Development of MEMS Self-Destruction Design Technology for Secure IoT Devices
Project/Area Number |
19K05232
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Research Category |
Grant-in-Aid for Scientific Research (C)
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Allocation Type | Multi-year Fund |
Section | 一般 |
Review Section |
Basic Section 28050:Nano/micro-systems-related
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Research Institution | Ritsumeikan University (2020-2021) Tokyo Institute of Technology (2019) |
Principal Investigator |
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Project Period (FY) |
2019-04-01 – 2022-03-31
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Project Status |
Completed (Fiscal Year 2021)
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Budget Amount *help |
¥4,420,000 (Direct Cost: ¥3,400,000、Indirect Cost: ¥1,020,000)
Fiscal Year 2021: ¥520,000 (Direct Cost: ¥400,000、Indirect Cost: ¥120,000)
Fiscal Year 2020: ¥1,950,000 (Direct Cost: ¥1,500,000、Indirect Cost: ¥450,000)
Fiscal Year 2019: ¥1,950,000 (Direct Cost: ¥1,500,000、Indirect Cost: ¥450,000)
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Keywords | MEMS / 合金 / 可動配線 / 電解めっき / IoT / 自壊 / セキュア / 金合金 / MEMS / 疲労破壊 / 機械特性 / セキュアIoTデバイス / セキュリティ / ハードウェア |
Outline of Research at the Start |
本研究では,微小可動配線の振動疲労破壊モデルを構築し,マイクロ機械構造と電気回路の設計技術を用いて,小型IoT(Internet of Things)デバイスの自壊時限(使用寿命)をハードウェア構造のみ(破壊命令不要)で決定可能とします。例えば,環境埋込型IoTセンサの大量利用が予想される将来社会において,小型IoTデバイスのメンテナンスフリーかつ回収不要な自律的セキュリティ対策が必要です。しかしながら,現在では,ソフトウェアのセキュリティ強化手法が主に検討されています。そのため,ハードウェアの自律的なセキュリティ対策を実現する本研究手法は国内外で実施例がなく,世界に先駆けた研究です。
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Outline of Final Research Achievements |
The target Ni-based alloy micro-interconnections were fabricated by MEMS (micro-electro-mechanical systems) technology using electroplating. In addition, conditions for dry etching to remove the sacrificial layer were found to create movable structures of the alloy interconnections for self-destructive devices. To construct equivalent circuit models of MEMS self-destructive devices, we created equivalent circuit models of movable electrodes in a SPICE-based circuit simulator. Based on the findings of this study, a new device using plated metal micro-movable structures, an electrostatic MEMS vibration energy harvester without charging processes and its equivalent circuit model were developed.
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Academic Significance and Societal Importance of the Research Achievements |
学術的意義:本課題では、MEMS自壊素子について世界に先駆けて研究を着手した。研究期間内には、デバイス試作・設計環境構築、および、MEMS自壊素子に関する特許申請も行い、今後の研究展開の基盤技術を構築した。また、水平展開として、これまで未到であったMEMS環境振動発電素子と電子回路をワンチップ化の見通しを得た。 社会的意義:電解めっきを用いたMEMSデバイスと電子回路の集積化について、センサやアクチュエータに加えて発電素子も集積できる新たな応用技術の可能性を示すことができた。これは、小型センサの数が莫大に増加している昨今、小型無線IoTセンサの電源供給問題の解決に向けた技術進歩である。
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Report
(4 results)
Research Products
(67 results)
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[Journal Article] A MEMS Accelerometer for Sub-mG Sensing2019
Author(s)
Daisuke Yamane, Toshifumi Konishi, Teruaki Safu, Hiroshi Toshiyoshi, Masato Sone, Katsuyuki Machida, Hiroyuki Ito, Kazuya Masu
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Journal Title
Sensors and Materials
Volume: 31
Issue: 9
Pages: 2883
DOI
ISSN
0914-4935, 2435-0869
Year and Date
2019-09-20
Related Report
Peer Reviewed / Open Access
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[Journal Article] Cu-Alloying Effect on Structure Stability of Electrodeposited Gold-Based Micro-Cantilever Evaluated by Long-Term Vibration Test2019
Author(s)
Kyotaro Nitta, Tso-Fu Mark Chang, Koichiro Tachibana, Hao-chun Tang, Chun-Yi Chen, Shinichi Iida, Daisuke Yamane, Hiroyuki Ito, Katsuyuki Machida, Kazuya Masu, Masato Sone
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Journal Title
Microelectronic Engineering
Volume: 215
Pages: 111001-111001
DOI
Related Report
Peer Reviewed
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[Presentation] A 100-nG/√Hz-Level Single Au Proof-Mass 3-axis MEMS Accelerometer with Pillar-Shaped Electrodes2020
Author(s)
Takashi Ichikawa, Ken Atsumi, Tatsuya Koga, Daisuke Yamane, Shin-ichi Iida, Hiroyuki Ito, Noboru Ishihara, Katsuyuki Machida, and Kazuya Masu
