Budget Amount *help |
¥23,010,000 (Direct Cost: ¥17,700,000、Indirect Cost: ¥5,310,000)
Fiscal Year 2009: ¥5,590,000 (Direct Cost: ¥4,300,000、Indirect Cost: ¥1,290,000)
Fiscal Year 2008: ¥8,840,000 (Direct Cost: ¥6,800,000、Indirect Cost: ¥2,040,000)
Fiscal Year 2007: ¥8,580,000 (Direct Cost: ¥6,600,000、Indirect Cost: ¥1,980,000)
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Research Abstract |
We have provided new three-dimensional integration technology based on high-precision multi-chip self-assembly using surface tension of liquid droplets. We have successfully fabricated heterogeneous multi-chip test module using the self-assembly technology. The alignment accuracy was found to be within 1 micron, and more than 500 chips can be self-assembled on substrates in batch. In addition, the chips were tightly bonded to the substrates at room temperature without thermal compression.
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