Three-Dimensionarlly Stacked Optoelectronic System-on-Chip Fabricated Using Grapho-Assembly

• Project/Area Number: 21226009
• Research Category: Grant-in-Aid for Scientific Research (S)
• Allocation Type: Single-year Grants
• Research Field: Electron device/Electronic equipment
• Research Institution: Tohoku University
• Principal Investigator: KOYANAGI Mitsumasa 東北大学, 未来科学技術共同研究センター, 教授 (60205531)
• Co-Investigator(Kenkyū-buntansha): FUKUSHIMA Takafumi 東北大学, 未来科学技術共同研究センター, 准教授 (10374969) ; TANAKA Testu 東北大学, 大学院医工学研究科, 教授 (40417382) ; HANE Kazuhiro 東北大学, 大学院工学研究科, 教授 (50164893) ; MIURA Hideo 東北大学, 大学院工学研究科, 教授 (90361112) ; PEI Yanli 東北大学, 国際高等研究教育機構, 助教 (70451622) ; KIYOYAMA Kouji 長崎総合科学大学, 工学部, 准教授 (60412722)
• Project Period (FY): 2009-05-11 – 2014-03-31
• Project Status: Completed (Fiscal Year 2013)
• Budget Amount: ¥212,030,000 (Direct Cost: ¥163,100,000、Indirect Cost: ¥48,930,000); Fiscal Year 2013: ¥12,740,000 (Direct Cost: ¥9,800,000、Indirect Cost: ¥2,940,000); Fiscal Year 2012: ¥20,540,000 (Direct Cost: ¥15,800,000、Indirect Cost: ¥4,740,000); Fiscal Year 2011: ¥28,860,000 (Direct Cost: ¥22,200,000、Indirect Cost: ¥6,660,000); Fiscal Year 2010: ¥81,510,000 (Direct Cost: ¥62,700,000、Indirect Cost: ¥18,810,000); Fiscal Year 2009: ¥68,380,000 (Direct Cost: ¥52,600,000、Indirect Cost: ¥15,780,000)
• Keywords: グラフォアセンブリー / セルフアセンブリー / 三次元集積化 / 光電子集積化 / スーパーチップ / シリコン貫通配線 / 光電子集積システム・オン・チップ

Research Abstract

Key technologies to achieve a 3D-stacked optoelectronic system-on-a chip (SOC) have been studied focusing on new grapho-assembly technology to achieve 3D stacking with high alignment accuracy and new 3D silicon photonics. We formed micro/nano-scale concavo-convex patterns on both upper and lower silicon chip surfaces and then these chips were precisely aligned making use of surface tension of liquid in the gapho-assembly. A high alignment accuracy of less than 0.1um has been achieved using the gapho-assembly. We have developed new technologies of TSPV (Through Si Photonic Via) and UDOC (Uni-Directional Optical Coupler). We successfully fabricated TSPV with a diameter of 10um showing excellent optical confinement. We proposed and fabricated a new optical grating coupler with side mirror. We confirmed that vertical optical signal propagated through TSPV was coupled to horizontal Si nano optical waveguide using this optical grating coupler with high coupling efficiency of more than 80%.

Assessment Rating

Verification Result (Rating)

A

Research Products

• [Journal Article] Reconfigured-Wafer-to-Wafer 3D Integration Using Parallel Self-Assembly of Chips With Cu-SnAg Microbumps and a Nonconductive Film (2014)
  • Author(s): Takafumi Fukushima, Ji Cheol Bea, Hisashi Kino, Chisato Nagai, Mariappan Murugesan, Hideto Hashiguchi, Kang-Wook Lee, Tetsu Tanaka, and Mitsumasa Koyanagi
  • Journal Title: IEEE TRANSACTIONS ON ELECTRON DEVICES Volume: Vol.61, No.2 Issue: 2 Pages: 533-539
  • DOI: 10.1109/ted.2013.2294831
  • Peer Reviewed
• [Journal Article] Die-Level 3-D Integration Technology for Rapid Prototyping of High -Performance Multifunctionality Hetero-Integrated Systems (2013)
  • Author(s): Kang-Wook Lee, Yuki Ohara, Kouji Kiyoyama, Ji-Cheol Bea, Mariappan Murugesan,Takafumi Fukushima, Tetsu Tanaka, and Mitsumasa Koyanagi
  • Journal Title: IEEE TRANSACTIONS ON ELECTRON DEVICES Volume: VOL.60, NO.11 Issue: 11 Pages: 3842-3848
  • DOI: 10.1109/ted.2013.2280273
  • Peer Reviewed
• [Journal Article] 3D Integration Technologies Using Self-Assembly and Electrostatic Temporary Multichip Bonding (2013)
  • Author(s): T.Fukusima, H.Hashiguchi, J.Bea, M.Mururesan, K-W.Lee, T.Tanaka, and M.Koyanagi
  • Journal Title: Proc.of IEEE 63rd ECTC Volume: VOL.63 Pages: 58-63
  • DOI: 10.1109/ectc.2013.6575550
  • Peer Reviewed
• [Journal Article] Improvement of the Reliability of TSV Interconnections by Controlling Crystallinity of Electroplated Copper Thin Films (2013)
  • Author(s): Ryosuke Furuya, Chuanhong Fan, Osamu Asai, Ken Suzuki, and Hideo Miura
  • Journal Title: Proc. of IEEE 63rd ECTC Volume: Vol.63 Pages: 635-640
  • DOI: 10.1109/ectc.2013.6575640
  • Peer Reviewed
• [Journal Article] Wavelength characteristics of gap-variable silicon nanowire waveguide coupler switch using micro actuator (2013)
  • Author(s): Y.Munemasa, Y.Akihama, K.Hane
  • Journal Title: IEEEJ Trans. Sensors Micromachines Volume: vol.133 Pages: 85-89
  • NAID: 10031155390
  • Peer Reviewed
• [Journal Article] Reductant-Assisted Self-Assembly with Cu/Sn Microbump for Three-Dimensional Heterogeneous Integration (2013)
  • Author(s): Yuka Ito, Takafumi Fukushima, Kang-Wook Lee, Koji Choki, Tetsu Tanaka, and Mitsumasa Koyanagi
  • Journal Title: Japanese Journal of Applied Physics (JJAP) Volume: 52 Issue: 4S Pages: 04CB09-04CB09
  • DOI: 10.7567/jjap.52.04cb09
