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Development of a new Chemical Mechanical Polishing (CMP) machine, assisted by the photocatalytic reactions and electrolytic actions in the atmosphere controlled sealed CMP chamber

Research Project

Project/Area Number 20246033
Research Category

Grant-in-Aid for Scientific Research (A)

Allocation TypeSingle-year Grants
Section一般
Research Field Production engineering/Processing studies
Research InstitutionKyushu University

Principal Investigator

DOI Toshiro  Kyushu University, 大学院・工学研究院, 教授 (30207675)

Co-Investigator(Kenkyū-buntansha) KUROKAWA Syuhei  九州大学, 大学院・工学研究院, 准教授 (90243899)
UMEZAKI Yoji  九州大学, 大学院・工学研究院, 助教 (70038066)
鬼鞍 宏猷  九州大学, 大学院・工学研究院, 教授 (90108655)
Project Period (FY) 2008 – 2010
Project Status Completed (Fiscal Year 2010)
Budget Amount *help
¥28,730,000 (Direct Cost: ¥22,100,000、Indirect Cost: ¥6,630,000)
Fiscal Year 2010: ¥1,430,000 (Direct Cost: ¥1,100,000、Indirect Cost: ¥330,000)
Fiscal Year 2009: ¥12,870,000 (Direct Cost: ¥9,900,000、Indirect Cost: ¥2,970,000)
Fiscal Year 2008: ¥14,430,000 (Direct Cost: ¥11,100,000、Indirect Cost: ¥3,330,000)
KeywordsCMP / 密閉型加工 / 密閉雰囲気 / 光触媒反応 / Si / SiC / 加工レート / ベルジャー密閉型 / 高圧ガス雰囲気と減圧雰囲気 / 光触媒反応の援用 / 両面同時加工 / 多枚数同時加工 / 難加工材料 / 雰囲気制御加工 / 電解CMP / 高圧酸素雰囲気
Research Abstract

Based on the characteristics and mechanism of CMP (Chemical Mechanical Polishing) obtained through the experiments, we have designed and manufactured a prototype of a sealed, bell-jar shaped, both-side simultaneous CMP machine. This innovative machine, assisted by the photocatalytic reactions inside the sealed Bell-Jar chamber while ultra-violet being applied, has realized integration of high efficiency CMP and both-side simultaneous polishing into one machine. This integrated machine provides 4.5 times higher polishing efficiency with hard-to-process SiC wafers than that of the conventional machine, and consequently, is drawing attentions from the industries as next generation CMP machine.

Report

(4 results)
  • 2010 Annual Research Report   Final Research Report ( PDF )
  • 2009 Annual Research Report
  • 2008 Annual Research Report
  • Research Products

    (46 results)

All 2011 2010 2009 2008 Other

All Journal Article (7 results) (of which Peer Reviewed: 5 results) Presentation (31 results) Book (7 results) Remarks (1 results)

  • [Journal Article] Polishing/CMP for Glass Substrates in a Radical Polishing Environment, Using Manganese Oxide Slurry as an Alternative for Ceria Slurry2010

    • Author(s)
      T.Doi, T.Yamazaki, S.Kurokawa, Y.Umezaki, O.Ohnishi,Y.Akagami, Y.Yamaguchi, S.Kishii
    • Journal Title

      Advances in Science and Technology Vol.64

      Pages: 65-70

    • Related Report
      2010 Final Research Report
  • [Journal Article] Basic Characteristics of a Simultaneous Double-side CMP Machine, Housed in a Sealed,Pressure-Resistance Container2010

    • Author(s)
      K.Kitamura, T.Doi, S.Kurokawa, Y.Umezaki, Y.Matsukawa, Y.Ooki, T.Hasegawa, I.Koshiyama, K.Ichikawa, Y.Nakamura
    • Journal Title

      Key Engineering Materials Vols.447-448

      Pages: 61-65

    • Related Report
      2010 Final Research Report
  • [Journal Article] Characteristics of a Simultaneous Double-side CMP Machine, Housed in a Sealed, Pressure-Resistance Container2010

