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Development of electrochemical dry polishing method for GaN surface using solid polymer electrolyte

Research Project

Project/Area Number 19K04117
Research Category

Grant-in-Aid for Scientific Research (C)

Allocation TypeMulti-year Fund
Section一般
Review Section Basic Section 18020:Manufacturing and production engineering-related
Research InstitutionRitsumeikan University

Principal Investigator

Murata Junji  立命館大学, 理工学部, 准教授 (70531474)

Project Period (FY) 2019-04-01 – 2023-03-31
Project Status Completed (Fiscal Year 2022)
Budget Amount *help
¥4,290,000 (Direct Cost: ¥3,300,000、Indirect Cost: ¥990,000)
Fiscal Year 2021: ¥1,300,000 (Direct Cost: ¥1,000,000、Indirect Cost: ¥300,000)
Fiscal Year 2020: ¥1,300,000 (Direct Cost: ¥1,000,000、Indirect Cost: ¥300,000)
Fiscal Year 2019: ¥1,690,000 (Direct Cost: ¥1,300,000、Indirect Cost: ¥390,000)
Keywords研磨加工 / 陽極酸化 / 固体電解質 / 高分子電解質 / 電気化学機械研磨 / ワイドギャップ半導体 / 研磨 / 電解酸化 / 窒化ガリウム / 微細加工 / ポリシング
Outline of Research at the Start

次世代の光・電子デバイス用材料である窒化ガリウム(GaN)に対する,高効率・高精度表面加工技術の確立が求められている.本研究では,電気化学(電解)反応を利用した表面改質の導入により,化学的に安定なGaNの高効率加工法の開発を行う.これにより,電解処理に用いられる薬液を排除し,固体電解質がそれを代替できる.固体電解質表面で発生するラジカル種により,材料表面の凸部のみを選択的に改質し.その改質層を砥粒によって除去する.本研究では,(1) 固体電解質を用いた電解による表面改質,(2) 微粒子による改質層の除去からなる新たな電解援用ドライポリシング法を開発する.

Outline of Final Research Achievements

In this research, we proposed a novel environment-friendly electrochemical mechanical polishing using solid polymer electrolytes for high-efficiency finishing of wide-gap semiconductor materials. The ion conductive polishing pad that contains the solid polymer electrolyte and abrasive particles allows the polishing conducted without the use of harsh chemicals. The proposed method yields a 10-times higher material removal rate than the conventional polishing method and can reduce the surface roughness from approximately 50 nm to less than 1 nm within several minutes of polishing.

Academic Significance and Societal Importance of the Research Achievements

研究では、固体高分子電解質を用いた環境調和型電気化学機械研磨(ECMP)について提唱し、ワイドギャップ半導体の高効率な研磨法を実現した.本加工法は、高い加工速度が得られるためウェハ表面のダメージを高速に除去し、表面粗さも短時間で低減することができる。そのため、従来技術に比べて加工時間を大幅に短縮できる。また、薬液を一切用いないことから、廃液処理のコストも低減でき、環境負荷の少ないウェハ製造技術として期待できる。

Report

(5 results)
  • 2022 Annual Research Report   Final Research Report ( PDF )
  • 2021 Research-status Report
  • 2020 Research-status Report
  • 2019 Research-status Report
  • Research Products

    (21 results)

All 2023 2022 2021 2020

All Journal Article (6 results) (of which Peer Reviewed: 4 results,  Open Access: 1 results) Presentation (12 results) (of which Int'l Joint Research: 3 results) Patent(Industrial Property Rights) (3 results)

  • [Journal Article] Environment-friendly electrochemical mechanical polishing using solid polymer electrolyte/CeO2 composite pad for highly efficient finishing of 4H-SiC (0001) surface2023

    • Author(s)
      Murata Junji, Hayama Kenshin, Takizawa Masaru
    • Journal Title

      Applied Surface Science

      Volume: 625 Pages: 157190-157190

    • DOI

      10.1016/j.apsusc.2023.157190

    • Related Report
      2022 Annual Research Report
    • Peer Reviewed / Open Access
  • [Journal Article] Improvement in the polishing characteristics of titanium-based materials using electrochemical mechanical polishing2022

    • Author(s)
      Tsuji Atsuki, Jia Pengfei, Takizawa Masaru, Murata Junji
    • Journal Title

      Surfaces and Interfaces

      Volume: 35 Pages: 102490-102490

    • DOI

      10.1016/j.surfin.2022.102490

    • Related Report
      2022 Annual Research Report
    • Peer Reviewed
  • [Journal Article] Direct micropatterning on a titanium surface through electrochemical imprint lithography with a polymer electrolyte membrane stamp2022

    • Author(s)
      Jia Pengfei、Umezaki Ryohei、Murata Junji
    • Journal Title

      Microelectronic Engineering

      Volume: 257 Pages: 111752-111752

    • DOI

      10.1016/j.mee.2022.111752

    • Related Report
      2021 Research-status Report
  • [Journal Article] High-efficiency wafer-scale finishing of 4H-SiC (0001) surface using chemical-free electrochemical mechanical method with a solid polymer electrolyte2021

    • Author(s)
      Zulkifle Che Nor Syahirah Binti Che、Hayama Kenshin、Murata Junji
    • Journal Title

      Diamond and Related Materials

      Volume: 120 Pages: 108700-108700

    • DOI

      10.1016/j.diamond.2021.108700

    • Related Report
      2021 Research-status Report
  • [Journal Article] Electrochemical imprint lithography on Si surface using a patterned polymer electrolyte membrane2021

