Study on electro plating and etching for metal interconnect in integrated circuit assisted with ArF excimer laser
| Project/Area Number |
20760086
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| Research Category |
Grant-in-Aid for Young Scientists (B)
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| Allocation Type | Single-year Grants |
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| Research Field |
Production engineering/Processing studies
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| Research Institution | Kyushu Institute of Technology |
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Principal Investigator |
KHAJORNRUNGRUANG Panart Kyushu Institute of Technology, 先端金型センター, 助教 (60404092)
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| Research Collaborator |
KANZAKI Masato 九州工業大学, 機械情報工学科, 学部4年生
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| Project Period (FY) |
2008 – 2009
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| Project Status |
Completed (Fiscal Year 2009)
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| Budget Amount *help |
¥3,120,000 (Direct Cost: ¥2,400,000、Indirect Cost: ¥720,000)
Fiscal Year 2009: ¥1,170,000 (Direct Cost: ¥900,000、Indirect Cost: ¥270,000)
Fiscal Year 2008: ¥1,950,000 (Direct Cost: ¥1,500,000、Indirect Cost: ¥450,000)
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| Keywords | ナノ・マイクロ加工 / ナノ構造作製 / 光応用加工 / 紫外光 / エッチング / めっき / リソグラフィ / ナノ槽造作製 |
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| Research Abstract |
The aim of this work is to establish a technology which can fabricate metallic interconnection pattern directly on wafer surface by assisting with ultra violet laser irradiation. By irradiating the UV laser on the wafer surface dipped in process solution, the region to be irradiated would be locally plated or etched. This technique could realize the fabrication of metallic interconnection pattern used in integrated circuit. At present circumstance, UV laser irradiation can enhance the local etching. The copper on wafer was etched by not only use of the chemical solution, but also use of ultra pure water. The etching rate in ultra pure water was 10 nm/min, when applying the dual UV laser beam exposure (under the conditions of λ=193nm, 4mJ/pulse ; 100pulse/sec). Main issues of this technology are the transmissivity of the short wavelength of UV laser in process solutions and the process control of enhancement or inhibition in different compounding process solution.
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Report
(3 results)
Research Products
(10 results)
