| Project/Area Number |
20246033
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| Research Category |
Grant-in-Aid for Scientific Research (A)
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| Allocation Type | Single-year Grants |
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| Section | 一般 |
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| Research Field |
Production engineering/Processing studies
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| Research Institution | Kyushu University |
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Principal Investigator |
DOI Toshiro Kyushu University, 大学院・工学研究院, 教授 (30207675)
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| Co-Investigator(Kenkyū-buntansha) |
KUROKAWA Syuhei 九州大学, 大学院・工学研究院, 准教授 (90243899)
UMEZAKI Yoji 九州大学, 大学院・工学研究院, 助教 (70038066)
鬼鞍 宏猷 九州大学, 大学院・工学研究院, 教授 (90108655)
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| Project Period (FY) |
2008 – 2010
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| Project Status |
Completed (Fiscal Year 2010)
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| Budget Amount *help |
¥28,730,000 (Direct Cost: ¥22,100,000、Indirect Cost: ¥6,630,000)
Fiscal Year 2010: ¥1,430,000 (Direct Cost: ¥1,100,000、Indirect Cost: ¥330,000)
Fiscal Year 2009: ¥12,870,000 (Direct Cost: ¥9,900,000、Indirect Cost: ¥2,970,000)
Fiscal Year 2008: ¥14,430,000 (Direct Cost: ¥11,100,000、Indirect Cost: ¥3,330,000)
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| Keywords | CMP / 密閉型加工 / 密閉雰囲気 / 光触媒反応 / Si / SiC / 加工レート / ベルジャー密閉型 / 高圧ガス雰囲気と減圧雰囲気 / 光触媒反応の援用 / 両面同時加工 / 多枚数同時加工 / 難加工材料 / 雰囲気制御加工 / 電解CMP / 高圧酸素雰囲気 |
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| Research Abstract |
Based on the characteristics and mechanism of CMP (Chemical Mechanical Polishing) obtained through the experiments, we have designed and manufactured a prototype of a sealed, bell-jar shaped, both-side simultaneous CMP machine. This innovative machine, assisted by the photocatalytic reactions inside the sealed Bell-Jar chamber while ultra-violet being applied, has realized integration of high efficiency CMP and both-side simultaneous polishing into one machine. This integrated machine provides 4.5 times higher polishing efficiency with hard-to-process SiC wafers than that of the conventional machine, and consequently, is drawing attentions from the industries as next generation CMP machine.
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