  • NAID: 210000141985
  • Peer Reviewed
• [Journal Article] Flux-Assisted Self-Assembly with Microbump Bonding for 3D Heterogeneous Integration (2013)
  • Author(s): Yuka Ito, Takafumi Fukushima, Kang-Wook Lee, Koji Choki, Tetsu Tanaka, Mitsumasa Koyanagi
  • Journal Title: Proc. of IEEE 63rd ECTC Volume: 63 Pages: 891-896
  • Peer Reviewed
• [Journal Article] IMPROVEMENT OF MECHANICAL RELIABILITY OF 3D ELECTRONIC PACKAGING BY CONTROLLING THE MECHANICAL PROPERTIES OF ELECTROPLATED MATERIALS (2013)
  • Author(s): Ken Suzuki, Hideo Miura
  • Journal Title: Proc. of ASME IMECE2013 Volume: 2013-73150
  • Peer Reviewed
• [Journal Article] 半導体実装用めっき銅薄膜強度物性の微細組織依存性 (2013)
  • Author(s): 遠藤史明，古屋亮輔，鈴木研，三浦英生
  • Journal Title: 電子情報通信学会論文誌C Volume: J96-C Pages: 400-408
  • Peer Reviewed
• [Journal Article] A tunable notch filter using microelectromechanical microring with gap-variable busline coupler (2013)
  • Author(s): T. Ikeda, K. Hane
  • Journal Title: Optics Express Volume: 21 Issue: 19 Pages: 22034-22042
  • DOI: 10.1364/oe.21.022034
  • Peer Reviewed
• [Journal Article] Transmisison-width-tunable silicon-photonic microelectromechanical ring resonator (2013)
  • Author(s): M. Ordu, K. Hane
  • Journal Title: IEEE Photonics Technology Letters Volume: 25 Issue: 22 Pages: 2236-2238
  • DOI: 10.1109/lpt.2013.2285130
  • Peer Reviewed / Open Access
• [Journal Article] Electric feed-through for vacuum package using double-side anodic bonding of silicon-on-insulator wafer (2013)
  • Author(s): H.M.Chu, H.N.Vu, K.Hane
  • Journal Title: J. Electrostatics Volume: 71 Issue: 2 Pages: 130-133
  • DOI: 10.1016/j.elstat.2012.12.028
  • Peer Reviewed
• [Journal Article] New Chip -to-Wafer 3D Integration Technology Using Hybrid Self-Assembly and Electrostatic Temporary Bonding (2012)
  • Author(s): T. Fukushima, H. Hashiguchi, J. Bea, Y. Ohara, M. Murugesan, K.-W. Lee, T. Tanaka, and M.Koyanagi
  • Journal Title: 2012 IEEE International Electron Devices Meeting Technical Digest (IEDM) Volume: - Pages: 789-792
  • DOI: 10.1109/iedm.2012.6479157
  • Peer Reviewed
• [Journal Article] Multichip-to-Wafer Three-Dimensional Integration Technology Using Chip Self-Assembly With Excimer Lamp Irradiation (2012)
  • Author(s): Takafumi Fukushima, Eiji Iwata, Yuki Ohara, Mariappan Murugesan, Jichoel Bea, Kangwook Lee, Tetsu Tanaka, and Mitsumasa Koyanagi
  • Journal Title: IEEE TRANSACTIONS ON ELECTRON DEVICES Volume: VOL.59(11) Issue: 11 Pages: 2956-2963
  • DOI: 10.1109/ted.2012.2212709
  • Peer Reviewed
• [Journal Article] Minimization of the Local Residual Stress in 3D Flip Chip Structures by Optimizing the Mechanical Properties of Electroplated Materials and the Alignment Structure of TSVs and Fine Bumps (2012)
  • Author(s): Kota Nakahira, Hironori Tago, Ken Suzuki, Hideo Miura, Fumiaki Endo
  • Journal Title: J. of Electronic Packaging Volume: VOL.134(2) Issue: 2
  • DOI: 10.1115/1.4006142
  • Peer Reviewed
• [Journal Article] Through-Silicon Photonic Via and Unidirectional- Coupler for High-Speed Data Transmission in Optoelectronic Three- Dimensional LSI (2012)
  • Author(s): Akihiro Noriki, Kangwook Lee, Jicheol Bea, Takafumi Fukushima, Tetsu Tanaka, and Mitsumasa Koyanagi
  • Journal Title: IEEE ELECTRON DEVICES LETTERS Volume: Vol.33 Issue: 2 Pages: 221-223
  • DOI: 10.1109/led.2011.2174608
  • Peer Reviewed
• [Journal Article] Single and multiple optical switches that use freestanding silicon nanowire waveguide couplers (2012)
  • Author(s): Y.Akihama, K.Hane
  • Journal Title: Light: Science Applications Volume: 1 Issue: 6 Pages: e16-e16
  • DOI: 10.1038/lsa.2012.16
  • Peer Reviewed
• [Journal Article] めっき銅薄膜配線ストレスマイグレーション支配因子の解明 (2012)
  • Author(s): 齋藤直樹，村田直一，玉川欣治，鈴木研，三浦英生
  • Journal Title: 電子情報通信学会論文誌C Volume: J95-C Pages: 351-357
  • NAID: 110009543936
  • Peer Reviewed
• [Journal Article] Low-Resistance Cu-Sn Electroplated Evaporated Microbumps for 3D Chip Stacking (2012)
  • Author(s): M. MURUGESAN, Y. OHARA, T. FUKUSHIMA, T. TANAKA, and M. KOYANAGI
  • Journal Title: Journal of ELECTRONIC MATERIALS Volume: Vol.41(4) Issue: 4 Pages: 720-729
  • DOI: 10.1007/s11664-012-1949-1
  • Peer Reviewed
• [Journal Article] Evaluation of the Crystallinity of Grain Boundaries of Electronic Copper Thin Films for Highly Reliable Interconnections (2012)
  • Author(s): Naoki Saito, Naokazu Murata, Kinji Tamakawa, Ken Suzuki, and Hideo Miura
  • Journal Title: Proc. of IEEE 62nd Electronic Components and Technology Conference Volume: - Pages: 1153-1158
  • DOI: 10.1109/ectc.2012.6248981
  • Peer Reviewed
• [Journal Article] Non-Conductive Film and Compression Molding Technology for Self-Assembly-Based 3D Integration (2012)
  • Author(s): T. Fukushima, Y. Ohara, J. Bea, M. Murugesan, K.-W. Lee, T. Tanaka, and M. Koyanagi
