PRECISION MICROPROCESSING OF PERMEABLE HARD BRITTLE MATERIAL BY NANOSECOND- OR CW-LASER AND ITS INTELLECTUALIZATION

• Project/Area Number: 19360065
• Research Category: Grant-in-Aid for Scientific Research (B)
• Allocation Type: Single-year Grants
• Section: 一般
• Research Field: Production engineering/Processing studies
• Research Institution: Osaka University
• Principal Investigator: OHMURA Etsuji Osaka University, 工学研究科, 教授 (90144435)
• Co-Investigator(Kenkyū-buntansha): NAKANO Notohiro 大阪大学, 工学研究科, 准教授 (40164256)
• Project Period (FY): 2007 – 2010
• Project Status: Completed (Fiscal Year 2010)
• Budget Amount: ¥20,020,000 (Direct Cost: ¥15,400,000、Indirect Cost: ¥4,620,000); Fiscal Year 2010: ¥2,080,000 (Direct Cost: ¥1,600,000、Indirect Cost: ¥480,000); Fiscal Year 2009: ¥2,340,000 (Direct Cost: ¥1,800,000、Indirect Cost: ¥540,000); Fiscal Year 2008: ¥2,340,000 (Direct Cost: ¥1,800,000、Indirect Cost: ¥540,000); Fiscal Year 2007: ¥13,260,000 (Direct Cost: ¥10,200,000、Indirect Cost: ¥3,060,000)
• Keywords: レーザ加工 / 硬脆材料 / レーザスクライブ / レーザ内部加工 / 吸収係数 / 亀裂 / 自己集束 / 熱伝導解析 / 熱応力解析

Research Abstract

The precision microprocessing of a hard and brittle materials such as a dielectric or a semiconductor was tried by focusing a permeable nanosecond pulse or CW laser beam in the material surface or the inside. The following matters about elucidation of the processing mechanism and investigation and control of parameters about processing quality were examined from the scientific situation : (1) The measurement of the temperature dependency of the absorption coefficient. (2) Surface or inside processings of permeable materials, and their processing quality assessment. (3) The analysis of a temperature history and a thermal shock phenomenon by the heat transfer analysis and the thermo-elastic-plastic analysis. (4) Fracture mechanics analysis

Research Products

• [Journal Article] Analysis of Intrnal Crack Propagation in Silicon Due to Permeable Laser Irradiation-Study on Processing Mechanism of Stealth Dicing (2011)
  • Author(s): Etsuji Ohmura, Yuta Kawahito, Kenshi Fukumitsu, Junji Okuma, Hideki Morita
  • Journal Title: Journal of Material Science and Engineering Vol.5(掲載予定)
  • Peer Reviewed
• [Journal Article] Analysis of Internal Crack Propagation in Silicon Due to Permeable Laser Irradiation-Study on Processing Mechanism of Stealth Dicing (2011)
  • Author(s): E.Ohmura, Y.Kawahito, K.Fukumitsu, J.Okuma, H.Morita
  • Journal Title: Journal of Material Science and Engineering Volume: 5(掲載予定)
  • Peer Reviewed
• [Journal Article] Crack Propagation Analysis in Laser Scribing of Glass (2010)
  • Author(s): Keisuke Yahata, Koji Yamamoto, Etsuji Ohmura
  • Journal Title: Journal of Laser Micro/Nanoengineering Vol.5 Pages: 109-114
  • Peer Reviewed
• [Journal Article] Thermal Stress Analysis on Laser Cross Scribe of Glass (2010)
  • Author(s): 山本幸司, 羽阪登, 森田英毅, 大村悦二
  • Journal Title: Journal of Laser Applications Vol.22, No.1 Pages: 29-36
  • NAID: 110006946127
  • Peer Reviewed
• [Journal Article] ステルスダイシングにおける応力拡大係数を用いた亀裂進展解析 (2010)
  • Author(s): 大村悦二、小川健輔、熊谷正芳、中野誠、福満憲志、森田英毅
  • Journal Title: 日本機械学会論文集, A編 Vol.76, No.764 Pages: 446-448
  • Peer Reviewed
• [Journal Article] Influence of thermal expansion coeffecient in laser scribing of glass (2010)
  • Author(s): 山本幸司, 羽阪登, 森田英毅, 大村悦二
  • Journal Title: Precision Engineering Vol.34 Pages: 70-75
  • Peer Reviewed
• [Journal Article] Laser Processing Mechanism of Monocrystalline Diamond (2010)
  • Author(s): Etsuji Ohmura, Katsuko Harano, Kenichi Watatani, Keiji Ebata
  • Journal Title: Proceedings of the 14th International Conference on Mechatronics Technology (ICMT 2010), 2010, Suita, Osaka Pages: 82-87
  • Peer Reviewed
• [Journal Article] ステルスダイシングにおける応力拡大係数を用いた亀裂進展解析 (2010)
  • Author(s): 大村悦二、小川健輔、熊谷正芳、中野誠、福満憲志、森田英毅
  • Journal Title: 日本機械学会論文集, A編 Volume: 76 Pages: 446-448
  • Peer Reviewed
• [Journal Article] Thermal Stress Analysis on Laser Cross Scribe of Glass (2010)
  • Author(s): K.Yamamoto, N.Hasaka, H.Morita, E.Ohmura
  • Journal Title: Journal of Laser Applications Volume: 22 Pages: 29-36
  • NAID: 110006946127
  • Peer Reviewed
• [Journal Article] Crack Propagation Analysis in Laser Scribing of Glass (2010)
  • Author(s): K.Yahata, K.Yamamoto, E.Ohmura
  • Journal Title: Journal of Laser Micro/Nanoengineering Volume: 5 Pages: 109-114
  • Peer Reviewed
• [Journal Article] Study of Laser Processing Mechanism of Single Crystal Diamond (2010)
  • Author(s): E.Ohmura, K.Harano, K.Watatani, K.Ebata
  • Journal Title: Proceedings of the 14th International Conference on Mechatronics Technology (ICMT 2010) Volume: (CD-ROM) Pages: 82-87