    • Author(s)
      K.Kitamura, T.Doi, et al.
    • Journal Title

      Key Engineering Materials

      Volume: 447-448 Pages: 61-65

    • Related Report
      2010 Annual Research Report
    • Peer Reviewed
  • [Journal Article] Study on the Development of Resource-Saving High Performance Slurry -Polishing/CMP for glass substrates in a radical polishing environment, using manganese oxide slurry as an alternative for ceria slurry-2010

    • Author(s)
      T.Doi, T.Yamazaki, S.Kurokawa, Y.Umezaki, et al.
    • Journal Title

      Advances in Science and Technology

      Volume: 64 Pages: 65-70

    • Related Report
      2010 Annual Research Report
    • Peer Reviewed
  • [Journal Article] Polishing Characteristics of Optoelectronics Materials by Bell-jar-shaped CMP Machine under the Controlled Working Atmosphere2009

    • Author(s)
      土肥俊郎
    • Journal Title

      Proceeding of First International Symposium on Atomically Controlled Fabrication Technology 1

      Pages: 12-13

    • Related Report
      2008 Annual Research Report
    • Peer Reviewed
  • [Journal Article] CMP of SiC Wafers as a Post-Si Power-Device-Photocatalitic reaction assisted Bell-Jar shaped CMP machine under high pressure oxygen gas-2008

    • Author(s)
      土肥俊郎, 黒河周平
    • Journal Title

      Proceeding of The 5^<th> International Conference on Planarization/CMP Technology (ICPT 2008) 1

      Pages: 2-2

    • Related Report
      2008 Annual Research Report
    • Peer Reviewed
  • [Journal Article] Si CMP with a sealed “Bell Jar"type CMP machine-Processing characteristics of Si-CMP, influenced by the processing atmosphere and additives dispersed in the slurry-2008

    • Author(s)
      木原丈晴, 土肥俊郎, 他7名
    • Journal Title

      Proceeding of The 5^<th> International Symposium on Advanced Science and Technology of Silicon Materials (JSPS Si Symposium) 1

      Pages: 98-102

    • Related Report
      2008 Annual Research Report
    • Peer Reviewed
  • [Presentation] 酸化マンガン系スラリーを用いたSiC単結晶基板の精密加工プロセスに関する研究-密閉型加工環境コントロールCMP装置による加工-2011

    • Author(s)
      長谷川正, 土肥俊郎, 黒河周平, 大西修, 河瀬康弘, 尹涛, 山崎努, 岸井貞浩
    • Organizer
      日本機械学会九州支部講演会
    • Place of Presentation
      九州大学(福岡)
    • Year and Date
      2011-03-17
    • Related Report
      2010 Final Research Report
  • [Presentation] 加工環境を制御したCMP装置によるSiCウエハの高能率加工に関する研究-コロイダルシリカとダイヤモンド微粒子スラリーを用いた加工特性-2011

    • Author(s)
      尹涛, 土肥俊郎, 黒河周平, 大西修, 山崎努, 北村圭, 長谷川正
    • Organizer
      日本機械学会九州支部講演会
    • Place of Presentation
      九州大学(福岡)
    • Year and Date
      2011-03-17
    • Related Report
      2010 Final Research Report
  • [Presentation] 密閉耐圧チャンバー型両面同時CMP装置の開発-各種加工雰囲気下でのSiおよびSiCウエハのCMP特性と光触媒援用CMPの可能性について-2011

    • Author(s)
      北村圭, 土肥俊郎, 黒河周平, 大西修, 尹涛, 長谷川正, 越山勇, 市川浩一郎
    • Organizer
      日本機械学会九州支部講演会
    • Place of Presentation
      九州大学(福岡)
    • Year and Date
      2011-03-17
    • Related Report
      2010 Final Research Report
  • [Presentation] 耐圧密閉チャンバー型CMP装置を用いた加工環境制御下における加工特性2011

