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Analysis of micro fracture mechanism of mono-crystalline silicon by using extended analytical-solution-controlled molecular dynamics

Research Project

Project/Area Number 20560106
Research Category

Grant-in-Aid for Scientific Research (C)

Allocation TypeSingle-year Grants
Section一般
Research Field Production engineering/Processing studies
Research InstitutionNagoya Institute of Technology

Principal Investigator

INAMURA Toyoshiro  Nagoya Institute of Technology, 大学院・工学研究科, 教授 (60107539)

Co-Investigator(Kenkyū-buntansha) TAKEZAWA Nobuhiro  名古屋工業大学, 大学院・工学研究科, 助教 (50236452)
Project Period (FY) 2008 – 2010
Project Status Completed (Fiscal Year 2010)
Budget Amount *help
¥4,810,000 (Direct Cost: ¥3,700,000、Indirect Cost: ¥1,110,000)
Fiscal Year 2010: ¥650,000 (Direct Cost: ¥500,000、Indirect Cost: ¥150,000)
Fiscal Year 2009: ¥650,000 (Direct Cost: ¥500,000、Indirect Cost: ¥150,000)
Fiscal Year 2008: ¥3,510,000 (Direct Cost: ¥2,700,000、Indirect Cost: ¥810,000)
Keywords分子動力学 / 解析解 / 材料欠陥 / 破壊 / マイクロダイナミックス / ズーミング / モードIき裂先端場 / 粗視化 / 連続体 / 粒子間相互作用 / 繰り込み / 引張り破壊 / ヘルツ押し込み / クラック / シリコン / アモルファス / 欠陥 / 弾性波 / ヘルツ押込み / ミクロ
Research Abstract

In Hertz indentation of mono-crystalline silicon with no pre-existing defect, phase change from diamond to amorphous structures occurs beneath the indenter. Then the dynamic stress associating with the acoustic waves emitted from the amorphous area is combined with the static tensile stress around the indenter and causes local poly-crystallization so that voids are created when cross slips occur in the area. Three types of crack surfaces, mirror, mist and hackle appear depending on the amount of involved dynamic effect in crack propagation.

Report

(4 results)
  • 2010 Annual Research Report   Final Research Report ( PDF )
  • 2009 Annual Research Report
  • 2008 Annual Research Report
  • Research Products

    (10 results)

All 2010 2009 2008 Other

All Journal Article (8 results) (of which Peer Reviewed: 8 results) Presentation (1 results) Remarks (1 results)

  • [Journal Article] Mechanism of ring crack initiation in Hertz indentation of monocrystalline silicon analyzed by controlled molecular dynamics2010

    • Author(s)
      稲村豊四郎, 宍倉由記子, 武澤伸浩
    • Journal Title

      CHIP Annals-Manufacturing Technology Vol.59, No.1

      Pages: 559-562

    • Related Report
      2010 Final Research Report
    • Peer Reviewed
  • [Journal Article] 解析解制御MDによる単結晶シリコン押し込み時のリングクラック生成メカニズム解析2010

    • Author(s)
      宍倉由記子、武澤伸浩、稲村豊四郎
    • Journal Title

      精密工学会誌 Vol.76, No.4

      Pages: 420-427

    • NAID

      130000421799

    • Related Report
      2010 Final Research Report
    • Peer Reviewed
  • [Journal Article] Ring crack initiation in micrometer-scale Hertz indentation simulated by controlled molecular dynamics2010

    • Author(s)
      稲村豊四郎, 宍倉由記子, 武澤伸浩
    • Journal Title

      The international journal of nanomanufacturing Vo1.6, No.1

      Pages: 12-21

    • Related Report
      2010 Final Research Report
    • Peer Reviewed
  • [Journal Article] Mechanism of ring crack initiation in Hertz indentation of monocrystalline silicon analyzed by controlled molecular dynamics2010

    • Author(s)
      T.Inamura, Y.Shishikura, N.Takezawa
    • Journal Title

      CIRP Annals-Manufacturing Technology

      Volume: 59/1 Pages: 559-562

    • Related Report
      2010 Annual Research Report
    • Peer Reviewed
  • [Journal Article] 解析解制御MDによる単結晶シリコン押し込み時のリングクラック生成メカニズム解析2010

    • Author(s)
      宍倉由記子, 武澤伸浩, 稲村豊四郎
    • Journal Title

      精密工学会誌 76

      Pages: 420-427

    • NAID

      130000421799

    • Related Report
      2009 Annual Research Report
    • Peer Reviewed
  • [Journal Article] Digital microscope observation of the initial stage of cutting monocrystalline silicon2009

    • Author(s)
      稲村豊四郎, 宍倉由記子, 武澤伸浩
    • Journal Title

      CIRP Annals Manufacturing Technology Vo1.58, No.1

      Pages: 69-72

    • Related Report
      2010 Final Research Report
    • Peer Reviewed
  • [Journal Article] Digital microscope observation of the initial stage of cutting monocrystalline silicon2009

    • Author(s)
      稲村豊四郎, 宍倉由記子, 武澤伸浩
    • Journal Title

      CIRP Annals Manufacturing Technology 58/1

      Pages: 69-72

    • Related Report
      2009 Annual Research Report
    • Peer Reviewed
  • [Journal Article] Digital microscope observation of the initial stage of cutting monocrystalline silicon2009

    • Author(s)
      T. Inamura, Y. Shishikura, N. Takezawa
    • Journal Title

      Annals of the CIRP 58/1

      Pages: 69-72

    • Related Report
      2008 Annual Research Report
    • Peer Reviewed
  • [Presentation] 有限要素解で制御されたMDによる単結晶Siの切削メカニズム解析2008

    • Author(s)
      宍倉由記子、大久保正慈、伊藤正樹、武澤伸浩、稲村豊四郎
    • Organizer
      精密工学会
    • Place of Presentation
      東北大学工学部
    • Year and Date
      2008-09-19
    • Related Report
      2010 Final Research Report 2008 Annual Research Report
  • [Remarks] ホームページ等

    • Related Report
      2010 Final Research Report

URL: 

Published: 2008-04-01   Modified: 2016-04-21  

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