• Search Research Projects
  • Search Researchers
  • How to Use
  1. Back to previous page

Investigation of damage mechanism of metal nanoparticle interconnect used in flexible electronic circuits under electrical and mechanical loadings

Research Project

Project/Area Number 19K04084
Research Category

Grant-in-Aid for Scientific Research (C)

Allocation TypeMulti-year Fund
Section一般
Review Section Basic Section 18010:Mechanics of materials and materials-related
Research InstitutionHirosaki University

Principal Investigator

SASAGAWA Kazuhiko  弘前大学, 理工学研究科, 教授 (50250676)

Project Period (FY) 2019-04-01 – 2023-03-31
Project Status Discontinued (Fiscal Year 2022)
Budget Amount *help
¥4,290,000 (Direct Cost: ¥3,300,000、Indirect Cost: ¥990,000)
Fiscal Year 2022: ¥910,000 (Direct Cost: ¥700,000、Indirect Cost: ¥210,000)
Fiscal Year 2021: ¥1,040,000 (Direct Cost: ¥800,000、Indirect Cost: ¥240,000)
Fiscal Year 2020: ¥910,000 (Direct Cost: ¥700,000、Indirect Cost: ¥210,000)
Fiscal Year 2019: ¥1,430,000 (Direct Cost: ¥1,100,000、Indirect Cost: ¥330,000)
Keywords金属ナノ粒子配線 / エレクトロマイグレーション / フレキシブル回路 / 信頼性 / 金属ナノ粒子 / 損傷機構 / フレキシブルエレクトロニクス
Outline of Research at the Start

柔らかな電子回路に用いられるフレキシブルな電子配線は、金属ナノ粒子を分散したインクをインクジェットプリンタなどにより印刷して作られ、今後大いに発展が見込まれている。今後進む配線の微細化は、高密度電子流による配線金属原子の拡散移動現象(EM)を誘起し、近々にこの信頼性問題に直面することは確実である。しかし、EM信頼性の検討はほとんど行われておらず、フレキシブルな金属ナノ粒子インク配線における損傷機構の解明が待たれている。実用化の始まった金属ナノ粒子配線を対象に、高密度電流・曲げ応力下の損傷機構の解明を行い、さらに得られた成果を踏まえ、配線寿命などの強度評価法の構築を行う。

Outline of Final Research Achievements

The followings were shown for the first time in the world;
In the flexible silver nanoparticle lines under electrical and mechanical loadings, the local decrease in line’s thickness by the formation of the metal particles aggregates on the line and electromigration, EM, was the complex damage factor, and as EM damage mechanism, the porous internal structure of the line changes, the aggregates of silver particles like a crystal grain were formed with electrical loading, and the metallic atoms diffused along the grain boundary by electromigration.
In general EM damage, the damage by the grain boundary diffusion occurred on the cathode side of the line, but the damage occurred on the anode side in the silver nanoparticles lines. Thus, it was revealed that it was necessary to build an atomic diffusion model in consideration of inhomogeneity of the crystal grain size in the line’s internal structure to reproduce this phenomenon, and the theoretical model was immediately started to build.

Academic Significance and Societal Importance of the Research Achievements

これまで明らかになっていないフレキシブル金属ナノ粒子インク配線の高密度電子流による損傷に焦点を絞り、特に実用環境で想定される電気負荷と応力負荷が重畳作用する複雑な損傷の初生および進展機序を世界に先駆け解明したものであり、学術的な意義を有する。
さらに、損傷機構の解明にとどまらず、これまで成功をみていない金属ナノ粒子インク配線の強度評価へ歩を進めたことは、今後発展が望まれる柔らかい電子回路の信頼性を確保することに貢献し、これによるさらなる応用分野の拡大が見込まれ、その社会的意義は大きい。

Report

(4 results)
  • 2022 Final Research Report ( PDF )
  • 2021 Annual Research Report
  • 2020 Research-status Report
  • 2019 Research-status Report
  • Research Products

    (14 results)

All 2022 2021 2020 2019 Other

All Journal Article (6 results) (of which Peer Reviewed: 5 results) Presentation (5 results) Book (1 results) Remarks (2 results)

  • [Journal Article] Damage Analysis in Ag Nanoparticle Interconnect Line Under High-Density Electric Current2022

    • Author(s)
      Daiki Saito, Kazuhiko Sasagawa, Takeshi Moriwaki, Kazuhiro Fujisaki
    • Journal Title

      ASME Journal of Electronic Packaging

      Volume: 144(4) Issue: 4

    • DOI

      10.1115/1.4053365

    • Related Report
      2021 Annual Research Report
    • Peer Reviewed
  • [Journal Article] Damage of Flexible Electronic Line Under Mechanical and Electrical Stress Loading2021

