| Project/Area Number |
20560671
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| Research Category |
Grant-in-Aid for Scientific Research (C)
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| Allocation Type | Single-year Grants |
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| Section | 一般 |
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| Research Field |
Material processing/treatments
|
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| Research Institution | Osaka University |
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Principal Investigator |
YASUDA Kiyokazu Osaka University, 工学研究科, 講師 (00210253)
|
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| Co-Investigator(Kenkyū-buntansha) |
FUJIMOTO Kozo 大阪大学, 大学院・工学研究科, 教授 (70135664)
MATSUSHIMA Michiya 大阪大学, 大学院・工学研究科, 助教 (90403154)
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| Project Period (FY) |
2008 – 2010
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| Project Status |
Completed (Fiscal Year 2010)
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| Budget Amount *help |
¥4,680,000 (Direct Cost: ¥3,600,000、Indirect Cost: ¥1,080,000)
Fiscal Year 2010: ¥650,000 (Direct Cost: ¥500,000、Indirect Cost: ¥150,000)
Fiscal Year 2009: ¥1,950,000 (Direct Cost: ¥1,500,000、Indirect Cost: ¥450,000)
Fiscal Year 2008: ¥2,080,000 (Direct Cost: ¥1,600,000、Indirect Cost: ¥480,000)
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| Keywords | 微細加工 / 微細接続 / マイクロ接合 / ぬれ / 表面張力 / 自己形成 / 自己組織化 / はんだ / 高密度実装 / 材料加工・処理 / ナノ材料 / 自己集積 / レプリケーション / 電子材料 |
|---|
| Research Abstract |
In order to make a batch of multi-point fine bumps (protruding electrodes) as the fundamental electrode structure of electronic devices, self-formation method was conducted. With a micro optical recording by a CCD camera, the observation of the wetting behavior of fine molten droplets on metal electrodes and morphological evaluation of bumps were conducted for the proper condition of the self-formation process.
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