| Budget Amount *help |
¥19,110,000 (Direct Cost: ¥14,700,000、Indirect Cost: ¥4,410,000)
Fiscal Year 2010: ¥5,460,000 (Direct Cost: ¥4,200,000、Indirect Cost: ¥1,260,000)
Fiscal Year 2009: ¥7,930,000 (Direct Cost: ¥6,100,000、Indirect Cost: ¥1,830,000)
Fiscal Year 2008: ¥5,720,000 (Direct Cost: ¥4,400,000、Indirect Cost: ¥1,320,000)
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| Research Abstract |
The spray coating and inclined UV light exposure technologies were examined to realize the three dimensional wiring pattern. Also, electroplating condition was examined to form the wiring. The technologies were applied to the Chip on Glass optical module. The resistance of the wiring is 0.1～0.2Ω, and also reliability was good. As the result, these technologies can be applicable to the three dimensional wiring. Further, the high aspect ratio vertical Si shape could be formed by the unisotropic wet etching.
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