    • Author(s)
      江頭峻輝, 土肥俊郎, 黒河周平, 大西修, 山崎努
    • Organizer
      日本機械学会九州学生会第42回卒業研究発表講演会
    • Place of Presentation
      大分工業高等専門学校(大分)
    • Year and Date
      2011-03-11
    • Related Report
      2010 Final Research Report
  • [Presentation] 酸化マンガン系スラリーを用いたSiC単結晶基板の精密加工-密閉型加工環境コントロールCMP装置による加工特性-2011

    • Author(s)
      長谷川正, 土肥俊郎, 黒河周平, 大西修, 山崎努, 尹涛, 河瀬康弘, 山口靖英, 岸井貞浩
    • Organizer
      2011年度精密工学会春季大会学術講演会
    • Place of Presentation
      東洋大学(東京)
    • Related Report
      2010 Final Research Report
  • [Presentation] SiC単結晶基板の酸化マンガン系スラリーによる精密加工プロセスに関する研究2010

    • Author(s)
      長谷川正, 土肥俊郎, 黒河周平, 大西修, 河瀬康弘, 山口靖英, 岸井貞浩
    • Organizer
      2010年度精密工学会九州支部熊本地方講演会
    • Place of Presentation
      熊本大学(熊本)
    • Year and Date
      2010-12-11
    • Related Report
      2010 Final Research Report
  • [Presentation] Chemical Mechanical Polishing (CMP) of Silicon Carbide (SiC) with Manganese Oxide Slurry -Polishing Characteristics under High Pressure Gas Atmosphere Inside the Bell-Jar (Chamber) Shaped CMP Machine-2010

    • Author(s)
      T.Hasegawa, T.Doi, S.Kurokawa, O.Ohnishi, T.Yamazaki, Y.Kawase, Y.Yamaguchi, S.Kishi
    • Organizer
      International Conference on Planarization/CMP Technology
    • Place of Presentation
      Phoenix, Arizona (USA)
    • Related Report
      2010 Final Research Report
  • [Presentation] Characteristics of Silicon CMP Performed in Various High Pressure Atmospheres -Development of a New Double-side Simultaneous CMP Machine Housed in a High Pressure Chamber-2010

    • Author(s)
      K.Kitamura, T.Doi, S.Kurokawa, O.Ohnishi, Y.Umezaki, T.Yamazaki, Y.Matsukawa, T.Hasegawa, I.Koshiyama, K.Ichikawa
    • Organizer
      Advanced Metallization Conference
    • Place of Presentation
      東京大学(大学)
    • Related Report
      2010 Final Research Report
  • [Presentation] SiC-CMP Characteristics under High Pressure Gas Atmospheres using Manganese Slurry2010

    • Author(s)
      T.Hasegawa, T.Doi, S.Kurokawa, O.Ohnishi, Y.Kawase, Y.Yamaguchi, S.Kishii
    • Organizer
      Advanced Metallization Conference
    • Place of Presentation
      東京大学(大学)
    • Related Report
      2010 Final Research Report
  • [Presentation] Characteristics of Silicon CMP performed in various high pressure atmospheres-Development of a new double-side simultaneous CMP machine housed in a high pressure chamber2010

    • Author(s)
      K.Kitamura, T.Doi, S.Kurokawa, O.Ohnishi, Y.Umezaki, T.Yamazaki, Y.Matsukawa, T.Hasegawa, I.Koshiyama, K.Ichikawa
    • Organizer
      Advanced Metallization Conference 2010 : 20^<th> Asian Session)
    • Place of Presentation
      東京大学(大学)
    • Related Report
      2010 Final Research Report
  • [Presentation] SiC-CMP characteristics under high pressure gas atmospheres using manganese slurry2010