  • Peer Reviewed
• [Journal Article] Laser Processing Mechanism of Monocrystalline Diamond (2010)
  • Author(s): E.Ohmura, K.Harano, K.Watatani, K.Ebata
  • Journal Title: Proceedings of International Conference on Inovative Technology (IN-TECH 2010) Pages: 203-208
• [Journal Article] Crack Propagation Analysis in Laser Scribing of Glass (2010)
  • Author(s): Keisuke Yahata, Koji Yamamoto, Etsuji Ohmura
  • Journal Title: Journal of Laser Micro/Nanoengineering Vol. 5(掲載予定)
  • Peer Reviewed
• [Journal Article] Thermal Stress Analysis on Laser Cross Scribe of Glass (2010)
  • Author(s): Koji Yamamoto, Noboru Hasaka, Hideki Morita, Etsuji Ohmura
  • Journal Title: Journal of Laser Applications Vol. 22, No. 1 Pages: 29-36
  • NAID: 110006946127
  • Peer Reviewed
• [Journal Article] ステルスダイシングにおける応力拡大係数を用いた亀裂進展解析 (2010)
  • Author(s): 大村悦二, 小川健輔, 熊谷正芳, 中野誠, 福満憲志, 森田英毅
  • Journal Title: 日本機械学会論文集, A 編 Vol. 76, No. 764 Pages: 446-448
  • Peer Reviewed
• [Journal Article] Influence of thermal expansion coeffecient in laser scribing of glass (2010)
  • Author(s): Koji Yamamoto, Noboru Hasaka, Hideki Morita, Etsuji Ohmura
  • Journal Title: Precision Engineering Vol. 34 Pages: 70-75
  • Peer Reviewed
• [Journal Article] Influence of glass substrate thickness in laser scribing of glass (2010)
  • Author(s): Koji Yamamoto, Noboru Hasaka, Hideki Morita, Etsuji Ohmura
  • Journal Title: Precision Engineering Vol. 34 Pages: 55-61
  • NAID: 10029042256
  • Peer Reviewed
• [Journal Article] ステルスダイシングにおける応力拡大係数を用いた亀裂進展解析 (2010)
  • Author(s): 大村悦二・小川健輔・熊谷正芳・中野誠・福満憲志・森田英毅
  • Journal Title: 日本機械学会論文集,A編 76(掲載決定)
  • Peer Reviewed
• [Journal Article] Thermal Stress Analysis on Laser Cross Scribe of Glass (2010)
  • Author(s): K.Yamamoto, N.Hasaka, H.Morita, E.Ohmura
  • Journal Title: Journal of Laser Applications 22(掲載決定)
  • NAID: 110006946127
  • Peer Reviewed
• [Journal Article] Crack Propagation Analysis in Laser Scribing of Glass (2010)
  • Author(s): K.Yahata, K.Yamamoto, E.Ohmura
  • Journal Title: Journal of Laser Micro/Nanoengineering, 5(掲載決定)
  • Peer Reviewed
• [Journal Article] ガラスのレーザスクライブにおける亀裂進展解析 (2009)
  • Author(s): 八幡恵輔、山本幸司、大村悦二
  • Journal Title: 日本機械学会論文集, C編 Vol.75, No.759 Pages: 3339-3346
  • Peer Reviewed
• [Journal Article] Crack Propagation in Glass by Laser Irradiation along Laser Scribed Line (2009)
  • Author(s): 山本幸司, 羽阪登, 森田英毅, 大村悦二
  • Journal Title: Journal of Manufacturing Science and Engineering, Transaction of the ASME Vol.131 Pages: 51002-51002
  • Peer Reviewed
• [Journal Article] Partial Growth of Crack in Laser Scribing of Glass (2009)
  • Author(s): 山本幸司, 羽阪登, 森田英毅, 大村悦二
  • Journal Title: Journal of Laser Applications Vol.21, No.2 Pages: 67-75
  • NAID: 130007890950
  • Peer Reviewed
• [Journal Article] Crack Propagation in Glass by Laser Irradiation along Laser Scribed Line (2009)
  • Author(s): Koji Yamamoto, Noboru Hasaka, Hideki Morita, Etsuji Ohmura
  • Journal Title: Journal of Manufacturing Science and Engineering, Transaction of the ASME Vol. 131 Pages: 51002-51002
  • Peer Reviewed
• [Journal Article] Partial Growth of Crack in Laser Scribing of Glass (2009)
  • Author(s): Koji Yamamoto, Noboru Hasaka, Hideki Morita, Etsuji Ohmura
  • Journal Title: Journal of Laser Applications Vol. 21, No. 2 Pages: 67-75
  • NAID: 130007890950
  • Peer Reviewed
• [Journal Article] Partial Growth of Crack in Laser Scribing of Glass (2009)
  • Author(s): K.Yamamoto, N.Hasaka, H.Morita, E.Ohmura
  • Journal Title: Journal of Laser Applications 21 Pages: 67-75
  • NAID: 130007890950
  • Peer Reviewed
• [Journal Article] Influence of glass substrate thickness in laser scribing of glass (2009)
  • Author(s): K.Yamamoto, N.Hasaka, H.M orita, E.Ohmura
  • Journal Title: Precision Engineering 34 Pages: 55-61
  • NAID: 10029042256
  • Peer Reviewed
• [Journal Article] Influence of thermal expansion coeffecient in laser scribing of glass (2009)
  • Author(s): K.Yamamoto, N.Hasaka, H.Morita, E.Ohmura
  • Journal Title: Precision Engineering 34 Pages: 70-75
  • Peer Reviewed
• [Journal Article] Crack Propagation in Glass by Laser Irradiation along Laser Scribed Li ne (2009)
  • Author(s): K.Yamamoto, N.Hasaka, H.Morita, E.Ohmura
  • Journal Title: Journal of Manufacturing Science and Engineerin g, Transaction of the ASME 131 Pages: 70-75
  • Peer Reviewed
• [Journal Article] ガラスのレーザスクライブにおける亀裂進展解析 (2009)
  • Author(s): 八幡恵輔・山本幸司・大村悦二
  • Journal Title: 日本機械学会論文集,C編 75 Pages: 3339-3346
  • Peer Reviewed
• [Journal Article] Laser Drilling Simulation Considering Multiple Reflection of Laser, Eva poration and Melt flow (2009)
