Slicing of silicon by direct irradiation of laser beam transmitted through optical fiber

Research Project

Project/Area Number	20760082
Research Category	Grant-in-Aid for Young Scientists (B)
Allocation Type	Single-year Grants
Research Field	Production engineering/Processing studies
Research Institution	Tokyo Institute of Technology
Principal Investigator	HIDAI Hirofumi Tokyo Institute of Technology, 大学院・理工学研究科, 助教 (60313334)
Project Period (FY)	2008 – 2009
Project Status	Completed (Fiscal Year 2009)
Budget Amount *help	¥4,160,000 (Direct Cost: ¥3,200,000、Indirect Cost: ¥960,000) Fiscal Year 2009: ¥1,950,000 (Direct Cost: ¥1,500,000、Indirect Cost: ¥450,000) Fiscal Year 2008: ¥2,210,000 (Direct Cost: ¥1,700,000、Indirect Cost: ¥510,000)
Keywords	レーザ / ファイバ / スライス / シリコン / スライシング / 光アシストエッチング
Research Abstract	Solar cells and semiconductor substrates are manufactured by sliding ingots. Nowadays ingots are sliced by wire saw. Kerf loss by the slicing was approximately half of the ingots and the reduction of kerf loss is strongly required. In this project the reduction of karf loss was tried by using the laser light delivered through optical fibers.