Organizer
Design, Test, Integration & Packaging of MEMS/MOEMS(DTIP2020)
Related Report
Int'l Joint Research
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[Presentation] Effects of Sample Geometry and Grain Size on Mechanical Property of Electrodeposited Gold Evaluated By Micro-Bending Test2020
Author(s)
Kosuke Suzuki, Yu-An Chien, Ken Hashigata, Keisuke Asano, Chun-Yi Chen, Tso-Fu Mark Chang, Daisuke Yamane, Hiroyuki Ito, Katsuyuki Machida, Kazuya Masu and Masato Sone
Organizer
PRiME 2020 (ECS, ECSJ, & KECS Joint Meeting)
Related Report
Int'l Joint Research
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[Presentation] High-Sensitivity Inertial Sensor Module to Measure Hidden Micro Muscular Sounds2019
Author(s)
Tatsuya Koga, Takashi Ichikawa, Naoto Tanaka, Taiki Ogata, Hiroki Ora, Daisuke Yamane, Noboru Ishihara, Hiroyuki Ito, Masato Sone, Katsuyuki Machida, Yoshihiro Miyake, Kazuya Masu
Organizer
IEEE Biomedical Circuits and Systems Conference 2019 (BioCAS2019)
Related Report
Int'l Joint Research
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[Presentation] Sample Geometry Effect on Mechanical Property of Electrodeposited Gold Evaluated by Micro-Bending Test2019
Author(s)
Kosuke Suzuki, Ken Hashigata, Keisuke Asano, Chun-Yi Chen, Takashi Nagoshi, Tso-Fu Mark Chang, Daisuke Yamane, Hiroyuki Ito, Katsuyuki Machida, Kazuya Masu, Masato Sone
Organizer
45th International Conference on Micro & Nano Engineering (MNE2019)
Related Report
Int'l Joint Research
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[Presentation] Mechanical properties of gold micro-cantilevers with different thickness evaluated by micro-bending test2019
Author(s)
Kosuke Suzuki, Ken Hashigata, Keisuke Asano, Chun-Yi Chen, Takanshi Nagoshi, Tso-Fu Mark Chang, Daisuke Yamane, Toshifumi Konishi, Hiroyuki Ito, Katsuyuki Machida, Kazuya Masu, Masato Sone
Organizer
The 2nd International Conference on Material Strength and Applied Mechanics (MSAM 2019)
Related Report
Int'l Joint Research
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[Presentation] High Structure Stability Ti/Au Multiple Layer Micro-Cantilever and the Temperature Dependence2019
Author(s)
Hitomi Watanabe, Takuma Suzuki, Chun-Yi Chen, Takanshi Nagoshi, Tso-Fu Mark Chang, Daisuke Yamane, Toshifumi Konishi, Katsuyuki Machida, Hiroyuki Ito, Kazuya Masu, Masato Sone
Organizer
The 2nd International Conference on Material Strength and Applied Mechanics (MSAM 2019)
Related Report
Int'l Joint Research
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[Presentation] Mechanical properties of electrodeposited gold-copper alloy by micro-compression test2019
Author(s)
Masato Sone, Hao-Chun Tang, Masaharu Yoshiba, Chun-Yi Chen, Takanshi Nagoshi, Tso-Fu Mark Chang, Daisuke Yamane, Toshifumi Konishi, Hiroyuki Ito, Katsuyuki Machida, Kazuya Masu
Organizer
The 2nd International Conference on Material Strength and Applied Mechanics (MSAM 2019)
Related Report
Int'l Joint Research
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[Presentation] Pillar-Shaped Electrodes for 3-axis Gold-Proof-Mass MEMS Capacitive Accelerometers2019
Author(s)
Ken Atsumi, Shota Otobe, Tatsuya Koga, Takashi Ichikawa, Daisuke Yamane, Shinichi Iida, Hiroyuki Ito, Noboru Ishihara, Masato Sone, Katsuyuki Machida, Kazuya Masu
Organizer
Design, Test, Integration & Packaging of MEMS/MOEMS(DTIP2019)
Related Report
Int'l Joint Research
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[Presentation] 微弱筋音計測に向けた高分解能MEMS慣性センサモジュールの検討2019
Author(s)
古賀 達也, 市川 崇志, 田中 直登, 緒方 大樹, 大良 宏樹, 山根 大輔, 石原 昇, 伊藤 浩之, 曽根 正人, 町田 克之, 三宅 美博, 益 一哉
Organizer
第11回集積化MEMSシンポジウム
Related Report
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[Presentation] 3Dピラー型Au錘MEMS加速度センサ2019
Author(s)
市川 崇志, 乙部 翔太, 渥美 賢, 古賀 達也, 山根 大輔, 飯田 慎一, 伊藤 浩之, 石原 昇, 曽根 正人, 町田 克之, 益 一哉
Organizer
第36回「センサ・マイクロマシンと応用システム」シンポジウム
Related Report
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[Presentation] Au錘3軸MEMS加速度センサのためのSCD電極の検討 (2)2019
Author(s)
市川 崇志, 乙部 翔太, 渥美 賢, 古賀 達也, 山根 大輔, 飯田 慎一, 伊藤 浩之, 石原 昇, 町田 克之, 曽根 正人, 益 一哉
Organizer
第80回応用物理学会秋季学術講演会
Related Report
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