    • Author(s)
      T.Hasegawa, T.Doi, S.Kurokawa, O.Ohnishi, Y.Kawase, Y.Yamaguchi, S.Kishii
    • Organizer
      Advanced Metallization Conference
    • Place of Presentation
      東京大学(大学)
    • Related Report
      2010 Final Research Report
  • [Presentation] Study on the Development of Resource-Saving High Performance Slurry - Polishing/CMP for glasssubstrates in a radical polishing environment2010

    • Author(s)
      T.Doi, T.Yamazaki, S.Kurokawa, Y.Umezaki, O.Ohnishi,Y.Akagami, Y.Yamaguchi, S.Kishii
    • Organizer
      using manganese oxide slurry as an alternative for ceria slurry-, CIMTEC2011 12th International Ceramics Congress
    • Place of Presentation
      Montecatine Terme, Itary
    • Related Report
      2010 Final Research Report
  • [Presentation] ガラス基板の研磨とラジカル環境場の効果-酸化セリウム系スラリーと酸化マンガン系スラリーによるCMP特性-2010

    • Author(s)
      山崎努, 土肥俊郎, 黒河周平, 大西修, 梅崎洋二, 松川洋二, 山口靖英, 岸井貞浩
    • Organizer
      2010年度精密工学会秋季大会学術講演会
    • Place of Presentation
      名古屋大学(名古屋
    • Related Report
      2010 Final Research Report
  • [Presentation] 4酸化マンガン系スラリーを用いたSiC基板の精密加工プロセスに関する研究-ベルジャー型加工機を用いた各種加工雰囲2010

    • Author(s)
      長谷川正, 土肥俊郎, 黒河周平, 大西修, 梅崎洋二, 山崎努, 北村圭, 河瀬康弘, 岸井貞浩
    • Organizer
      2010年度精密工学会秋季大会学術講演会
    • Place of Presentation
      名古屋大学(名古屋
    • Related Report
      2010 Final Research Report
  • [Presentation] Basic Characteristics of a Simultaneous Double-side CMP Machine, Housed in a Sealed, Pressure-Resistance Container2010

    • Author(s)
      K.Kitamura, T.Doi, et al.
    • Organizer
      International Conference on Precision Engineering (ICoPE2010 & 13th ICPE)
    • Place of Presentation
      Singapore
    • Related Report
      2010 Annual Research Report
  • [Presentation] Polishing/CMP for glass substrates in a radical polishing environment, using manganese oxide slurry as an alternative for ceria slurry2010

    • Author(s)
      T.Doi, T.Yamazaki, S.Kurokawa, Y.Umezaki, et al.
    • Organizer
      Proc.of CIMTEC2010 (12th International Ceramics Congress)
    • Place of Presentation
      Itary
    • Related Report
      2010 Annual Research Report
  • [Presentation] Characteristics of Silicon CMP Performed in Various High Pressure Atmospheres- Development of a new double-side simultaneous CMP machine, housed in a high pressure chamber-2010

    • Author(s)
      K.Kitamura, T.Doi, et al.
    • Organizer
      Advanced Metallization Conference (ADMETA) 2010 : 20^<th> Asian Session
    • Place of Presentation
      Tokyo, Japan
    • Related Report
      2010 Annual Research Report
  • [Presentation] SiC-CMP characteristics under high pressure gas atmospheres using manganese slurry2010

    • Author(s)
      H.Hasegawa, T.Doi, et al.
    • Organizer
      Advanced Metallization Conference (ADMETA) 2010 : 20^<th> Asian Session
    • Place of Presentation
      Tokyo, Japan
    • Related Report
      2010 Annual Research Report
  • [Presentation] Chemical Mechanical Polishing (CMP) of Silicon Carbide (SiC) with Manganese Oxide Slurry---Polishing Characteristics under High Pressure Gas Atmosphere Inside the Bell-Jar (Chamber) Shaped CMP Machine---2010