    • Author(s)
      Ryota Horiuchi, Kazuhiko Sasagawa, Kazuhiro Fujisaki
    • Journal Title

      Proc. of ASME InterPACK 2021

      Volume: -

    • DOI

      10.1115/ipack2021-68902

    • Related Report
      2021 Annual Research Report
    • Peer Reviewed
  • [Journal Article] Computational evaluation of optimal reservoir and sink lengths for threshold current density of electromigration damage considering void and hillock formation2021

    • Author(s)
      Ryuji Takaya, Kazuhiko Sasagawa, Takeshi Moriwaki, Kazuhiro Fujisaki
    • Journal Title

      Microelectronics Reliability

      Volume: 118 Pages: 114060-114060

    • DOI

      10.1016/j.microrel.2021.114060

    • Related Report
      2020 Research-status Report
    • Peer Reviewed
  • [Journal Article] Electromigration Damage of Flexible Electronic Lines Printed With Ag Nanoparticle Ink2020

    • Author(s)
      Daiki Saito, Kazuhiko Sasagawa ,Takeshi Moriwaki ,Kazuhiro Fujisaki
    • Journal Title

      Journal of Electronic Packaging

      Volume: 142 Issue: 3

    • DOI

      10.1115/1.4046849

    • Related Report
      2020 Research-status Report
    • Peer Reviewed
  • [Journal Article] 高密度電流下の銀ナノ粒子インク配線における凝集塊分布の観察2019

    • Author(s)
      斉藤 大輝,笹川 和彦,森脇 健司,藤﨑 和弘
    • Journal Title

      第29回マイクロエレクトロニクスシンポジウム論文集

      Volume: - Pages: 139-142

    • NAID

      40022301710

    • Related Report
      2019 Research-status Report
  • [Journal Article] Damege of Flexible Electronic Line Printed with Ag Nanoparticle Ink Due to High-Current Density2019

    • Author(s)
      Daiki Saito, Kazuhiko Sasagawa, Takeshi Moriwaki, Kazuhiro Fujisaki
    • Journal Title

      Proc. ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems

      Volume: -

    • Related Report
      2019 Research-status Report
    • Peer Reviewed
  • [Presentation] 高密度電流下フレキシブルAg配線の損傷に対する保護膜の影響2022

    • Author(s)
      工藤泰河, 笹川和彦, 藤崎和弘
    • Organizer
      日本機械学会東北支部 第52回学生員卒業研究発表講演会
    • Related Report
      2021 Annual Research Report
  • [Presentation] 高密度電流によるグラフェンインク配線の損傷2021

    • Author(s)
      大坪拓生, 笹川和彦, 森脇健司, 藤﨑和弘
    • Organizer
      日本実験力学会2021年度年次講演会
    • Related Report
      2021 Annual Research Report
  • [Presentation] 酸化インジウムスズ電子配線の高密度電流下における損傷機構の検討2021

    • Author(s)
      鈴木雄, 笹川和彦, 森脇健司, 藤﨑和弘
    • Organizer
      日本機械学会M&M2021材料力学カンファレンス
    • Related Report
      2021 Annual Research Report
  • [Presentation] フレキシブル基板上に印刷した導電性インク配線の高密度電流負荷試験2021

    • Author(s)
      大坪拓生,笹川和彦,森脇健司,藤崎和弘
    • Organizer
      日本機械学会東北学生会第51回学生員卒業研究発表講演会
    • Related Report
      2020 Research-status Report
  • [Presentation] 酸化インジウムスズ電子配線の高密度電流下における損傷評価2021

    • Author(s)
      鈴木 雄,森脇健司,笹川和彦,藤崎和弘
    • Organizer
      日本機械学会東北学生会第51回学生員卒業研究発表講演会
    • Related Report
      2020 Research-status Report
  • [Book] 金属ナノ粒子、微粒子の合成、調整と最新応用技術2021

    • Author(s)
      笹川和彦, 藤﨑和弘(分担執筆)
    • Total Pages
      558
    • Publisher
      技術情報協会
    • ISBN
      9784861048623
    • Related Report
      2021 Annual Research Report
  • [Remarks] 笹川研究室

    • URL

      http://www.mech.hirosaki-u.ac.jp/~sasagawa/labhp/index.html

    • Related Report
      2020 Research-status Report
  • [Remarks] 笹川・森脇研究室

    • URL

      http://www.mech.hirosaki-u.ac.jp/~sasagawa/labhp/index.html

    • Related Report
      2019 Research-status Report

URL: 

Published: 2019-04-18   Modified: 2024-01-30  

Information User Guide FAQ News Terms of Use Attribution of KAKENHI

Powered by NII kakenhi