Budget Amount *help |
¥4,290,000 (Direct Cost: ¥3,300,000、Indirect Cost: ¥990,000)
Fiscal Year 2009: ¥1,950,000 (Direct Cost: ¥1,500,000、Indirect Cost: ¥450,000)
Fiscal Year 2008: ¥2,340,000 (Direct Cost: ¥1,800,000、Indirect Cost: ¥540,000)
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Research Abstract |
In this study, we introduce of micro electro mechanical systems (MEMS) to conventional compound semiconductor laser structures. At first, we proposed and fabricated the MEMS-grating structure with comb drive actuators but the estimate of wavelength shifts is quite small. Therefore, in order to apply external force to multiple quantum well (MQW) structure by MEMS, we developed the surface active bonding technology and compound semiconductor chips were successfully bonded on silicon. We also measured optical emitting by current injection from silicon to MQW.
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