| Budget Amount *help |
¥19,110,000 (Direct Cost: ¥14,700,000、Indirect Cost: ¥4,410,000)
Fiscal Year 2009: ¥5,850,000 (Direct Cost: ¥4,500,000、Indirect Cost: ¥1,350,000)
Fiscal Year 2008: ¥6,890,000 (Direct Cost: ¥5,300,000、Indirect Cost: ¥1,590,000)
Fiscal Year 2007: ¥6,370,000 (Direct Cost: ¥4,900,000、Indirect Cost: ¥1,470,000)
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| Research Abstract |
A novel bonding process using Ag nanoparticles with a particle size less than several tens nm that realizes solid state metal-to-metal bonding at a bonding temperature of 300℃ or lower has been developed. In particular, we have devised a bonding process through in-situ formation of Ag nanoparticles by reducing Ag_2O microparticles that achieves successful metal-to-metal bonding at 200℃. This bonding process is also more convenient and lower cost, and allows higher bonding strength than that directly using Ag nanoparticles. We have applied this bonding process to assembly of a power semiconductor and achieved higher reliability than the conventional assembly by soldering.
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