  • Author(s): E.Ohmura, S.Noguchi
  • Journal Title: Proceedings of 3rd International Conference on A dvanced Computational Engineering and Experim enting (ACE-X 2009) (CD-ROM)
• [Journal Article] Analysis of Crack Propagation in Stealth Dicing Using Stress Intensity Factor (2009)
  • Author(s): E.Ohmura, K.Ogawa, M.Kumagai, M.Nakano, K.Fukumitsu, H.Morita
  • Journal Title: On-line Proceedings of the 5th International Cong ress on Laser Advanced Materials Processing (LA MP2009)
• [Journal Article] 熱応力解析に基づくガラスのレーザスクライブ機構の解明と亀裂進展条件の推定 (2009)
  • Author(s): 山本幸司・羽阪登・森田英毅・大村悦二
  • Journal Title: レーザ加工学会誌 16 Pages: 44-51
• [Journal Article] Thermal Stress Analysis on Laser Scribing of Glass (2008)
  • Author(s): 山本幸司, 羽阪登, 森田英毅, 大村悦二
  • Journal Title: Journal of Laser Applications Vol.20, No.4 Pages: 193-200
  • NAID: 110001794645
  • Peer Reviewed
• [Journal Article] レーザ重ね照射によるガラスのレーザスクライブ亀裂の伸長 (2008)
  • Author(s): 山本幸司、羽阪登、森田英毅、大村悦二
  • Journal Title: 精密工学会誌 Vol.74, No.11 Pages: 1182-1187
  • Peer Reviewed
• [Journal Article] ガラスのレーザスクライブにおける板厚の影響 (2008)
  • Author(s): 山本幸司, 羽阪登, 森田英毅、大村悦二
  • Journal Title: レーザ加工学会誌 Vol.15, No.4 Pages: 276-281
  • Peer Reviewed
• [Journal Article] ガラスのレーザスクライブにおける線膨張係数の影響 (2008)
  • Author(s): 山本幸司, 羽阪登, 森田英毅、大村悦二
  • Journal Title: レーザ加工学会誌 (レーザ加工学会誌ベストオーサー賞受賞論文) Vol.15, No.4 Pages: 269-275
  • Peer Reviewed
• [Journal Article] ガラスのレーザクロススクライブにおける熱応力解析 (2008)
  • Author(s): 山本幸司、羽阪登、森田英毅、大村悦二
  • Journal Title: 精密工学会誌 (精密工学会高城賞受賞論文) Vol.74, No.9 Pages: 937-943
  • NAID: 130005028211
  • Peer Reviewed
• [Journal Article] Analysis of Processing Mechanism in Stealth Dicing of Ultra Thin Silicon Wafer (2008)
  • Author(s): Etsuji Ohmura, Masayoshi Kumagai, Makoto Nakano, Koji Kuno, Kenshi Fukumitsu, Hideki Morita
  • Journal Title: Journal of Advanced Mechanical Design, Systems, and Manufacturing Vol.2, No.4 Pages: 540-549
  • NAID: 130000080854
  • Peer Reviewed
• [Journal Article] 透過性パルスレーザによる極薄シリコンウェハの内部改質 (2008)
  • Author(s): 大村悦二、熊谷正芳、福満憲志、中野誠、内山直己、森田英毅
  • Journal Title: 精密工学会誌 Vol.74, No.3 Pages: 275-281
  • NAID: 110006647632
  • Peer Reviewed
• [Journal Article] ナノ秒レーザによる単結晶シリコンの内部改質層形成機構の解析 (2008)
  • Author(s): 大村悦二、福満憲志、熊谷正芳、森田英毅
  • Journal Title: 日本機械学会論文集, C編 Vol.74, No.738 Pages: 446-452
  • NAID: 110006623684
  • Peer Reviewed
• [Journal Article] Thermal Stress Analysis on Laser Scribing of Glass (2008)
  • Author(s): Koji Yamamoto, Noboru Hasaka, Hideki Morita, Etsuji Ohmura
  • Journal Title: Journal of Laser Applications Vol. 20, No. 4 Pages: 193-200
  • NAID: 110001794645
  • Peer Reviewed
• [Journal Article] Three-Dimensional Thermal Stress Analysis on Laser Scribing of Glass (2008)
  • Author(s): Koji Yamamoto, Noboru Hasaka, Hideki Morita, Etsuji Ohmura
  • Journal Title: Precision Engineering Vol. 32, No. 4 Pages: 301-308
  • NAID: 10029040607
  • Peer Reviewed
• [Journal Article] ガラスのレーザスクライブにおける線膨張係数の影響 (2008)
  • Author(s): 山本幸司, 羽阪登, 森田英毅, 大村悦二
  • Journal Title: レーザ加工学会誌 Vol. 15, No. 4 Pages: 269-275
  • Peer Reviewed
• [Journal Article] ガラスのレーザクロススクライブにおける熱応力解析 (2008)
  • Author(s): 山本幸司, 羽阪登, 森田英毅, 大村悦二
  • Journal Title: 精密工学会誌 Vol. 74, No. 9 Pages: 937-943
  • NAID: 130005028211
  • Peer Reviewed
• [Journal Article] Analysis of Processing Mechanism in Stealth Dicing of Ultra Thin Silicon Wafer (2008)
  • Author(s): Etsuji Ohmura, Masayoshi Kumagai, Makoto Nakano, Koji Kuno, Kenshi Fukumitsu, Hideki Morita
  • Journal Title: Journal of Advanced Mechanical Design, Systems, and Manufacturing Vol. 2, No. 4 Pages: 540-549
  • NAID: 130000080854
  • Peer Reviewed
• [Journal Article] Analysis of Processing Mechanism in stealth Dicing of Ultra Thin Silicon Wafer (2008)
  • Author(s): E. Ohmura, M. Kumagai, M. Nakano, K. Kuno, K. Fukumitsu, H. Morita
  • Journal Title: Journal of Advanced Me-chanical Design, Systems, and Manufacturing 2 Pages: 540-549
  • NAID: 130000080854
  • Peer Reviewed
• [Journal Article] ガラスのレーザクロススクライブにおける熱応力解析 (2008)
  • Author(s): 山本幸司, 羽阪 登, 森田英毅, 大村悦二
  • Journal Title: 精密工学会誌 74 Pages: 937-943
  • NAID: 130005028211
  • Peer Reviewed
• [Journal Article] ガラスのレーザスクライブにおける線膨張係数の影響 (2008)
  • Author(s): 山本幸司, 羽阪 登, 森田英毅, 大村悦二
  • Journal Title: レーザ加工学会誌 15 Pages: 270-276
  • Peer Reviewed
• [Journal Article] ガラスのレーザスクライブにおける板厚の影響 (2008)
  • Author(s): 山本幸司, 羽阪 登, 森田英毅, 大村悦二
  • Journal Title: レーザ加工学会誌 15 Pages: 277-282
  • Peer Reviewed
• [Journal Article] Three-Dimensional Thermal stress Analysis on Laser Scribing Of Glass (2008)
  • Author(s): K. Yamamoto, N. Hasaka, H. Morita, E. Ohmura
  • Journal Title: Precision Engineering 32 Pages: 301-308