    • Author(s)
      H.Hasegawa, T.Doi, et al.
    • Organizer
      International Conference on Planarization/CMP Technology (ICPT) 2010
    • Place of Presentation
      Phoenix, USA
    • Related Report
      2010 Annual Research Report
  • [Presentation] Characteristics of Micro Fiber Pads in Electro-Chemical Mechanical Polishing(E-CMP)of Copper Substrates,2010

    • Author(s)
      T.HASEGAWA, T.Doi, et al.
    • Organizer
      International Symposium on Technology of Mechanical Design and Production 2010,
    • Place of Presentation
      Jinjy, Korea
    • Related Report
      2009 Annual Research Report
  • [Presentation] Polishing Characteristics of Optoelectronics Materials by Bell-jar-shaped CMP Machine under the Controlled Working Atmosphere2009

    • Author(s)
      土肥 俊郎
    • Organizer
      First International Symposium on Atomically Controlled Fabrication Technology
    • Place of Presentation
      大阪大学
    • Year and Date
      2009-02-16
    • Related Report
      2008 Annual Research Report
  • [Presentation] CMP of SiC Wafers as a Post-Si Power-Device (Bell-Jar shaped CMP machine assisted by photocatalitic reactions under high pressure oxygen gas and CMP characteristics of functional material2009

    • Author(s)
      土肥俊郎, 黒河周平
    • Organizer
      The 1st International Conference on Surface and Interface Fabrication Techonologies (ICSIF)
    • Place of Presentation
      (独)理化学研究所(埼玉)
    • Related Report
      2010 Final Research Report
  • [Presentation] Electro-Chemical Mechanical Polishing(E-CMP)of Copper Substrates with Micro Fiber Pad2009

    • Author(s)
      T.Hasegawa, T.Doi, et al.
    • Organizer
      International Conference on Planarization/CMP Technology 2009
    • Place of Presentation
      Fukuoka, Japan
    • Related Report
      2009 Annual Research Report
  • [Presentation] CMP of SiC Wafers as a Post-Si Power-Device-Bell-Jar shaped CMP machine, assisted by photocatalitic reactions under high pressure oxygen gas, and CMP Characteristics of functional materials-2009

    • Author(s)
      T.Doi, S.Kurokawa
    • Organizer
      1^<st> International Conference on Surface and Interface Fabrication Techonologies(ICSIF)
    • Place of Presentation
      RIKEN Wako Institute Welfare and Conference Building, Japan
    • Related Report
      2009 Annual Research Report
  • [Presentation] Cu-CMP Characteristics by Controlled Atmosphere polishin Machine and Effect of High Pressure CO_2 Gas2009

    • Author(s)
      Y.Oki, T.Doi, et al.
    • Organizer
      International Conference on Planarization/CMP Technology 2009
    • Place of Presentation
      Fukuoka, Japan
    • Related Report
      2009 Annual Research Report
  • [Presentation] ベルジャー密閉型CMPシステムによる付加作用の効果に関する研究2008

    • Author(s)
      大木洋太, 土肥俊郎, 他4名
    • Organizer
      2008年度精密工学会福岡地方講演会
    • Place of Presentation
      九州大学
    • Year and Date
      2008-12-07
    • Related Report
      2008 Annual Research Report
  • [Presentation] 加工環境コントロールによる機能性材料の加工に関する研究2008

    • Author(s)
      木原丈晴, 土肥俊郎, 他5名
    • Organizer
      2008年度精密工学会福岡地方講演会
    • Place of Presentation
      九州大学
    • Year and Date
      2008-12-07
    • Related Report
      2008 Annual Research Report
  • [Presentation] Si CMP with a sealed“Bell Jar"type CMP machine-Processing characteristics of Si-CMP, influenced by the processing atmosphere and additives dispersed in the slurry-2008

    • Author(s)
      木原丈晴, 土肥俊郎, 他7名
    • Organizer
      The 5^<th> International Symposium on Advanced Science and Technology of Silicon Materials (JSPS Si Symposium)
    • Place of Presentation
      Hawaii (America)
    • Year and Date
      2008-11-11
    • Related Report
      2008 Annual Research Report
  • [Presentation] CMP of SiC Wafers as a Post-Si Power-Device-Photocatalitic reaction assisted Bell-Jar shaped CMP Machine under high pressure oxygen gas-2008

