| Project/Area Number |
20560098
|
|---|
| Research Category |
Grant-in-Aid for Scientific Research (C)
|
| Allocation Type | Single-year Grants |
|---|
| Section | 一般 |
|---|
| Research Field |
Materials/Mechanics of materials
|
|---|
| Research Institution | Hyogo Prefectural Institute of Technology |
|---|
Principal Investigator |
NOZAKI Mineo Hyogo Prefectural Institute of Technology, 技術支援部, 主任研究員 (10470238)
|
|---|
| Co-Investigator(Renkei-kenkyūsha) |
SAKANE Masao 立命館大学, 理工学部, 教授 (20111130)
|
|---|
| Project Period (FY) |
2008 – 2010
|
| Project Status |
Completed (Fiscal Year 2010)
|
| Budget Amount *help |
¥3,640,000 (Direct Cost: ¥2,800,000、Indirect Cost: ¥840,000)
Fiscal Year 2010: ¥1,560,000 (Direct Cost: ¥1,200,000、Indirect Cost: ¥360,000)
Fiscal Year 2009: ¥1,040,000 (Direct Cost: ¥800,000、Indirect Cost: ¥240,000)
Fiscal Year 2008: ¥1,040,000 (Direct Cost: ¥800,000、Indirect Cost: ¥240,000)
|
|---|
| Keywords | 鉛フリーはんだ / 低サイクル疲労 / クリープ疲労 / 応力集中 / 相当ひずみ / 構成関係 |
|---|
| Research Abstract |
In recent years, operating condition of electronic devices is becoming increasingly severe due to the temperature raise with high density mounting of electronic devices. Solder connections in electronic devices are a key part for the quality assurance of electronic devices and the quality assurance of solder connection is strongly needed. Therefor, development of an accurate and efficient fatigue life estimation method applicable to solders is needed for the quality assurance of solder connections. In this study, a fatigue life estimation method for Sn-3.5Ag solder was developed based on the results of fatigue test using Sn-3.5Ag solder.
|