  • NAID: 10029040607
  • Peer Reviewed
• [Journal Article] レーザ重ね照射によるガラスのレーザスクライブ亀裂の伸長 (2008)
  • Author(s): 山本幸司, 羽阪 登, 森田英毅, 大村悦二
  • Journal Title: 精密工学会誌 74 Pages: 1182-1187
  • Peer Reviewed
• [Journal Article] Thermal stress Analysis on Laser Scribing of Glass (2008)
  • Author(s): K. YaBamolo, N. Hasaka, H. Morita, E. Ohmura
  • Journal Title: Journal of Laser Applications 20 Pages: 193-200
  • NAID: 110001794645
  • Peer Reviewed
• [Journal Article] Innovative Laser Technology for Semiconductor Manufacturing - Stealth Dicing (2008)
  • Author(s): E. Ohmura, M. Kumagai, H. Morita
  • Journal Title: Proceedings of the 3rd Pacific International Conference on Application of Lasers and Optics 2008 (PICALO2008) Pages: 679-684
• [Journal Article] Influence of Thickness in Laser Scribing of Glass and Crack Propagation by Laser lrradiation along Laser Scribed Line (2008)
  • Author(s): K. Yamamoto, N. Hasaka, H. Morita, E. Ohmura
  • Journal Title: On-line Proceedings of the 9th International Symposium on Laser Precision Microfabrication (LPM2008)
• [Journal Article] Partial Growth of Crack and Cross Scribe in Laser Scribing of Glass (2008)
  • Author(s): K. Yamamolo, N. Hasaka, H. Morila, E. Ohmura
  • Journal Title: On-line Proceedings of the 9th International Symposium on Laser Precision Microfabrication (LPM2008)
• [Journal Article] ナノ秒レーザによる単結晶シリコンの内部改質層形成機構の解析 (2008)
  • Author(s): 大村悦二・福満憲志・熊谷正芳・森田英毅
  • Journal Title: 日本機械学会論文集, C編 74 Pages: 446-452
  • NAID: 110006623684
  • Peer Reviewed
• [Journal Article] 透過性パルスレーザによる極薄シリコンウェハの内部改質 (2008)
  • Author(s): 大村悦二・熊谷正芳・福満憲志・中野 誠・内山直己・森田英毅
  • Journal Title: 精密工学会誌 74(印刷中)
  • NAID: 110006647632
  • Peer Reviewed
• [Journal Article] Three-Dimensional Thermal Stress Analysis on Laser Scribing of Glass (2008)
  • Author(s): K. Yamamoto, N. Hasaka, H. Morita, E. Ohmura
  • Journal Title: Precision Engineering 32(in press)
  • NAID: 10029040607
  • Peer Reviewed
• [Journal Article] Advanced dicing technology for semiconductor wafer-Stealth Dicing- (2007)
  • Author(s): M. Kumagai, N. Uchiyama, E. Ohmura, R. Sugiura, K. Atsumi, K. Fukumitsu
  • Journal Title: IEEE Transactions on Semiconductor Manufacturing Vol.20, No.3 Pages: 259-265
  • Peer Reviewed
• [Journal Article] ガラスのレーザスクライブにおける亀裂の局所進展 (2007)
  • Author(s): 山本幸司、羽阪登、森田英毅、大村悦二
  • Journal Title: 精密工学会誌 Vol.73, No.8 Pages: 917-923
  • NAID: 110006368883
  • Peer Reviewed
• [Journal Article] 単結晶シリコンの吸収係数温度依存性測定 (2007)
  • Author(s): 福世文嗣、大村悦二、福満憲志、森田英毅
  • Journal Title: レーザ加工学会誌 Vol.14, No.1 Pages: 22-26
  • NAID: 40015340879
  • Peer Reviewed
• [Journal Article] Partial Growth of Crack in Laser Scribing of Glass (2007)
  • Author(s): 山本幸司, 羽阪登, 森田英毅, 大村悦二
  • Journal Title: Proceedings of the International Conference on Leading Edge Manufacturing in 21st Century (LEM21), 2007, Fukuoka Japan Pages: 873-878
  • NAID: 130007890950
  • Peer Reviewed
• [Journal Article] Analysis of Processing Mechanism in Stealth Dicing of Ultra Thin Silicon Wafer (2007)
  • Author(s): Etsuji Ohmura, Masayoshi Kumagai, Makoto Nakano, Koji Kuno, Kenshi Fukumitsu, Hideki Morita
  • Journal Title: Proc. the International Conference on Leading Edge Manufacturing in 21st Century, 2007, Fukuoka Japan(LEM21 The Best Paper Award受賞論文) Pages: 861-866
  • NAID: 130000080854
  • Peer Reviewed
• [Journal Article] Advanced dicing technology for semiconductor wafer―Stealth Dicing― (2007)
  • Author(s): M. Kumagai, N. Uchiyama, E. Ohmura, R. Sugiura, K. Atsumi, K. Fukumitsu
  • Journal Title: IEEE Transactions on Semiconductor Manufacturing Vol. 20, No. 3 Pages: 259-265
  • Peer Reviewed
• [Journal Article] Analysis of Processing Mechanism in Stealth Dicing of Ultra Thin Silicon Wafer (2007)
  • Author(s): Etsuji Ohmura, Masayoshi Kumagai, Makoto Nakano, Koji Kuno, Kenshi Fukumitsu, Hideki Morita
  • Journal Title: Proc. the International Conference on Leading Edge Manufacturing in 21st Century, 2007, Fukuoka Japan Pages: 861-866
  • NAID: 130000080854
  • Peer Reviewed
• [Journal Article] レーザの多重反射と蒸発を考慮したレーザ穴あけ加工の熱流体解析-第2報,レーザの多重反射と材料の蒸発を考慮したレーザ穴あけシミュレーション- (2007)
  • Author(s): 野口 暁・大村悦二・平田好則
  • Journal Title: レーザ加工学会誌 14 Pages: 113-119
  • NAID: 40015552527
  • Peer Reviewed
• [Journal Article] レーザ切断フロントにおける溶融膜厚とパワー密度の推算 (2007)
  • Author(s): 新井武二・大村悦二
  • Journal Title: レーザ加工学会誌 14 Pages: 174-181
  • NAID: 40015643052
  • Peer Reviewed
• [Journal Article] ガラスのレーザスクライブにおける亀裂の局所進展 (2007)
  • Author(s): 山本幸司・羽阪 登・森田英毅・大村悦二
  • Journal Title: 精密工学会誌 73 Pages: 917-923
  • NAID: 110006368883
  • Peer Reviewed
