ポリマー繊維整然配列によってヒドロゲル熱伝導率の研究について
| Project/Area Number |
20J22608
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| Research Category |
Grant-in-Aid for JSPS Fellows
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| Allocation Type | Single-year Grants |
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| Section | 国内 |
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| Review Section |
Basic Section 19020:Thermal engineering-related
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| Research Institution | The University of Tokyo |
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Principal Investigator |
GUO RULEI 東京大学, 工学系研究科, 特別研究員(DC1)
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| Project Period (FY) |
2020-04-24 – 2023-03-31
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| Project Status |
Completed (Fiscal Year 2022)
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| Budget Amount *help |
¥3,100,000 (Direct Cost: ¥3,100,000)
Fiscal Year 2022: ¥1,000,000 (Direct Cost: ¥1,000,000)
Fiscal Year 2021: ¥1,000,000 (Direct Cost: ¥1,000,000)
Fiscal Year 2020: ¥1,100,000 (Direct Cost: ¥1,100,000)
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| Keywords | TDTR / Thermal conductivity / TR-MOKE / Wafer bonding / TBC / Graphene / FDTR / Mapping |
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| Outline of Research at the Start |
Recently hydrogel incorporated electronics and devices have emerged to be a new class of flexible/stretchable electronics and ionic devices due to their extraordinary properties, such as softness, mechanically robustness, and biocompatibility. However, the thermal conductivity of hydrogel is low, which may limit its future application in soft electronics. To deal with this problem, This research will carry out a joint simulation, experiment, and material informatics investigation into enhancing the thermal conductivity of hydrogels through aligning polymer chains.
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| Outline of Annual Research Achievements |
1.The building of the time-domain thermoreflectance (TDTR) thermal property measurement system. Thermal property measurement is essential for understanding the transport and interaction processes of heat carriers and developing novel materials with desired thermal properties. Among the numerous measurement methods, TDTR offers unique advantages, including easy sample preparation, non-contact measurement, wide applicability, specific suitability for ultrathin films, thermal boundary conductance (TBC) measurement, and probing the ultrafast transport process. A TDTR measurement system with controll and data process programm has been developed with some new features, such as multiple objective lenses, wide range of modulation frequency, mapping sample stage, TDTR and TR-MOKE dual detectors.
2.The TBC measurement of wafer bonding. In recent years, thermal management has become increasingly important for large-scale integrated circuits with the rising density of FETs integrated both horizontally and vertically in a limited space (3D ICs). Wafer bonding technology, which connects the device layer to a substrate with high thermal conductivity, holds promise for solving this issue. In that case, the thermal boundary conductance (TBC) of the interface between the two bonded wafers plays a vital role in thermal management performance. In this study, we developed a mapping system to obtain not only the value of TBC but also the spatial distribution of TBC of the Si-SiC sample, providing more detailed and stochastic knowledge about thermal transport at the interface.
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| Research Progress Status |
令和4年度が最終年度であるため、記入しない。
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| Strategy for Future Research Activity |
令和4年度が最終年度であるため、記入しない。
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Report
(3 results)
Research Products
(3 results)