  • Journal Title: Proc. of IEEE 62nd Electronic Components and Technology Conference Volume: - Pages: 393-398
  • DOI: 10.1109/ectc.2012.6248860
  • Peer Reviewed
• [Journal Article] High-step-coverage Cu-lateral interconnections over 100 μm thick chips on a polymer substrate-an alternative method to wire bonding (2012)
  • Author(s): M Murugesan, T Fukushima, K Kiyoyama, J C Bea, T Tanaka and M Koyanagi
  • Journal Title: JOURNAL of Micromechanics and Microengineering Volume: Vol.22(8) Issue: 8 Pages: 085033-085033
  • DOI: 10.1088/0960-1317/22/8/085033
  • Peer Reviewed
• [Journal Article] Minimizing the Local Deformation Induced around Cu-TSVs and CuSn/InAu-Microbumps in High-Density 3D-LSIs (2012)
  • Author(s): M. Murugesan, H. Kobayashi, H. Shimamoto, F. Yamada, T. Fukushima, J.C. Bea, K.W. Lee, T. Tanaka, and M. Koyanagi
  • Journal Title: 2012 IEEE International Electron Devices Meeting Technical Digest (IEDM) Volume: - Pages: 657-660
  • DOI: 10.1109/iedm.2012.6479124
  • Peer Reviewed
• [Journal Article] Ultra-small silicon waveguide coupler switch using gap-variable mechanism (2011)
  • Author(s): Y.Akihama, Y.Kanamori, K.Hane
  • Journal Title: Optics Express Volume: 1.19, 11 Issue: 24 Pages: 23658-23663
  • DOI: 10.1364/oe.19.023658
  • Year and Date: 2011-11-07
  • Peer Reviewed
• [Journal Article] Multichip Self-Assembly Technology for Advanced Die-to-Wafer 3-D Integration to Precisely Align Known Good Dies in Batch Processing (2011)
  • Author(s): Takafumi Fukushima, Eiji Iwata, Yuki Ohara, Mariappan Murugesan, Jichoel Bea, Kangwook Lee, Tetsu Tanaka, and Mitsumasa Koyanagi
  • Journal Title: IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY Volume: VOL.1 Issue: 12 Pages: 1873-1884
  • DOI: 10.1109/tcpmt.2011.2160266
  • Peer Reviewed
• [Journal Article] Three-Dimensional Hybrid Integration Technology of CMOS, MEMS, and Photonics Circuits for Optoelectronic Heterogeneous Integrated Systems (2011)
  • Author(s): Kang-Wook Lee, Akihiro Noriki, Kouji Kiyoyama, Takafumi Fukushima, Tetsu Tanaka, and Mitsumasa Koyanagi
  • Journal Title: IEEE TRANSACTIONS ON ELECTRON DEVICES Volume: 58 Issue: 3 Pages: 748-757
  • DOI: 10.1109/ted.2010.2099870
  • Peer Reviewed
• [Journal Article] 三次元集積化技術とヘテロインテグレーション (2011)
  • Author(s): 小柳光正, 福島誉史, 李康旭, 田中徹
  • Journal Title: 電子情報通信学会論文誌C(電子デバイスの高速・高密度実装とインテグレーション技術論文特集) Volume: Vol.J94-C(招待論文) Pages: 355-364
  • NAID: 110008761537
  • Peer Reviewed
• [Journal Article] 微細Si貫通ビアによる三次元インタコネクト技術 (2011)
  • Author(s): 小柳光正, 田中徹
  • Journal Title: 電子情報通信学会誌(インタコネクション技術小特集) Volume: Vol.94(招待論文) Pages: 1027-1032
  • NAID: 110008799241
  • Peer Reviewed
• [Journal Article] Three-Dimensional Hybrid Integration Technology of CMOS, MEMS, and Photonics Circuits for Optoelectronic Heterogeneous Integrated Systems (2011)
  • Author(s): Kang-Wook Lee, Akihiro Noriki, Kouji Kiyoyama, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
  • Journal Title: IEEE TRANSACTIONS ON ELECTRON DEVICES Volume: Vol.58 Pages: 748-757
  • Peer Reviewed
• [Journal Article] Surface-tensiondriven chip self-assembly with load-free hydrogen fluoride-assisted direct bonding at room temperature for three-dimensional integrated circuits (2010)
  • Author(s): T. Fukushima, E. Iwata, T. Konno, J.-C. Bea, K.-W. Lee, T. Tanaka, and M. Koyanagi
  • Journal Title: Applied Physics Letters Volume: VOL.96 Issue: 15
  • DOI: 10.1063/1.3328098
  • Peer Reviewed
• [Journal Article] A Cavity Chip Interconnection Technology for Thick MEMS Chip Integration in MEMS-LSI Multichip Module (2010)
  • Author(s): Kang-Wook Lee, Soichiro Kanno, Kouji Kiyoyama, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
  • Journal Title: JOURNAL OF MICROELECTROMECHANICAL SYSTEMS Volume: Vol.19 Pages: 1284-1291
  • Peer Reviewed
• [Journal Article] 3D Hybrid Integration Technology for Opto-Electronic Hetero-Integrated Systems (2010)
  • Author(s): Kangwook Lee, Takafumi Fukushima, Tetsu Tanaka, Mitsuma Koyanagi
  • Journal Title: ECS (Electrochemical Society) Transactions Volume: Vol.33 Pages: 71-90
  • Peer Reviewed
• [Journal Article] Surface-tension-driven chip self-assembly with load-free hydrogen fluoride-assisted direct bonding at room temperature for three-dimensional integrated circuits (2010)
  • Author(s): T.Fukushima, E.Iwata, T.Konno, J.-C.Bea, K.-W.Lee, T.Tanaka, M.Koyanagi
  • Journal Title: Applied Physics Letters Volume: Vol.96
  • Peer Reviewed
• [Journal Article] Self-Assembly of Chip-Size Components with Cavity Structures : High-Precision Alignment and Direct Bonding without Thermal Compression for Hetero Integration (2010)
  • Author(s): Takafumi Fukushima, Takayuki Konno, Eiji Iwata, Risato Kobayashi, Toshiya Kojima, Mariappan Murugesan, Ji-Chel Bea, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi
  • Journal Title: Micromachines Volume: Vol.2 Pages: 49-68
