Reviewed: 8 results,  Open Access: 1 results) Presentation (13 results) (of which Int'l Joint Research: 3 results)

  • [Journal Article] 酸化銀分解反応に基づく金属-シリコン基板間の低温接合プロセスの開発2021

    • Author(s)
      川端 玲、松田 朋己、小椋 智、佐野 智一、廣瀬 明夫
    • Journal Title

      第27回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム (Mate2021) 論文集

      Volume: 27 Pages: 221-226

    • Related Report
      2020 Annual Research Report
    • Peer Reviewed
  • [Journal Article] Ag/Cu複合焼結層に及ぼす熱時効の影響2021

    • Author(s)
      山田 晴悟、松田 朋己、小椋 智、佐野 智一、廣瀬 明夫
    • Journal Title

      第27回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム (Mate2021) 論文集

      Volume: 27 Pages: 215-220

    • Related Report
      2020 Annual Research Report
    • Peer Reviewed
  • [Journal Article] Lowering bonding temperature for silver sintering to silicon and silicon carbide using silver oxide decomposition2020

    • Author(s)
      Inami Kota、Matsuda Tomoki、Kawabata Rei、Sano Tomokazu、Hirose Akio
    • Journal Title

      Journal of Materials Science: Materials in Electronics

      Volume: 31 Issue: 19 Pages: 16511-16518

    • DOI

      10.1007/s10854-020-04205-w

    • Related Report
      2020 Annual Research Report
    • Peer Reviewed
  • [Journal Article] Thermal stability and characteristic properties of pressureless sintered Ag layers formed with Ag nanoparticles for power device applications2020

    • Author(s)
      Watanabe Tomofumi、Takesue Masafumi、Matsuda Tomoki、Sano Tomokazu、Hirose Akio
    • Journal Title

      Journal of Materials Science: Materials in Electronics

      Volume: 31 Issue: 20 Pages: 17173-17182

    • DOI

      10.1007/s10854-020-04265-y

    • Related Report
      2020 Annual Research Report
    • Peer Reviewed
  • [Journal Article] Formation Process of the Interface in the Ag/Si Joints by the Decomposition Reaction of Ag2O2019

    • Author(s)
      MATSUDA Tomoki、INAMI Kota、MOTOYAMA Keita、SANO Tomokazu、HIROSE Akio
    • Journal Title

      Journal of Smart Processing

      Volume: 8 Issue: 5 Pages: 177-183

    • DOI

      10.7791/jspmee.8.177

    • NAID

      130007719755

    • ISSN
      2186-702X, 2187-1337
    • Related Report
      2019 Research-status Report
    • Peer Reviewed
  • [Journal Article] 酸化銀分解反応によるシリコン系材料の直接接合とその接合機構2019

    • Author(s)
      松田 朋己、伊波 康太、本山 啓太、佐野 智一、廣瀬 明夫
    • Journal Title

      第25回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム (Mate2019) 論文集

      Volume: 25 Pages: 353-358

    • Related Report
      2018 Research-status Report
    • Peer Reviewed
  • [Journal Article] Silver oxide decomposition mediated direct bonding of silicon-based materials2018

    • Author(s)
      Matsuda Tomoki、Inami Kota、Motoyama Keita、Sano Tomokazu、Hirose Akio
    • Journal Title

      Scientific Reports

      Volume: 8 Issue: 1 Pages: 1-10

    • DOI

      10.1038/s41598-018-28788-x

    • Related Report
      2018 Research-status Report
    • Peer Reviewed / Open Access
  • [Journal Article] AlN-to-Metal Direct Bonding Process Utilizing Sintering of Ag Nanoparticles Derived from the Reduction of Ag2O2018

    • Author(s)
      Motoyama Keita、Matsuda Tomoki、Sano Tomokazu、Hirose Akio
    • Journal Title

      Journal of Electronic Materials

      Volume: 47 Issue: 10 Pages: 5780-5787

    • DOI

      10.1007/s11664-018-6504-2

    • Related Report
      2018 Research-status Report
    • Peer Reviewed
  • [Presentation] 酸化銀分解反応に基づく金属-シリコン基板間の低温接合プロセスの開発2021

    • Author(s)
      川端 玲、松田 朋己、小椋 智、佐野 智一、廣瀬 明夫
    • Organizer
      第27回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム (Mate2021)
    • Related Report
      2020 Annual Research Report
  • [Presentation] Ag/Cu複合焼結層に及ぼす熱時効の影響2021

