Research on three dimensional wiring by 3-D patterning and vertical shape forming technologies.
| Project/Area Number |
20360116
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| Research Category |
Grant-in-Aid for Scientific Research (B)
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| Allocation Type | Single-year Grants |
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| Section | 一般 |
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| Research Field |
Intelligent mechanics/Mechanical systems
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| Research Institution | Kagawa University |
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Principal Investigator |
OOHIRA Fumikazu Kagawa University, 工学部, 教授 (80325315)
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| Co-Investigator(Kenkyū-buntansha) |
SASAKI Minoru 豊田工業大学, 工学部, 教授 (70282100)
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| Co-Investigator(Renkei-kenkyūsha) |
MIHARA Yutaka 香川大学, 工学部, 特命教授 (50314901)
YOSIMURA Hidenori 香川大学, 工学部, 准教授 (30314412)
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| Project Period (FY) |
2008 – 2010
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| Project Status |
Completed (Fiscal Year 2010)
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| Budget Amount *help |
¥19,110,000 (Direct Cost: ¥14,700,000、Indirect Cost: ¥4,410,000)
Fiscal Year 2010: ¥5,460,000 (Direct Cost: ¥4,200,000、Indirect Cost: ¥1,260,000)
Fiscal Year 2009: ¥7,930,000 (Direct Cost: ¥6,100,000、Indirect Cost: ¥1,830,000)
Fiscal Year 2008: ¥5,720,000 (Direct Cost: ¥4,400,000、Indirect Cost: ¥1,320,000)
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| Keywords | 三次元実装 / 垂直配線 / スプレーコート / 斜め露光 / 光モジュール / MEMS / 実装技術 / 配線形成 / 垂直面形成 |
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| Research Abstract |
The spray coating and inclined UV light exposure technologies were examined to realize the three dimensional wiring pattern. Also, electroplating condition was examined to form the wiring. The technologies were applied to the Chip on Glass optical module. The resistance of the wiring is 0.1～0.2Ω, and also reliability was good. As the result, these technologies can be applicable to the three dimensional wiring. Further, the high aspect ratio vertical Si shape could be formed by the unisotropic wet etching.
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Report
(4 results)
Research Products
(15 results)
