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ELASTO-PLASTIC-CREEP CHARACTERISTICS OF ELECTROPLATED COPPER FOIL AND ITS ESTIMATION BY STEPPED MICRO INDENTATION

Research Project

Project/Area Number 19560071
Research Category

Grant-in-Aid for Scientific Research (C)

Allocation TypeSingle-year Grants
Section一般
Research Field Materials/Mechanics of materials
Research InstitutionAkita University

Principal Investigator

OHGUCHI Ken-ichi  Akita University, 工学資源学部, 准教授 (30292361)

Co-Investigator(Kenkyū-buntansha) EIJI Eiji  秋田大学, 工学資源学部, 准教授 (40302260)
Project Period (FY) 2007 – 2008
Project Status Completed (Fiscal Year 2008)
Budget Amount *help
¥4,550,000 (Direct Cost: ¥3,500,000、Indirect Cost: ¥1,050,000)
Fiscal Year 2008: ¥1,560,000 (Direct Cost: ¥1,200,000、Indirect Cost: ¥360,000)
Fiscal Year 2007: ¥2,990,000 (Direct Cost: ¥2,300,000、Indirect Cost: ¥690,000)
Keywords連続体力学 / インデンテーション / 電解めっき銅箔 / 弾・塑性・クリープ構成モデル / 疲労寿命評価 / ラチェット変形 / 荷重緩和曲線 / 粘塑性 / 粘塑性変形 / クリープ / 応力緩和
Research Abstract

電解めっき銅箔の変形特性を正確に評価するための試験法を確立した. この方法により, 電解めっき銅箔の変形は, 室温でもクリープ変形の影響を受けることが明らかになった. 繰返し引張・除荷による疲労試験も実施可能となった. また, クリープ構成則を導出し, これを用いた弾・塑性・クリープ構成則で電解めっき銅箔の変形が記述できることを明らかにした. 一方で, 階段マイクロインデンテーション試験によりクリープ構成則の材料定数を導出するための方法について検討した.

Report

(3 results)
  • 2008 Annual Research Report   Final Research Report ( PDF )
  • 2007 Annual Research Report
  • Research Products

    (11 results)

All 2009 2008 2007

All Journal Article (4 results) (of which Peer Reviewed: 4 results) Presentation (7 results)

  • [Journal Article] Evaluation of Time-Independent and Time-Dependent Strains of Lead-Free Solder by Stepped Ramp Loading Test2009

    • Author(s)
      K. OHGUCHI, K. SASAKI and Setsuo Aso
    • Journal Title

      Transactions of ASME, Journal of Electronic Packaging Vol.131

    • Related Report
      2008 Final Research Report
    • Peer Reviewed
  • [Journal Article] Evaluation of Time-Independent and Time-Dependent Strains of Lead-Free Solder by Stepped Ramp Loading Test2009

    • Author(s)
      K. OHGUCHI, K. SASAKI and S. Aso
    • Journal Title

      Transactions of ASME, Journal of Electronic Packaging 131(印刷中)

    • Related Report
      2008 Annual Research Report
    • Peer Reviewed
  • [Journal Article] Evaluation of Time-Independent and Time-Dependent Strains of Lead-Free Solder by Stepped Ramp Loading Test2007

    • Author(s)
      K. OHGUCHI, K. SASAKI and Setsuo Aso
    • Journal Title

      Proceedings of InterPACK'07 IPACK2007

      Pages: 33663-33663

    • Related Report
      2008 Final Research Report
    • Peer Reviewed
  • [Journal Article] Evaluation of Time-Independent and Time-Dependent Strains of Lead-Free Solder by Stepped Ramp Loading Test2007

    • Author(s)
      K. OHGUCHI, K. SASAKI and S. Aso
    • Journal Title

      Proceedings of InterPACK'07 (CD-ROM)

    • Related Report
      2007 Annual Research Report
    • Peer Reviewed
  • [Presentation] 繰返し階段負荷によるSn-3.0Ag-0.5Cu材の塑性・クリープひずみ解析2008

    • Author(s)
      大口健一, 麻生節夫, 佐々木克彦
    • Organizer
      日本金属学会2008年秋季(第143回)大会
    • Place of Presentation
      熊本大学
    • Year and Date
      2008-09-25
    • Related Report
      2008 Annual Research Report 2008 Final Research Report
  • [Presentation] ラチェット変形による電解めっき銅箔の疲労2008

    • Author(s)
      三浦裕太, 大口健一, 多田英司, 井口裕, 八木輝明
    • Organizer
      日本機会学会M & M2008材料力学カンファレンス
    • Place of Presentation
      立命館大学
    • Year and Date
      2008-09-16
    • Related Report
      2008 Final Research Report
  • [Presentation] ラチェット変形による電解めっき銅箔の疲労2008

    • Author(s)
      三浦裕太, 大口健一, 多田英司, 井口裕, 八木輝明
    • Organizer
      日本機会学会M&M2008材料力学カンファレンス
    • Place of Presentation
      立命館大学
    • Year and Date
      2008-09-16
    • Related Report
      2008 Annual Research Report
  • [Presentation] Sn-3.0Ag-0.5Cu材の低サイクル疲労過程におけるクリープひずみ成分の定量化2008

    • Author(s)
      大口健一, 佐々木克彦, 麻生節夫
    • Organizer
      日本機械学会2008年度年次大会
    • Place of Presentation
      横浜国立大学
    • Year and Date
      2008-08-06
    • Related Report
      2008 Annual Research Report 2008 Final Research Report
  • [Presentation] 電解めっき銅箔の非弾性変形におけるクリープ変形の効果2008

    • Author(s)
      三浦裕太, 大口健一, 多田英司, 井口裕, 八木輝明
    • Organizer
      日本機械学会2008年度年次大会
    • Place of Presentation
      横浜国立大学
    • Year and Date
      2008-08-04
    • Related Report
      2008 Annual Research Report 2008 Final Research Report
  • [Presentation] Evaluation of Time-Independent and Time -Dependent Strains of Lead-Free Solder by Stepped Ramp Loading Test2007

    • Author(s)
      K. OHGUCHI, K. SASAKI and Setsuo Aso
    • Organizer
      InterPACK'07
    • Place of Presentation
      Vancouver, Canada
    • Year and Date
      2007-07-11
    • Related Report
      2008 Final Research Report
  • [Presentation] Evaluation of Time-Independent and Time-Dependent Strains of Lead-Free Solder by Stepped Ramp Loading Test2007

    • Author(s)
      K. OHGUCHI, K. SASAKI and S. Aso
    • Organizer
      InterPACK'07
    • Place of Presentation
      Vancouver, Canada
    • Year and Date
      2007-07-11
    • Related Report
      2007 Annual Research Report

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Published: 2007-04-01   Modified: 2016-04-21  

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