    • Author(s)
      土肥俊郎, 黒河周平
    • Organizer
      The 5^<th> International Conference on Planarization/CMP Technology (ICPT2008)
    • Place of Presentation
      台湾・新竹市
    • Year and Date
      2008-11-10
    • Related Report
      2008 Annual Research Report
  • [Presentation] CMP of SiC Wafers as a Post-Si Power-Device -Photocatalitic Reaction Assisted Bell-Jar shaped CMP Machine under High Pressure Oxygen Gas-2008

    • Author(s)
      土肥俊郎, 黒河周平
    • Organizer
      International Conference on Planarization/CMP Technology
    • Place of Presentation
      Congress Center,浜松(静岡)
    • Related Report
      2010 Final Research Report
  • [Presentation] Si CMP with a Sealed "Bell-Jar" Type CMP Machine -Proc. Characteristics of Si-CMP, Influenced by the Processing Atmosphere and Additives Dispersed in the Slurry-2008

    • Author(s)
      T.Kihara, T.Doi, S.Kurokawa, Y.Ooki, Y.Umezaki, Y.Matsukawa, K.Ichikawa, I.Koshiyama, H.Kohno
    • Organizer
      The 5^<th> International Symposium on Advanced Science and Technology of Silicon Materials
    • Place of Presentation
      Kona, Hawaii (USA)
    • Related Report
      2010 Final Research Report
  • [Book] 超精密研磨/CMP技術とその最新動向(その1)-研磨の発展経緯と加工原理-第55巻第11号2010

    • Author(s)
      土肥俊郎, 黒河周平, 大西修, 山崎努
    • Publisher
      トライボロジスト
    • Related Report
      2010 Final Research Report
  • [Book] 超精密研磨/CMP技術とその最新動向(その-最新のCMP技術とトライボケミカル応用-第55巻第11号2010

    • Author(s)
      土肥俊郎, 黒河周平, 大西修, 山崎努
    • Publisher
      トライボロジスト
    • Related Report
      2010 Final Research Report
  • [Book] 高圧酸素環境場で光触媒反応を重畳させた革新的加工法-密閉式ベルジャ型CMP装置-113,11042010

    • Author(s)
      土肥俊郎
    • Total Pages
      896
    • Publisher
      日本機械学会誌
    • Related Report
      2010 Final Research Report
  • [Book] 超精密研磨/CMP技術とその最新動向(その2)-最新のCMP技術とトライボケミカル応用-2010

    • Author(s)
      土肥俊郎, 黒河周平, 大西修, 山崎努
    • Total Pages
      72
    • Publisher
      日本トライボロジー学会
    • Related Report
      2010 Annual Research Report
  • [Book] 高圧酸素環境場で光触媒反応を重畳させた革新的加工法-密閉式ベルジャ型CMP装置-2010

    • Author(s)
      土肥俊郎
    • Total Pages
      98
    • Publisher
      日本機械学会誌
    • Related Report
      2010 Annual Research Report
  • [Book] ものづくりのイノベーションとそのサステナビリティを目指して第75巻,第6号2009

    • Author(s)
      土肥俊郎, 黒河周平, 梅崎洋二
    • Publisher
      精密工学会誌
    • Related Report
      2010 Final Research Report
  • [Book] 平坦化CMP装置,電子材料(12月号別冊超LSI製造・試験装置ガイドブック)2008

    • Author(s)
      土肥俊郎, 黒河周平
    • Related Report
      2010 Final Research Report
  • [Remarks]

    • URL

      http://premach903.mech.kyushu-u.ac.jp/

    • Related Report
      2010 Annual Research Report

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Published: 2008-04-01   Modified: 2016-04-21  

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