    • Author(s)
      Umezaki Ryohei、Murata Junji
    • Journal Title

      Materials Chemistry and Physics

      Volume: 259 Pages: 124081-124081

    • DOI

      10.1016/j.matchemphys.2020.124081

    • Related Report
      2020 Research-status Report
    • Peer Reviewed
  • [Journal Article] Investigation of Electrolytic Condition on Abrasive-Free Electrochemical Mechanical Polishing of 4H-SiC Using Ce Thin Film2020

    • Author(s)
      Murata Junji、Nagatomo Daiki
    • Journal Title

      ECS Journal of Solid State Science and Technology

      Volume: 9 Issue: 3 Pages: 034002-034002

    • DOI

      10.1149/2162-8777/ab7672

    • Related Report
      2019 Research-status Report
    • Peer Reviewed
  • [Presentation] 高分子電解質を用いた半固定砥粒パッドによる SiC の ECMP 特性2023

    • Author(s)
      稲田直希,村田順二
    • Organizer
      精密工学会関西地方定期学術講演会
    • Related Report
      2022 Annual Research Report
  • [Presentation] Electrochemical mechanical polishing using solid polymer electrolyte2022

    • Author(s)
      Junji Murata, Kenshin Hayama, Atsuki Tsuji
    • Organizer
      The 19th International Conference on Precision Engineering
    • Related Report
      2022 Annual Research Report
    • Int'l Joint Research
  • [Presentation] 固体高分子電解質を含浸させた半固定砥粒工具によるSiCのECMP 特性2021

    • Author(s)
      巴山顕真,稲田直希,村田順二
    • Organizer
      2021年度精密工学会秋季大会学術講演会
    • Related Report
      2021 Research-status Report
  • [Presentation] 高分子電解質を用いた電解援用研磨法の開発~難加工金属の平滑化への適用~2021

    • Author(s)
      辻淳喜,JIA Pengfei,村田順二
    • Organizer
      2021年度精密工学会秋季大会学術講演会
    • Related Report
      2021 Research-status Report
  • [Presentation] 天然由来結合剤を用いた酸化セリウム固定砥粒パッドによるガラス研磨特性2021

    • Author(s)
      村田順二,石丸太一,山﨑小有里
    • Organizer
      2021年度砥粒加工学会学術講演会
    • Related Report
      2021 Research-status Report
  • [Presentation] 高分子電解質を用いたワイドギャップ半導体の高能率電解複合研磨2021

    • Author(s)
      巴山顕真,チェノル シャヒラ ビンティ チェ ズルキフリ,村田順二
    • Organizer
      2021年度精密工学会春季大会学術講演会
    • Related Report
      2020 Research-status Report
  • [Presentation] 高分子電解質を用いたTiの電気化学的表面改質2021

    • Author(s)
      JIA Pengfei,梅崎凌平,村田順二
    • Organizer
      2021年度精密工学会春季大会学術講演会
    • Related Report
      2020 Research-status Report
  • [Presentation] 高分子電解質を用いた電気化学的インプリントリソグラフィ技術の開発2021

    • Author(s)
      梅崎凌平,土田ひなの,村田順二
    • Organizer
      2021年度精密工学会春季大会学術講演会
    • Related Report
      2020 Research-status Report
  • [Presentation] Liquid-electrolyte-free electrochemical surface finishing of GaN surface using a solid polymer electrolyte2020

    • Author(s)
      Junji Murata, Yoshito Nishiguchi
    • Organizer
      International Conference on Precision Engineering 2020 (ICPE2020)
    • Related Report
      2020 Research-status Report
    • Int'l Joint Research
  • [Presentation] Microstructure fabrication method using a novel electrolyte-free electrochemical treatment with patterned polymer electrolyte membranes2020

    • Author(s)
      Ryohei Umezaki, Junji Murata
    • Organizer
      International Conference on Precision Engineering 2020 (ICPE2020)
    • Related Report
      2020 Research-status Report
    • Int'l Joint Research
  • [Presentation] 固体高分子電解質を用いたGaNの電解アシスト複合研磨法の開発2020

    • Author(s)
      西口嘉人、村田順二
    • Organizer
      2020年度精密工学会春季大会学術講演会
    • Related Report
      2019 Research-status Report
  • [Presentation] 高分子電解質を用いた半導体の電解援用微細パターニング2020

    • Author(s)
      梅﨑凌平、村田順二
    • Organizer
      2020年度精密工学会春季大会学術講演会 学生会員卒研発表講演会
    • Related Report
      2019 Research-status Report
  • [Patent(Industrial Property Rights)] 研磨用パッド、導電性半導体基板の製造方法および研磨方法2021

    • Inventor(s)
      村田順二、巴山顕真、堀切文正
    • Industrial Property Rights Holder
      株式会社サイオクス
    • Industrial Property Rights Type
      特許
    • Industrial Property Number
      2021-133059
    • Filing Date
      2021
    • Related Report
      2021 Research-status Report
  • [Patent(Industrial Property Rights)] 研磨用パッド、および導電性半導体基板の製造方法2021

    • Inventor(s)
      村田順二ほか
    • Industrial Property Rights Holder
      サイオクス
    • Industrial Property Rights Type
      特許
    • Industrial Property Number
      2021-022970
    • Filing Date
      2021
    • Related Report
      2020 Research-status Report
  • [Patent(Industrial Property Rights)] 研磨用パッド、および導電性半導体基板の製造方法2020

    • Inventor(s)
      村田順二ほか
    • Industrial Property Rights Holder
      (株)サイオクス
    • Industrial Property Rights Type
      特許
    • Industrial Property Number
      2020-025916
    • Filing Date
      2020
    • Related Report
      2019 Research-status Report

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Published: 2019-04-18   Modified: 2024-01-30  

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