• [Journal Article] Advanced dicing technology for semiconductor wafer-Stealth Dicing- (2007)
  • Author(s): M. Kumagai, N. Uchiyama, E. Ohmura, R. Sugiura, K. Atsumi, K. Fukumitsu
  • Journal Title: IEEE Transactions on Semiconductor Manufacturing 20 Pages: 259-265
  • Peer Reviewed
• [Journal Article] Molecular Dynamics Simulation of Flattening Process of a High- Temperature, High-Speed Droplet-Influence of Impact Parameters (2007)
  • Author(s): J. Shimizu, E. Ohmura, Y. Kobayashi, S. Kiyoshima, H. Eda
  • Journal Title: Journal of Thermal Spray Technology 16 Pages: 722-728
  • Peer Reviewed
• [Journal Article] Internal Modification of Ultra Thin Silicon Wafer by Permeable Pulse Laser (2007)
  • Author(s): E. Ohmura, M. Kumagai, K. Fukumitsu, K. Kuno, M. Nakano, H. Morita
  • Journal Title: Online Proceedings of LPM2007-the 8th Int. Symp. on Laser Precision Microfabrication
  • NAID: 110006647632
• [Journal Article] Molecular Dynamics Simulation of Flattening Process of a High-Temperature, High-Speed Droplet:Influence of Impact Parameters (2007)
  • Author(s): J. Shimizu, E. Ohmura, Y. Kobayashi, S. Kiyoshima, H. Eda
  • Journal Title: Proceedings of the 2007 International Thermal Spray Conference(ITSC2007) Pages: 230-235
  • Peer Reviewed
• [Journal Article] Effects of Laser Irradiation on Plasma Sprayed Al2O3 (2007)
  • Author(s): Y. Kobayashi, E. Ohmura, S. Ueki
  • Journal Title: Proceedings of the 2007 International Thermal Spray Conference(ITSC2007) Pages: 1035-1040
  • Peer Reviewed
• [Journal Article] Thermohydrodynamics Analysis of Laser Drilling Considering Multiple Reflection of Laser and Evaporation (2007)
  • Author(s): E. Ohmura, S. Noguchi, Y. Hirata
  • Journal Title: Proceedings of 11th Nordic Conference in Laser Processing of Materials(NOLAMP) Pages: 216-226
  • NAID: 130005028686
• [Journal Article] Laser processing of doped silicon wafer by the Stealth Dicing (2007)
  • Author(s): M. Kumagai, T. Sakamoto, E. Ohmura
  • Journal Title: Proceedings of 2007 International Symposium on Semiconductor Manufacturing(ISSM2007) Pages: 215-218
• [Journal Article] Modeling of Laser Drilling Considering Multiple Reflection of Laser, Evaporation and Melt Flow (2007)
  • Author(s): S. Noguchi, E. Ohmura, W. R. Harp, J. Tu and Y. Hirata
  • Journal Title: Proceedings of the 26th Int. Cong. on Application of Laser and Electro-Optics 2007(ICALEO2007) Pages: 674-683
• [Journal Article] Analysis of Processing Mechanism in Stealth Dicing of Ultra Thin Silicon Wafer (2007)
  • Author(s): E. Ohmura, M. Kumagai, M. Nakano, K. Kuno, K. Fukumitsu, H.Morita
  • Journal Title: Proceedings of the Int. Conf. on Leading Edge Manufacturing in 21st Century, LEM21 Pages: 861-866
  • NAID: 130000080854
  • Peer Reviewed
• [Journal Article] Partial Growth of Crack in Laser Scribing of Glass (2007)
  • Author(s): K. Yamamoto, N. Hasaka, H. Morita, E. Ohmura
  • Journal Title: Proceedings of the Int. Conf. on Leading Edge Manufacturing in 21st Century, LEM21 Pages: 873-878
  • NAID: 130007890950
  • Peer Reviewed
• [Journal Article] 超短パルスレーザアブレーションの分子動力学シミュレーション (2007)
  • Author(s): 大村悦二
  • Journal Title: 日本機械学会誌 110 Pages: 844-846
  • NAID: 10004435918
  • Peer Reviewed
• [Journal Article] レーザ穴あけにおける多重反射を考慮した熱流体解析 (2007)
  • Author(s): 大村悦二
  • Journal Title: OPTRONICS 26 Pages: 64-69
  • Peer Reviewed
• [Presentation] ステルスダイシングの加工メカニズム【特別講演】 (2011)
  • Author(s): 大村悦二
  • Organizer: 第75 回レーザ加工学会講演会
  • Place of Presentation: 吹田
  • Year and Date: 2011-05-11
• [Presentation] 超短パルスレーザ照射による光吸収性媒質中の自己集束と温度場の理論的解析 (2010)
  • Author(s): 大村悦二
  • Organizer: 第74回レーザ加工学会講演会
  • Place of Presentation: 東京
  • Year and Date: 2010-12-06
• [Presentation] ガラスのレーザスクライブにおけるレーザの繰り返し周波数の影響 (2010)
  • Author(s): 八幡恵輔, 大村悦二, 清水政二, 村上政直
  • Organizer: 第74回レーザ加工学会講演会
  • Place of Presentation: 東京
  • Year and Date: 2010-12-06
• [Presentation] Laser Processing Mechanism of Monocrystalline Diamond (2010)
  • Author(s): Etsuji Ohmura, Katsuko Harano, Kenichi Watatani, Keiji Ebata
  • Organizer: 14th International Conference on Mechatronics Technology, ICMT 2010
  • Place of Presentation: 吹田
  • Year and Date: 2010-11-24
• [Presentation] 光吸収性媒質中における超短パルスレーザの自己集束現象と温度場の解析 (2010)
  • Author(s): 大村悦二
  • Organizer: 日本機械学会第8回生産加工・工作機械部門講演会
  • Place of Presentation: 岡山
  • Year and Date: 2010-11-20
• [Presentation] ガラスのレーザスクライブにおけるレーザの繰り返し周波数の影響 (2010)
  • Author(s): 八幡恵輔, 大村悦二, 清水政二, 村上政直
  • Organizer: 日本機械学会第8回生産加工・工作機械部門講演会
  • Place of Presentation: 岡山
  • Year and Date: 2010-11-20
• [Presentation] Analyses of Self-Focusing Phenomenon and Temperature Field in Light Absorption Medium with Ultrashort Pulse Laser Irradiation (2010)