    • Author(s)
      山田 晴悟、松田 朋己、小椋 智、佐野 智一、廣瀬 明夫
    • Organizer
      第27回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム (Mate2021)
    • Related Report
      2020 Annual Research Report
  • [Presentation] 高温放置試験におけるAg/Cu 複合層の焼結挙動に及ぼす金属基板の影響2020

    • Author(s)
      山田 晴悟、松田 朋己、小椋 智、佐野 智一、廣瀬 明夫
    • Organizer
      溶接学会 2020年度秋季全国大会
    • Related Report
      2020 Annual Research Report
  • [Presentation] 酸化銀還元反応を用いた銀-シリコン基板接合プロセスの低温化2020

    • Author(s)
      川端玲、松田朋己、佐野智一、廣瀬明夫
    • Organizer
      第30回マイクロエレクトロニクスシンポジウム(MES2020)秋季大会
    • Related Report
      2020 Annual Research Report
  • [Presentation] Formation process of interfacial structure in Ag/Si joint during Ag2O decomposition2020

    • Author(s)
      Matsuda Tomoki、Inami Kota、Motoyama Keita、Sano Tomokazu、Hirose Akio
    • Organizer
      The 73rd IIW Annual Assembly and International Conference
    • Related Report
      2020 Annual Research Report
    • Int'l Joint Research
  • [Presentation] Silicon-silver direct joining process using in-situ generation of silver nanoparticles derived from the decomposition of silver oxide microparticles2019

    • Author(s)
      Tomoki Matsuda, Kota Inami, Keita Motoyama, Tomokazu Sano, Akio Hirose
    • Organizer
      European Congress and Exhibition on Advanced Materials and Process (EUROMAT) 2019
    • Related Report
      2019 Research-status Report
    • Int'l Joint Research
  • [Presentation] Low-temperature metal-to-silicon joining using silver oxide decomposition without the metallized layer of substrate2019

    • Author(s)
      Tomoki Matsuda, Kota Inami, Tomokazu Sano, Akio Hirose
    • Organizer
      The 72nd IIW Annual Assembly and International Conference
    • Related Report
      2019 Research-status Report
    • Int'l Joint Research
  • [Presentation] 酸化銀還元反応を利用した金属‐窒化ケイ素基板の接合2019

    • Author(s)
      川端玲、松田朋己、佐野智一、廣瀬明夫
    • Organizer
      溶接学会 2019年度秋季全国大会
    • Related Report
      2019 Research-status Report
  • [Presentation] 酸化銅還元反応を利用した焼結接合法における酸化銅形態が接合性に及ぼす影響2019

    • Author(s)
      五十嵐友也、松田朋己、佐野智一、廣瀬明夫
    • Organizer
      溶接学会 2019年度秋季全国大会
    • Related Report
      2019 Research-status Report
  • [Presentation] 酸化銀還元焼結による-シリコン基板直接合2019

    • Author(s)
      松田朋己、伊波康太、佐野智一、廣瀬明夫
    • Organizer
      第29回マイクロエレクトロニクスシンポジウム 秋季大会 (MES2019)
    • Related Report
      2019 Research-status Report
  • [Presentation] 酸化銀分解反応によるシリコン系材料の直接接合とその接合機構2019

    • Author(s)
      松田 朋己、伊波 康太、本山 啓太、佐野 智一、廣瀬 明夫
    • Organizer
      第25回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム (Mate2019)
    • Related Report
      2018 Research-status Report
  • [Presentation] SiC direct joining using silver oxide decomposition2018

    • Author(s)
      Tomoki Matsuda, Keita Motoyama, Kota Inami, Tomokazu Sano, Akio Hirose
    • Organizer
      4th International Conference on Nanojoining and Microjoining 2018 (NMJ2018)
    • Related Report
      2018 Research-status Report
  • [Presentation] Silver Oxide Decomposition Assisted Direct Bonding of Silicon Carbide2018

    • Author(s)
      Tomoki Matsuda, Keita Motoyama, Tomokazu Sano, Akio Hirose
    • Organizer
      Materials Science & Technology 2018 (MS&T18)
    • Related Report
      2018 Research-status Report

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Published: 2018-04-23   Modified: 2022-01-27  

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