  • Peer Reviewed
• [Journal Article] Effect of the Mechanical Properties of Underfill on the Local Deformation and Residual Stress in a Chip Mounted by Area-Arrayed Flip Chip Structures (2010)
  • Author(s): Kohta Nakahira, Yuki Sato, Hiroki Kishi, Ken Suzuki, Hideo Miura
  • Journal Title: Proc.of 11th International conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro/Nanoelectronics and Systems Pages: 641-646
  • Peer Reviewed
• [Journal Article] Nondestructive Evaluation of the Delamination of Fine Bumps in Three-Dimensionally Stacked Flip Chip Structures (2010)
  • Author(s): Yuhki Sato, Naokazu Murata, Kinji Tamakawa, Ken Suzuki, Hideo Miura
  • Journal Title: Proc.of the 60^<th> Electronic Components and Technology Conference Pages: 1951-1956
  • Peer Reviewed
• [Journal Article] Phase-shifter using submicron silicon waveguide couplers with ultra-small eletro-mechanical actuator (2010)
  • Author(s): Taro Ikeda, Kazunori Takahashi, Yoshiaki Kanamori, Kazuhiro Hane
  • Journal Title: Optics Express Volume: vol.18 Pages: 7031-7037
  • Peer Reviewed
• [Journal Article] 三次元積層型集積回路のための自己組織化チップ位置合わせ技術 (2010)
  • Author(s): 岩田永司、福島誉史、大原悠希、李康旭、田中徹、小柳光正
  • Journal Title: 電子情報通信学会論文誌C Volume: Vol.J93-C Pages: 493-502
  • Peer Reviewed
• [Journal Article] 極限集積化を目指すスーパーチップ (2010)
  • Author(s): 小柳光正、福島誉史、李康旭、田中徹
  • Journal Title: 電子情報通信学会誌 Volume: Vol.93(招待論文) Pages: 918-922
  • NAID: 110007880868
• [Journal Article] 3次元積層型集積回路に向けた自己組織化チップ実装技術 (2010)
  • Author(s): 福島誉史、李康旭、田中徹、小柳光正
  • Journal Title: 電子材料 Volume: Vol.49 Pages: 17-24
• [Journal Article] Optical Interposer Technology Using Buried Vertical-Cavity Surface-Emitting Laser Chip and Tapered Through-Silicon Via for High-Speed Chip-to-Chip Optical Interconnection (2009)
  • Author(s): Akihiro Noriki, Makoto Fujiwara, Kang-Wook Lee, Woo-Cheol Jeong, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
  • Journal Title: Japanese Journal of Applied Physics Volume: VOL.48 Issue: 4S Pages: 04C113-04C113
  • DOI: 10.1143/jjap.48.04c113
  • NAID: 210000066624
  • Peer Reviewed
• [Journal Article] High-Density Through Silicon Vias for 3-D LSIs (2009)
  • Author(s): MITSUMASA KOYANAGI, TAKAFUMI FUKUSHIMA, TETSU TANAKA
  • Journal Title: Proceedings of THE IEEE 97 Pages: 49-59
  • Peer Reviewed
• [Journal Article] 三次元積層型チップのためのSi貫通ビア(TSV)形成技術 (2009)
  • Author(s): 福島誉史, 田中徹, 小柳光正
  • Journal Title: エレクトロニクス実装学会誌 12 Pages: 104-109
  • NAID: 110007122665
  • Peer Reviewed
• [Journal Article] Fundamental Study of Complementary Metal Oxide Semiconductor Image Sensor for Three-Dimensional Image Processing System (2009)
  • Author(s): Kenji Makita, Kouji Kiyoyama, Takeaki Sugimura, Kang Wook Lee, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
  • Journal Title: Japanese Journal of Applied Physics 48
  • NAID: 210000066588
  • Peer Reviewed
• [Journal Article] Optical Interposer Technology Using Buried Vertical-Cavity Surface-Emitting Laser Chip and Tapered Through-Silicon Via for High-Speed Chip-to-Chip Optical Interconnection (2009)
  • Author(s): Akihiro Noriki, Makoto Fujiwara, Kang-Wook Lee, Woo-Cheol Jeong, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
  • Journal Title: Japanese Journal of Applied Physics 48
  • NAID: 210000066624
  • Peer Reviewed
• [Journal Article] An ultarasmall wavelength-selective channel drop switch using a nanomechanical photonic crystal nanocavity (2009)
  • Author(s): Yoshiaki Kanamori, Kazunori Takahashi, Kazuhiro Hane
  • Journal Title: Applied Physics Letters 95(17) Pages: 171911-171913
  • Peer Reviewed
• [Journal Article] Effect of the Formation of the Intermetallic Compounds between a Tin Bump and an Electroplated Copper Thin Film on both the Mechanical and Electrical Properties of the Jointed Structure (2009)
  • Author(s): Seongcheol Jeong, Naokazu Murata, Yuki Sato, Ken Suzuki, Hideo Miura
  • Journal Title: Transaction of the Japan Institute of Electronics Packaging 2 Pages: 91-97
  • NAID: 130000254840
  • Peer Reviewed
• [Journal Article] ピエゾ抵抗ひずみセンサを用いたフリップチップ実装構造内局所2軸残留応力分布の測定 (2009)
  • Author(s): 佐々木拓也, 上田啓貴, 三浦英生
  • Journal Title: エレクトロニクス実装学会誌 12 Pages: 623-628
  • NAID: 110007465806
  • Peer Reviewed
• [Journal Article] 積層フリップチップ実装構造の残留応力低減構造に関する研究 (2009)
  • Author(s): 上田啓貴, 佐々木拓也, 三浦英生
  • Journal Title: エレクトロニクス実装学会誌 12 Pages: 519-525
  • NAID: 110007339289
  • Peer Reviewed
• [Journal Article] (2009)
  • Author(s): Mitsumasa Koyanagi, Co-editor/Author
  • Journal Title: Materials and Technologies for 3-D Integration(共著)(Material Research Society) Pages: 121-130
• [Presentation] Heterogeneous 3D Integration-Technology Enabler toward Future Super-Chip (Plenary Talk) (2013)
  • Author(s): Mitsumasa Koyanagi
  • Organizer: IEEE International Electron Devices Meeting 2013 (IEDM)
  • Place of Presentation: アメリカ、ワシントンD.C.