  • Author(s): 大村悦二
  • Organizer: The 29th International Congress on Application of Laser and Electro-Optics 2010 (ICALEO2010)
  • Place of Presentation: Anaheim
  • Year and Date: 2010-09-27
• [Presentation] Analyses of Self-Focusing Phenomenon and Temperature Field in Light Absorption Medium with Ultrashort Pulse Laser Irradiation (2010)
  • Author(s): Etsuji Ohmura
  • Organizer: The 29th International Congress on Application of Laser and Electro-Optics 2010, ICALEO2010
  • Place of Presentation: アナハイム(米国)
  • Year and Date: 2010-09-26
• [Presentation] Study of Laser Processing Mechanism of Single Crystal Diamond (2010)
  • Author(s): Etsuji Ohmura, Katsuko Harano, Kenichi Watatani, Keiji Ebata
  • Organizer: International Conference on Innovative Technologies in Design, Manufacturing and Production, IN-TECH 2010
  • Place of Presentation: プラハ(チェコ)
  • Year and Date: 2010-09-14
• [Presentation] Crack Propagation Analysis in Underwater Laser Drilling 【招待講演】 (2010)
  • Author(s): Etsuji Ohmura, Takashi Okazaki, Keiichi Kishi, Toshio Kobayashi, Masahiro Nakamura, Satoshi Kubo, Komei Okatsu
  • Organizer: The 4th International Conference on Advanced Computational Engineering and Experimenting (ACE-X 2010)
  • Place of Presentation: Paris
  • Year and Date: 2010-07-08
• [Presentation] Crack Propagation Analysis in Underwater Laser Drilling (2010)
  • Author(s): Etsuji Ohmura, Takashi Okazaki, Keiichi Kishi, Toshio Kobayashi, Masahiro Nakamura, Satoshi Kubo, Komei Okatsu
  • Organizer: 4rd International Conference on Advanced Computational Engineering and Experimenting, ACE-X 2010
  • Place of Presentation: パリ(フランス)(招待講演)
  • Year and Date: 2010-07-08
• [Presentation] Analysis of Internal Crack Propagation in Silicon Due to Permeable Pulse Laser Irradiation-Study on Processing Mechanism of Stealth Dicing- (2010)
  • Author(s): Etsuji Ohmura, Yuta Kawahito, Kenshi Fukumitsu, Junji Okuma, Hideki Morita
  • Organizer: International Conference on Fundamentals of Laser Assisted Micro- & Nanotechnologies (FLAMN-10)
  • Place of Presentation: St. Pe-tersburg
  • Year and Date: 2010-07-06
• [Presentation] Analysis of Internal Crack Propagation in Silicon Due to Permeable Pulse Laser Irradiation-Study on Processing Mechanism of Stealth Dicing- (2010)
  • Author(s): Etsuji Ohmura, Yuta Kawahito, Kenshi Fukumitsu, Junji Okuma, Hideki Morita
  • Organizer: International Conference on Fundamentals of Laser Assisted Micro- & Nanotechnologies, FLAMN-10
  • Place of Presentation: サンクトペテルブルグ(ロシア)
  • Year and Date: 2010-07-06
• [Presentation] 透過性パルスレーザによるシリコン内部の亀裂伸展解析-ステルスダイシングの加工メカニズムに関する研究- (2010)
  • Author(s): 川人佑太・大村悦二・中野誠・福満憲志・森田英毅
  • Organizer: 2010年度精密工学会春季大会学術講演会
  • Place of Presentation: さいたま
  • Year and Date: 2010-03-17
• [Presentation] レーザプロセスによる知的ナノ加工【依頼講演】 (2009)
  • Author(s): 大村悦二
  • Organizer: 日本太陽エネルギー学会関西支部2009年度シンポジウム
  • Place of Presentation: 生駒
  • Year and Date: 2009-12-03
• [Presentation] レーザプロセスによる知的ナノ加工【招待講演】 (2009)
  • Author(s): 大村悦二
  • Organizer: 日本太陽エネルギー学会関西支部2009年度シンポジウム
  • Place of Presentation: 生駒
  • Year and Date: 2009-12-03
• [Presentation] Crack Propagation Analysis During Pulse Duration in Stealth Dicing (2009)
  • Author(s): Etsuji Ohmura, Kensuke Ogawa, Masayoshi Kumagai, Makoto Nakano, Kenshi Fukumitsu, Hideki Morita
  • Organizer: The 28th International Congress on Application of Laser and Electro-Optics 2009 (ICALEO2009)
  • Place of Presentation: Orlando
  • Year and Date: 2009-11-03
• [Presentation] Crack Propagation Analysis During Pulse Duration in Stealth Dicing (2009)
  • Author(s): E.Ohmura, K.Ogawa, M.Kumagai, M.Nakano, K.Fukumitsu, H.Morita
  • Organizer: The 28th International Congress on Application of Laser and Electro-Optics 2009, ICALEO2009
  • Place of Presentation: オーランド(米国)
  • Year and Date: 2009-11-03
• [Presentation] 単結晶ダイヤモンドのレーザ加工メカニズムに関する研究 (2009)
  • Author(s): 大村悦二・原野佳津子・綿谷研一・江畑恵司
  • Organizer: 日本機械学会2009年度年次大会
  • Place of Presentation: 盛岡
  • Year and Date: 2009-09-15
• [Presentation] ステルスダイシングにおける応力拡大係数を用いたき裂進展解析 (2009)
  • Author(s): 大村悦二・小川健輔・熊谷正芳・中野誠・福満憲志・森田英毅
  • Organizer: 材料力学カンファレンスM&M2009
  • Place of Presentation: 札幌
  • Year and Date: 2009-07-24
• [Presentation] Analysis of Crack Propagation Induced by Laser Irradiation in Stealth Dicing (2009)
  • Author(s): E.Ohmura, K.Ogawa, M.Kum agai, M.Nakano, K.Fukumitsu, H.Morita
  • Organizer: The Fifth International Congress on Laser Advan ced Materials Processing, LAMP2009
  • Place of Presentation: 神戸
  • Year and Date: 2009-07-02
• [Presentation] Crack Propagation Analysis in Laser Scribing of Glass (2009)
