| Budget Amount *help |
¥39,000,000 (Direct Cost: ¥30,000,000、Indirect Cost: ¥9,000,000)
Fiscal Year 2009: ¥5,460,000 (Direct Cost: ¥4,200,000、Indirect Cost: ¥1,260,000)
Fiscal Year 2008: ¥10,920,000 (Direct Cost: ¥8,400,000、Indirect Cost: ¥2,520,000)
Fiscal Year 2007: ¥22,620,000 (Direct Cost: ¥17,400,000、Indirect Cost: ¥5,220,000)
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| Research Abstract |
In this study, we investigated the fundamental principles of the flow, cohesion, and coalescence of the molten filler metals in the resin in the newly proposed self-organization assembly process. In particular, we found that the surface energy change due to degradation of the surface oxide film is the driving force of the molten filler metal flow. We also found that degradation of oxide film on the filler metals and viscosity change of the resin are major influence for the assembly property of the self-organization assembly process. In addition, guidelines of material design or process design for terminal connection on the thousands of electrodes on IC chip has been given.
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