  • Year and Date: 2013-12-09
• [Presentation] 三次元集積化による超低消費電力化 (2013)
  • Author(s): 小柳 光正
  • Organizer: 第29回京都賞記念ワークショップ先端術部門
  • Place of Presentation: 京都
  • Year and Date: 2013-11-12
• [Presentation] Fabrication Tolerance Evaluation of High Efficient Unidirectional Optical Coupler for Though Silicon Photonic Via in Optoelectronic 3D-LSI (2012)
  • Author(s): A. Noriki, K. W. Lee, J. Bea, T. Fukushima, T. Tanaka and M. Koyanagi
  • Organizer: IEEE International 3D System Integration Conference (3DIC) 2011
  • Place of Presentation: 大阪
  • Year and Date: 2012-02-01
• [Presentation] High-Bandwidth Data Transmission of New Transceiver Module Through Optical Interconnection (2012)
  • Author(s): Y.Ito, S.Terada, S.Arai, K.Choki, T.Fukushima, M.Koyanagi
  • Organizer: IEEE International 3D System Integration Conference (3DIC)
  • Place of Presentation: Osaka
  • Year and Date: 2012-02-01
• [Presentation] Fabrication Tolerance Evaluation of High Efficient Unidirectional Optical Coupler for Though Silicon Photonic Via in Optoelectronic 3D-LSI (2012)
  • Author(s): A.Noriki, K.W.Lee, J.Bea, T.Fukushima, T.Tanaka, M.Koyanagi
  • Organizer: IEEE International 3D System Integration Conference (3DIC) 2011
  • Place of Presentation: Osaka
  • Year and Date: 2012-02-01
• [Presentation] Residual Stress in 3DICs by Controlling the Structures and Mechanical Properties of 3D Interconnections (2012)
  • Author(s): Kota Nakahira, Fumiaki Endo, Ryosuke Furuya, Ken Suzuki, Hideo Miura
  • Organizer: IEEE International 3D System Integration Conference (3DIC)
  • Place of Presentation: Osaka
  • Year and Date: 2012-01-31
• [Presentation] Mechanical and Electrical Reliability of Copper Interconnections for 3DIC (2012)
  • Author(s): Naoki Saito, Naokazu Murata, Kinji Tamakawa, Ken Suzuki, Hideo Miura
  • Organizer: IEEE International 3D System Integration Conference (3DIC)
  • Place of Presentation: Osaka
  • Year and Date: 2012-01-31
• [Presentation] Effect of the 3D Alignment of Flip Chip Bumps on the Distribution of the Local Residuals Stress in Stacked Silicon Chips (2011)
  • Author(s): Kota Nakahira, Hideo Miura
  • Organizer: 13^<th> International Conference on Electronics Materials and Packaging
  • Place of Presentation: Kyoto(招待講演)
  • Year and Date: 2011-12-15
• [Presentation] Effect of the Crystallinity of Electroplated Copper Thin Films on Their Mechanical Properties (2011)
  • Author(s): Fumiaki Endo, Naokazu Murata, Ken Suzuki, Hideo Miura
  • Organizer: 13^<th> International Conference on Electronics Materials and Packaging
  • Place of Presentation: Kyoto
  • Year and Date: 2011-12-13
• [Presentation] Measurement of the Residual Stress in Nano-Scale Transistors (2011)
  • Author(s): Hironori Tago, Kota Nakahira, Ken Suzuki, Hideo Miura
  • Organizer: 13^<th> International Conference on Electronics Materials and Packaging
  • Place of Presentation: Kyoto
  • Year and Date: 2011-12-13
• [Presentation] 3D Chip Stacking Technologies and Hetero System Integration (2011)
  • Author(s): 福島誉史
  • Organizer: SEMIテクノロジーシンポジウム(STS)2011
  • Place of Presentation: 幕張メッセ(招待講演)
  • Year and Date: 2011-12-08
• [Presentation] High Efficient Unidirectional Optical Coupler for Through Silicon Photonic Via in Optoelectronic 3D-LSI (2011)
  • Author(s): Akihiro Noriki, Kang-Wook Lee, Jicheol Bea, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
  • Organizer: 2011 International Conference on Solid State Devices and Materials
  • Place of Presentation: Nagoya
  • Year and Date: 2011-09-30
• [Presentation] Performance of Low-Loss and Low-Cost Optoelectronic Module with Polynorbornene Waveguide for 10-Gbps Data Transmission (2011)
  • Author(s): Yuka Ito, Shinsuke Terada, Shinya Arai, Makoto Fujiwara, Tetsuya Mori, Koji Choki, Takafumi Fukushima, Mitsumasa Koyanagi
  • Organizer: 2011 International Conference on Solid State Devices and Materials
  • Place of Presentation: Nagoya
  • Year and Date: 2011-09-28
• [Presentation] More-than-Moore技術と3次元集積化 (2011)
  • Author(s): 小柳光正, 田中徹, 福島誉史, 李康旭
  • Organizer: センサ・マイクロマシンと応用システムシンポジウム
  • Place of Presentation: 東京(招待講演)
  • Year and Date: 2011-09-26
• [Presentation] Development of Wafer-Level 3D System Integration Technologies (2011)
  • Author(s): Takafumi Fukushima, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi
  • Organizer: The International Union of Materials Research Societies-International Conference in Asia (IUMRS-ICA) 12^<th> International Conference in Asia
  • Place of Presentation: Taipei, Taiwan(招待講演)
  • Year and Date: 2011-09-20
• [Presentation] More-than-Moore技術と3次元集積化 (2011)
  • Author(s): 小柳光正, 田中徹, 福島誉史, 李康旭
  • Organizer: 電子通信学会エレクトロニクスソサイエティ大会
  • Place of Presentation: 札幌(特別講演)
  • Year and Date: 2011-09-14
• [Presentation] 光電子集積三次元LSIに用いるシリコン貫通光配線のFDTD解析 (2011)
  • Author(s): 乗木暁博, 李康旭, Jichoel Bea, 福島誉史, 田中徹, 小柳光正
  • Organizer: 2011年秋季第72回応用物理学会学術講演会
  • Place of Presentation: 山形大学
  • Year and Date: 2011-09-02
• [Presentation] ナノ・マイクロスケールの材料力学と強度信頼性 (2011)
  • Author(s): 三浦英生
  • Organizer: 日本機械学会材料力学カンファレンス(M&M2011)
  • Place of Presentation: Fukuoka(基調講演)
  • Year and Date: 2011-07-17
• [Presentation] Minimization of the Local Residual Stress in 3D Flip Chip Structures by Optimizing the Mechanical Properties of Electroplated Materials and the Alignment Structure of TSVs and Fine Bumps (2011)
  • Author(s): Kota Nakahira, Hironori Tago, Ken Suzuki, Hideo Miura, Fumiaki Endo