  • Author(s): K.Yahata, K.Yamamoto, E.Ohmura, Y.Hirata
  • Organizer: The Fifth International Congress on Laser Advan ced Materials Processing, LAMP2009
  • Place of Presentation: 神戸
  • Year and Date: 2009-07-02
• [Presentation] Laser Drilling Simulation Considering Multiple Reflection of Laser, Eva poration and Melt flow (2009)
  • Author(s): E.Ohmura, S.Noguchi
  • Organizer: 3rd International Conference on Advanced Compu tational Engineering and Experimenting, ACE-X 2 009
  • Place of Presentation: ローマ(イタリア)
  • Year and Date: 2009-06-23
• [Presentation] Analysis of Crack Propagation Induced by Laser Irradiation in Stealth Dicing (2009)
  • Author(s): Etsuji Ohmura, Kensuke Ogawa, Masayoshi Kumagai, Makoto Nakano, Kenshi Fukumitsu, Hideki Morita
  • Organizer: The Fifth International Congress on Laser Advanced Materials Processing (LAMP2009)
  • Place of Presentation: 神戸
  • Year and Date: 2009-06-02
• [Presentation] Crack Propagation Analysis in Laser Scribing of Glass (2009)
  • Author(s): Keisuke Yahata, Koji Yamamoto, Etsuji Ohmura, Yoshinori Hirata
  • Organizer: The Fifth International Congress on Laser Advanced Materials Processing (LAMP2009)
  • Place of Presentation: 神戸
  • Year and Date: 2009-06-01
• [Presentation] ステルスダイシングにおける内部亀裂進展シミュレーション (2009)
  • Author(s): 小川健輔, 大村悦二, 熊谷正芳, 中野 誠, 福満憲志, 平田好則
  • Organizer: 2009年度精密工学会春季大会学術講演会
  • Place of Presentation: 東京都
  • Year and Date: 2009-03-13
• [Presentation] ガラスのレーザスクライブにおける予亀裂導入モデルによる熱応力解析 (2008)
  • Author(s): 八幡恵輔, 山本幸司, 大村悦二, 平田好則
  • Organizer: 日本機械学会第7回生産加工・工作機械部門講演会
  • Place of Presentation: 岐阜市
  • Year and Date: 2008-11-22
• [Presentation] Temperature field analysis of silicon wafer in stealth dicing (2008)
  • Author(s): Etsuji Ohmura, Masayoshi Kumagai, Kenshi Fukumitsu, Makoto Nakano, Kazuhiro Atsumi, Hideki Morita
  • Organizer: The 27th International Congress on Application of Laser and Electro-Optics 2008 (ICALEO2008)
  • Place of Presentation: Temecula
  • Year and Date: 2008-10-22
• [Presentation] ステルスダイシングにおけるシリコンウェハの温度場解析 (2008)
  • Author(s): 大村悦二, 熊谷正芳, 福満憲志, 中野 誠, 渥美一弘, 森田英毅
  • Organizer: 2008年度精密工学会秋季大会学術講演会
  • Place of Presentation: 仙台市
  • Year and Date: 2008-09-18
• [Presentation] Influence of Thickness in Laser Scribing of Glass and Crack Propagation by Laser Irradiation along Laser Scribed Line (2008)
  • Author(s): Koji Yamamoto, Noboru Hasaka, Hideki Morita, Etsuji Ohmura
  • Organizer: Nineth International Symposium on Laser Precision Microfabrication (LPM2008)
  • Place of Presentation: Quebec City
  • Year and Date: 2008-06-18
• [Presentation] Partial Growth of Crack and Cross Scribe in Laser Scribing of Glass e (2008)
  • Author(s): Koji Yamamoto, Noboru Hasaka, Hideki Morita, Etsuji Ohmura
  • Organizer: Nineth International Symposium on Laser Precision Microfabrication (LPM2008)
  • Place of Presentation: Quebec City
  • Year and Date: 2008-06-18
• [Presentation] Innovative Laser Technology for Semiconductor Manufacturing -Stealth Dicing-【招待講 演】 (2008)
  • Author(s): E. Ohmura、 Masayoshi Kumagai, Hideki 、 Morita
  • Organizer: The 3rd Pacific International Conference on Application of Lasers and Optics 2008 (PICALO2008)
  • Place of Presentation: 北京
  • Year and Date: 2008-04-17
• [Presentation] Innovative Laser Technology for Semiconductor Manufacturing ―Stealth Dicing―【招待講演】 (2008)
  • Author(s): E. Ohmura, Masayoshi Kumagai, Hideki Morita
  • Organizer: The 3rd Pacific International Conference on Application of Lasers and Optics 2008 (PICALO2008)
  • Place of Presentation: 北京、中国
  • Year and Date: 2008-04-17
• [Presentation] Analysis of Processing Mechanism in Stealth Dicing of Ultra Thin Silicon Wafer (2007)
  • Author(s): Etsuji Ohmura, Masayoshi Kumagai, Makoto Nakano, Koji Kuno, Kenshi Fukumitasu, Hideki Morita
  • Organizer: International Conference on Leading Edge Manufacturing in 21st Century (LEM21)
  • Place of Presentation: 福岡
  • Year and Date: 2007-11-09
• [Presentation] Partial Growth of Crack in Laser Scribing of Glass (2007)
  • Author(s): Koji Yamamoto, Noboru Hasaka, Hideki Morita, Etsuji Ohmura
  • Organizer: International Conference on Leading Edge Manufacturing in 21st Century (LEM21)
  • Place of Presentation: 福岡
  • Year and Date: 2007-11-09
• [Presentation] Analysis of Processing Mechanism in Stealth Dicing of Ultra Thin Silicon Wafer (2007)
  • Author(s): E. Ohmura, M. Kumagai, M. Nakano, K. Kuno, K. Fukumitsu, H. Morita
  • Organizer: International Conference on Leading Edge Manufacturing in 21st Century, LEM21
  • Place of Presentation: Fukuoka, Japan
  • Year and Date: 2007-11-09
• [Presentation] Partial Growth of Crack in Laser Scribing of Glass (2007)
