Budget Amount *help |
¥4,420,000 (Direct Cost: ¥3,400,000、Indirect Cost: ¥1,020,000)
Fiscal Year 2009: ¥650,000 (Direct Cost: ¥500,000、Indirect Cost: ¥150,000)
Fiscal Year 2008: ¥1,690,000 (Direct Cost: ¥1,300,000、Indirect Cost: ¥390,000)
Fiscal Year 2007: ¥2,080,000 (Direct Cost: ¥1,600,000、Indirect Cost: ¥480,000)
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Research Abstract |
Reactive sputter deposition process has been studied for the precise control of deposited film composition. We clarified the effects of transport process of sputtered metal atoms and sticking probability of reactive gases. Especially, the former leads the dependence of the composition on total gas pressure, which has not been pre-dicted by conventional process models. We also studied the characteristics of pulse power sputtering, which has been proved to be able to modify the film structure.
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