  • Organizer: ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems (InterPACK2011)
  • Place of Presentation: Portland, Oregon, USA
  • Year and Date: 2011-07-07
• [Presentation] Integration of MEMS actuators with nanophotonics : silicon submicron-wide waveguides for optical path changes (2011)
  • Author(s): K.Hane, Y.Kanamori
  • Organizer: The16th Opto-Electronics and Communication Conferences (OECC2911)
  • Place of Presentation: Kaohsiung, Taiwan(招待講演)
  • Year and Date: 2011-07-07
• [Presentation] Mechanical Reliability of Three-dimensionally Stacked LSIs (2011)
  • Author(s): Hideo Miura
  • Organizer: International Conference on Materials for Advanced Technologies
  • Place of Presentation: Suntec, Singapore(招待講演)
  • Year and Date: 2011-06-30
• [Presentation] Silicon submicron waveguide and MEMS tunable optical telecommunication devices (2011)
  • Author(s): K.Hane, Y.Kanamori
  • Organizer: International Conference on Micro/Nano Optical Engineering (ICOME 2011)
  • Place of Presentation: Changchun, China(招待講演)
  • Year and Date: 2011-06-13
• [Presentation] シリコン貫通光配線を用いた三次元光電子集積化技術 (2011)
  • Author(s): 乗木暁博, 李康旭, 裴志哲, 福島誉史, 田中徹, 小柳光正
  • Organizer: J PCA Show 2011/ラージエレクトロニクスショー2011/2011マイクロエレクトロニクスショー/JISSO PROTEC2011
  • Place of Presentation: 東京
  • Year and Date: 2011-06-03
• [Presentation] Self-Assembly Technologies with High-Precision Chip Alignment and Fine-Pitch Microbump Bonding for Advanced Die-to-Wafer 3D Integration (2011)
  • Author(s): T.Fukushima, Y.Ohara, M.Murugesan, J.-C.Bea, K.-W.Lee, T.Tanaka, M.Koyanagi
  • Organizer: 第61回Electronic Components and Technology Conference (ECTC)
  • Place of Presentation: Walt Disney World Swan and Dolphin Resort, Florida, USA
  • Year and Date: 2011-06-02
• [Presentation] 3D and Hetero Integration Based on Chip-to-Wafer Bonding Using Self-Assembly Technologies (2011)
  • Author(s): Takafumi Fukushima, Kangwook Lee, Tetsu Tanaka, Mitsumasa Koyanagi
  • Organizer: Workshop ICRA (IEEE Int.Conf.on Robotics and Automation) 2011 MEMS assembly and packaging : trends and challenges for robotics in the microscale
  • Place of Presentation: Shanghai, China(招待講演)
  • Year and Date: 2011-05-09
• [Presentation] Evaluation of the Change of the Residual Stress in Nano-scale Transistors During the Deposition and Fine Patterning Processes of Thin Films (2011)
  • Author(s): Hideo Miura
  • Organizer: 12^<th> IEEE International Conference on Thermal Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems
  • Place of Presentation: Linz, Austria(招待講演)
  • Year and Date: 2011-04-19
• [Presentation] Monitoring Method of Residual Stress in a Substrate During Thin Film Processing (2011)
  • Author(s): Kota Nakahira, Hironori Tago, Hiroki Kishi, Ken Suzuki, Hideo Miura
  • Organizer: International Conference on Electronics Packaging (ICEP 2011)
  • Place of Presentation: Nara
  • Year and Date: 2011-04-14
• [Presentation] 三次元集積のための高精度チップ位置合わせと常温直接接合技術 (2011)
  • Author(s): 岩田永司, 福島誉史, 李康旭, 田中徹, 小柳光正
  • Organizer: 2011年春季第58回応用物理学関係連合講演会
  • Place of Presentation: 神奈川工科大学
  • Year and Date: 2011-03-24
• [Presentation] 高集積微細デバイスにおける今後の信号伝達/配線技術:シリコン貫通光インターコネクション(TSPV)を用いた光電子三次元 (2011)
  • Author(s): 福島誉史, 乗木暁博, 田中徹, 小柳光正
  • Organizer: 2011年春季第58回応用物理学関係連合講演会
  • Place of Presentation: 神奈川工科大学
  • Year and Date: 2011-03-24
• [Presentation] 狭ピッチ金属マイクロバンプを有するチップの自己組織化実装技術 (2011)
  • Author(s): 福島誉史, 岩田永司, 李康旭, 田中徹, 小柳光正
  • Organizer: 第25回エレクトロニクス実装学会春季講演大会
  • Place of Presentation: 横浜国立大学
  • Year and Date: 2011-03-08
• [Presentation] Micro Texture Dependence of the Mechanical and Electrical Reliability of Electroplated Copper Thin Film Interconnections (2011)
  • Author(s): Naokazu Murata, Naoki Saito, Fumiaki Endo, Kinji Tamakawa, Ken Suzuki, Hideo Miura
  • Organizer: 第61回Electronic Components and Technology Conference (ECTC)
  • Place of Presentation: Walt Disney World Swan and Dolphin Resort, Florida, USA
• [Presentation] Stress-Induced and Electro-migration of Electroplated Copper Thin Films Used for 3D Integration (2011)
  • Author(s): Naoki Saito, Naokazu Murata, Kinji Tamakawa, Ken Suzuki, Hideo Miura
  • Organizer: ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems (InterPACK2011)
  • Place of Presentation: Portland, Oregon, USA
• [Presentation] Super Chip Technology Achieving Hetero-Integration (2010)
  • Author(s): 小柳光正
  • Organizer: SEMICON Japan 2010
  • Place of Presentation: 幕張メッセ(招待講演)
  • Year and Date: 2010-12-01
• [Presentation] Through Silicon Photonic Via (TSPV) with Si Core for Low Loss and High-Speed Data Transmission in Opto-Electronic 3-D LSI (2010)
  • Author(s): A. Noriki, K.-W. Lee, J. Bea, T. Fukushima, T. Tanaka, and M. Koyanagi
  • Organizer: IEEE International 3D System Integration Conference 2010(3DIC)
  • Place of Presentation: ドイツ, ミュンヘン
  • Year and Date: 2010-11-17
• [Presentation] Through Silicon Photonic Via (TSPV) with Si Core for Low Loss and High-Speed Data Transmission in Opto-Electronic 3-D LSI (2010)
  • Author(s): A.Noriki, K.-W.Lee, J.Bea, T.Fukushima, T.Tanaka, M.Koyanagi
  • Organizer: IEEE International 3D System Integration Conference 2010 (3DIC)
  • Place of Presentation: Munich, Germany
  • Year and Date: 2010-11-17
• [Presentation] Evaluation of Alignment Accuracy on Chip-to-Wafer Self-Assembly and Mechanism on the Direct Chip Bonding at Room Temperature (2010)
  • Author(s): T.Fukushima, E.Iwata, J.Bea, M.Murugesan, K.-W.Lee, T.Tanaka, M.Koyanagi