  • Author(s): K. Yamamoto, N. Hasaka, H. Morita, E.Ohmura
  • Organizer: International Conference on Leading Edge Manufacturing in 21st Century, LEM21
  • Place of Presentation: Fukuoka,Japan
  • Year and Date: 2007-11-09
• [Presentation] Modeling of Laser Drilling Considering Multiple Reflection of Laser, Evaporation and Melt Flow (2007)
  • Author(s): S. Noguchi, E. Ohmura, W.R. Harp, J. Tu and Y. Hirata
  • Organizer: The 26th International Congress on Application of Laser and Electro-Optics 2007, ICALEO2007
  • Place of Presentation: Orlando, FL, USA
  • Year and Date: 2007-10-31
• [Presentation] Laser processing of doped silicon wafer by the Stealth Dicing (2007)
  • Author(s): Masayoshi Kumagai、Takeshi Sakamoto, Etsuji Ohmura
  • Organizer: 2007 International Symposium on Semiconductor Manufacturing (ISSM2007)
  • Place of Presentation: Santa Clara
  • Year and Date: 2007-10-16
• [Presentation] 極薄シリコンウェハのステルスダイシング (2007)
  • Author(s): 大村悦二・熊谷正芳・中野 誠・渥美一弘・森田英毅
  • Organizer: 2007年度精密工学会秋季大会学術講演会
  • Place of Presentation: 旭川市
  • Year and Date: 2007-09-13
• [Presentation] Thermohydrodynamics Analysis of Laser Drilling Considering Multiple Reflection of Laser and Evaporation (2007)
  • Author(s): E. Ohmural S. Noguchi, Y. Hirata
  • Organizer: 11th Nordic Conference in Laser Processing of Materials, NOLAMP11
  • Place of Presentation: Rappeenranta, Finland
  • Year and Date: 2007-08-20
• [Presentation] Molecular Dynamics Simulation of Flattening Process of a High-Temperature, High-Speed Droplet: Influence of Impact Parameters (2007)
  • Author(s): J. Shimizu, E. Ohmura, Y. Kobayashi, S. Kiyoshima, H. Eda
  • Organizer: International Thermal Spray Conference & Exposition, ITSC2007
  • Place of Presentation: Beijing, China
  • Year and Date: 2007-05-16
• [Presentation] Effects of Laser Irradiation on Plasma Sprayed Al2O3 (2007)
  • Author(s): Y. Kobayashi, E. Ohmura, S. Ueki
  • Organizer: International Thermal Spray Conference & Exposition, ITSC2007
  • Place of Presentation: Beijing, China
  • Year and Date: 2007-05-16
• [Presentation] Laser processing of doped silicon wafer by the Stealth Dicing (2007)
  • Author(s): M. Kumagai, T. Sakamoto, E. Ohmura
  • Organizer: 2007 International Symposium on Semiconductor Manufacturing(ISSM2007)
  • Place of Presentation: Santa Clara, CL, USA
  • Year and Date: 2007-05-16
• [Book] Materials with Complex Behaviour -Modelling, Simulation, Testing, and Applications (ed. by A. Ochsner, L.F. Martins da Silva and H. Altenbach) (2010)
  • Author(s): E.Ohmura, S.Noguchi (分担執筆)
  • Publisher: Springel
• [Book] Materials with Complex Behaviour-Modelling, Simulation, Testing, and Applications (ed.by A.Ochsner, L.F.Martins da Silva and H.Altenbach) (2010)
  • Author(s): E.Ohmura, S.Noguchi(分担執筆)
  • Total Pages: 372
  • Publisher: Springel
• [Patent(Industrial Property Rights)] レーザ加工方法及びレーザ加工装置 (2010)
  • Inventor(s): 渥美貴文・池田優二・大村悦二
  • Industrial Property Rights Holder: アイシン精機(株)
  • Filing Date: 2010-09-10
  • Overseas
• [Patent(Industrial Property Rights)] 雷射加工方法及雷射加工装置 (2010)
  • Inventor(s): 渥美貴文・池田優二・大村悦二
  • Industrial Property Rights Holder: アイシン精機(株)
  • Filing Date: 2010-09-10
  • Overseas
• [Patent(Industrial Property Rights)] レーザ加工方法及びレーザ加工装置 (2009)
  • Inventor(s): 渥美貴文・池田優二・大村悦二
  • Industrial Property Rights Holder: アイシン精機(株)
  • Industrial Property Number: 2009-208789
  • Filing Date: 2009-09-10
• [Patent(Industrial Property Rights)] レーザ加工方法及びレーザ加工装置 (2009)
  • Inventor(s): 渥美貴文・池田優二・大村悦二
  • Industrial Property Rights Holder: アイシン精機(株)
  • Filing Date: 2009-09-15
• [Patent(Industrial Property Rights)] 特許 (2009)
  • Inventor(s): 渥美貴文・池田優二・大村悦二
  • Industrial Property Rights Holder: アイシン精機
  • Filing Date: 2009-09-03
• [Patent(Industrial Property Rights)] Laser Processing Method and Laser Processing System (2007)
  • Inventor(s): 福世文嗣, 大村悦二, 福満憲志, 熊谷正芳, 渥美一弘, 内山直己
  • Industrial Property Rights Holder: 浜松ホトニクス(株)
  • Acquisition Date: 2007
  • Overseas
• [Patent(Industrial Property Rights)] レーザ加工方法及びレーザ加工装置 (2007)
  • Inventor(s): 福世文嗣・大村悦二・福満憲志・熊谷正芳・渥美一弘・内山直己
  • Industrial Property Rights Holder: 浜松ホトニクス(株)
  • Acquisition Date: 2007
• [Patent(Industrial Property Rights)] レーザ加工方法及びレーザ加工装置 (2007)
  • Inventor(s): 福世文嗣・大村悦二・福満憲志・熊谷正芳・渥美一弘・内山直己
  • Industrial Property Rights Holder: 浜松ホトニクス(株)
  • Acquisition Date: 2007
• [Patent(Industrial Property Rights)] 特許「レーザ加工方法及びレーザ加工装置」 (2007)
  • Inventor(s): 福世文嗣, 大村悦二, 福満憲志, 熊谷正芳, 渥美一弘, 内山直己
  • Industrial Property Rights Holder: 浜松ホトニクス株式会社
  • Industrial Property Number: 2006-069985
  • Acquisition Date: 2007-09-27