  • Organizer: IEEE International 3D System Integration Conference 2010 (3DIC)
  • Place of Presentation: Munich, Germany
  • Year and Date: 2010-11-17
• [Presentation] NONDESTRUCTIVE DETECTION OF OPEN FAILURES IN THREE-DIMENSIONALLY STACK ED CHIPS MOUNTED BY AREA-ARRAYED FINE BUMPS (2010)
  • Author(s): Yuki Sato, Kohta Nakahira, Naokazu Murata, Ken Suzuki, Hideo Miura
  • Organizer: 12^<th> International Conference on Electronics Materials and Packaging, Proceedings
  • Place of Presentation: Singapore, Orcharsd Hotel
  • Year and Date: 2010-10-27
• [Presentation] 3D Hybrid Integration Technology for Opto-Electronic Hetero-Integrated Systems (2010)
  • Author(s): K.Lee, T.Fukushima, T.Tanaka, M.Koyanagi
  • Organizer: 218th Electrochemical Society (ECS) Meeting
  • Place of Presentation: Las Vegas, USA(招待講演)
  • Year and Date: 2010-10-13
• [Presentation] Mechanical Reliability of 3D Stacked Silicon Chips (2010)
  • Author(s): Hideo Miura
  • Organizer: The 9^<th> International Symposium on Microelectronics and Packaging
  • Place of Presentation: Seoul, Korea
  • Year and Date: 2010-10-04
• [Presentation] 3D Integration Technology and 3D System-on-a Chip (2010)
  • Author(s): M.Koyanagi
  • Organizer: International Conference on Solid State Devices and Materials (SSDM)
  • Place of Presentation: Tokyo(招待講演)
  • Year and Date: 2010-09-24
• [Presentation] Through Silicon Photonic Via with Si core for Low loss and High Density Vertical Optical Interconnection in 3D-LSI (2010)
  • Author(s): Akihiro Noriki, Kang-Wook Lee, Jicheol Bea, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
  • Organizer: Intern.Conf.on Solid State Device and Materials
  • Place of Presentation: Tokyo
  • Year and Date: 2010-09-24
• [Presentation] Self-Assembly with Metal Microbump-to-Microbump Bonding for Advanced Chip-to-Wafer 3D Integration (2010)
  • Author(s): Eiji Iwata, Yuki Ohara, Takafumi Fukushima, Kang-Wook Lee, Mitsumasa Koyanagi, Tetsu Tanaka
  • Organizer: Intern.Conf.on Solid State Device and Materials
  • Place of Presentation: Tokyo
  • Year and Date: 2010-09-24
• [Presentation] Three-Dimensional Integration Technology Using Through-Si Via Based on Reconfigured Wafer-to-Wafer Bonding (2010)
  • Author(s): Mitsumasa Koyanagi, Takafumi Fukushima, Tetsu Tanaka
  • Organizer: IEEE Custom Integrated Circuits Conference (CICC)
  • Place of Presentation: San Jose, USA(招待講演)
  • Year and Date: 2010-09-20
• [Presentation] ファインピッチ金属マイクロバンプを有するチップの自己組織化積層 (2010)
  • Author(s): 岩田永司, 福島誉史, 李康旭, 小柳光正, 田中徹
  • Organizer: 第71回応用物理学会学術講演会
  • Place of Presentation: 長崎大学(長崎)
  • Year and Date: 2010-09-15
• [Presentation] Submicron silicon waveguide Mach-Zehnder interferometer using micro electro-mechanical phase-shifter (2010)
  • Author(s): Taro Ikeda, Yoshiaki Kanamori, Kazuhiro Hane
  • Organizer: International Conference on Optical MEMS & Nanophotonics
  • Place of Presentation: 札幌
  • Year and Date: 2010-08-11
• [Presentation] バッチ式Die-to-Wafer三次元集積化技術 (2010)
  • Author(s): 福島誉史、李康旭、小柳光正
  • Organizer: 関西ワークショップ2010
  • Place of Presentation: 京都(招待講演)
  • Year and Date: 2010-07-09
• [Presentation] Self-Assembly Technology for Reconfigured Wafer-to-Wafer 3D Integration (2010)
  • Author(s): T.Fukushima, E.Iwata, K.-W.Lee, T.Tanaka, M.Koyanagi
  • Organizer: Electronic Components and Technology Conference (ECTC)
  • Place of Presentation: Las Vegas, USA
  • Year and Date: 2010-06-03
• [Presentation] 3-D Integration Technology and 3-D LSIs (2010)
  • Author(s): M.Koyanagi
  • Organizer: IEEE International Conf.on IC Design and Technology (ICICDT)
  • Place of Presentation: Grenoble, France(招待講演)
  • Year and Date: 2010-06-02
• [Presentation] 3D-LSI/TSVの技術動向と新領域への展開 (2010)
  • Author(s): 田中徹, 福島誉史, 李康旭, 小柳光正
  • Organizer: Semi Forum Japan 2010 TSV/3次元実装セミナー
  • Place of Presentation: グランキューブ大阪(招待講演)
  • Year and Date: 2010-06-01
• [Presentation] Dominant Structural Factors of the Local Deformation and Residual Stress of a Silicon Chip Mounted on Area-Arrayed Flip Chip Structures (2010)
  • Author(s): Kohta Nakahira, Naokazu Murata, Yuhki Sato, Ken Suzuki, Hideo Miura
  • Organizer: International Conference on Electronics Packaging 2010
  • Place of Presentation: Sapporo, Japan
  • Year and Date: 2010-05-13
• [Presentation] 東北大学における三次元積層技術とヘテロインテグレーション (2010)
  • Author(s): 李康旭、福島誉史、田中徹、小柳光正
  • Organizer: JPCA Show 2010 (pp.99-104)
  • Place of Presentation: アカデミックプラザ,東京ビッグサイト(招待講演)
• [Presentation] Three-Dimensional Optoelectronic Multichip Module with Optical Interconnection(Invited) (2009)
  • Author(s): Mitsumasa Koyanagi, Takafumi Fukushima, Tetsu Tanaka
  • Organizer: 12th IEEE International Symposium on Microwave and Optical Technology(ISMOT-2009)
  • Place of Presentation: Indiaニューデリー
  • Year and Date: 2009-12-18
• [Presentation] Three-Dimensional Integration Technology Based on Reconfigured Wafer-to-Wafer and Multichip-to-Wafer Stacking Using Self-Assembly Method (2009)
  • Author(s): Takafumi Fukushima, Eiji Iwata, Yuki Ohara, Akihiro Noriki, Kiyoshi Inamura, Kang-Wook Lee, Jicheol Bea, Tetsu Tanaka, Mitsumasa Koyanagi
  • Organizer: The IEEE International Electron Devices Meeting(IEDM)
  • Place of Presentation: Baltimore, USA
  • Year and Date: 2009-12-08
• [Presentation] 3D Heterogeneous Opto-Electronic Integration Technology for System-on-Silicon(SOS) (2009)
  • Author(s): K-W Lee, A.Noriki, K.Kiyoyama, S.Kanno, R.Kobayashi, W-C Jeong, J-C Bea, T.Fukushima, T.Tanaka, M.Koyanagi
  • Organizer: The IEEE International Electron Devices Meeting(IEDM)
  • Place of Presentation: Baltimore, USA
  • Year and Date: 2009-12-08
• [Presentation] 3次元LSI技術を使ったイメージセンサ技術の課題、動向(招待講演) (2009)
  • Author(s): 小柳光正, 元吉真
  • Organizer: SEMIテクノロジーシンポジウム(STS)
  • Place of Presentation: 幕張
  • Year and Date: 2009-12-04
• [Presentation] Super-Hetero Integration Technology Using Self-Assembly(Invited) (2009)
  • Author(s): 小柳光正
  • Organizer: International Conference on Planarization/CMP Technology 2009(ICPT2009)
  • Place of Presentation: 福岡
  • Year and Date: 2009-11-20
• [Presentation] Effect of Micro-Texture of Electroplated Copper Thin Flms on Their Mechanical and Electrical Properties (2009)
  • Author(s): Hideo Miura
  • Organizer: IEEE International Conf.on Electronic Materials and Packaging 2009
  • Place of Presentation: Taipei, Taiwan
  • Year and Date: 2009-10-24
• [Presentation] Self-Assembled 3D Chip Stacking Technology(Invited) (2009)
  • Author(s): Kang-Wook Lee, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
  • Organizer: 216th Electrochemical Society(ECS)Meeting
  • Place of Presentation: Vienna, Austria
  • Year and Date: 2009-10-06
• [Presentation] Development of a New Self-Assembled Die bonder to Three-Dimensionally Stack Known Good Dies in Batch (2009)
  • Author(s): Tanafumi Fukushima, Eiji Iwata, Tetsu Tanaka, Mitsumasa Koyanagi
  • Organizer: Proc.of IEEE International 3D System Integration Conference(3DIC)
  • Place of Presentation: San Francisco, USA
  • Year and Date: 2009-09-30
• [Presentation] Three-Dimensional Integration Technology Using Self-Assembly Technique(Invited) (2009)
  • Author(s): 小柳光正
  • Organizer: International Symposium on Dry Process(DPS)
  • Place of Presentation: Korea釜山
  • Year and Date: 2009-09-24
• [Presentation] Spherical silicon micro-mirrors bent by anodic bonding (2009)
  • Author(s): Takahiro Yamazaki, Ryohei Hokari, Kazuhiro Hane
  • Organizer: IEEE/LEOS Int.Conference on Optical MEMS and Nano-Photonics
  • Place of Presentation: Clearwater, USA.
  • Year and Date: 2009-08-18
• [Presentation] Control of the Growth of the Intermetallic Compound for mechanical and electrical reliability of fine bump joints (2009)
  • Author(s): Hideo Miura
  • Organizer: The ASME Pacific Rim Technical Conference and Exhibition on Integration and Packaging of Micro, Nano, and Electronic Systems
  • Place of Presentation: San Francisco, USA
  • Year and Date: 2009-07-22
• [Presentation] セルフアセンブリー伝を用いた新しいヘテロインテグレーション技術(VLSI特集)(招待講演) (2009)
  • Author(s): 福島誉史, 田中徹, 小柳光正
  • Organizer: 応用物理学会シリコンテクノロジー分科会
  • Place of Presentation: 東京
  • Year and Date: 2009-07-21
• [Presentation] Thin-Film Devices and Three-Dimensional Systems(Invited) (2009)
  • Author(s): 小柳光正
  • Organizer: Active Matrix-Flat Panel Display(AM-FPD)
  • Place of Presentation: 奈良
  • Year and Date: 2009-07-01
• [Presentation] Connection characteristics of silicon nanowire waveguides and fabrication of physical contact switches (2009)
  • Author(s): Erdal Bulgan, Yoshiaki Kanamori, Kazuhiro Hane
  • Organizer: IEEE 15th Int.Conference on Solid-State Sensors, Actuators and Microssytems
  • Place of Presentation: Denver, USA.
  • Year and Date: 2009-06-23
• [Presentation] New 3D Integration Technology and 3D System LSIs(Invited) (2009)
  • Author(s): 小柳光正
  • Organizer: Symposium on VLSI Technology
  • Place of Presentation: 京都
  • Year and Date: 2009-06-15
• [Presentation] 異種デバイスの融合を目指すスーパー・ヘテロインテグレーション技術 (2009)
  • Author(s): 小柳光正
  • Organizer: 浜松ホトニクス第21回半導体ワークショップ
  • Place of Presentation: 浜松
  • Year and Date: 2009-06-04
• [Presentation] 3D Integration Technology and 3D Integrated Systems(Invited) (2009)
  • Author(s): 小柳光正, 福島誉史, 田中徹
  • Organizer: IEEE International Interconnect Technology Conference(IITC)
  • Place of Presentation: 札幌
  • Year and Date: 2009-05-31
• [Presentation] Chip-to-Wafer 3D Stacking Using Self-Assembly and Electrostatic Temporary Bonding/Debonding
  • Author(s): H. Hashiguchi, T. Fukushima, J. Bea, H. Kino, K.-W. Lee, T.Tanaka, M. Koyanagi
  • Organizer: International Conference on Electronics Packaging 2013 (ICEP2013)
  • Place of Presentation: Osaka International Convention Center
• [Presentation] Challenges in 3D Integration
  • Author(s): Mitsumasa Koyanagi, Kang Wook Lee, Takafumi Fukushima, and Tetsu Tanaka
  • Organizer: 223th Electrochemical Society (ECS) Meeting
  • Place of Presentation: Toronto, Canada,
  • Invited
• [Presentation] 3D Integration Technologies Using Self-Assembly and Electrostatic Temporary Multichip Bonding
  • Author(s): T. Fukushima, H. Hashiguchi, J. Bea, M. Murugesan, K.-W. Lee, T.Tanaka, and M. Koyanagi
  • Organizer: The 63rd Eelectronic Components and Technology Conference
  • Place of Presentation: Las Vegas, USA
• [Presentation] Flux-Assisted Self-Assembly with Microbump Bonding for 3D Heterogeneous Integration
  • Author(s): Yuka Ito, Takafumi Fukushima, Kang-Wook Lee, Koji Choki, Tetsu Tanaka, Mitsumasa Koyanagi
  • Organizer: The 63rd Eelectronic Components and Technology Conference
  • Place of Presentation: Las Vegas, USA
• [Presentation] Improvement of the Reliability of TSV Interconnections by Controlling Crystallinity of Electroplated Copper Thin Films
  • Author(s): Ryosuke Furuya, Chuanhong Fan, Osamu Asai, Ken Suzuki, and Hideo Miura
  • Organizer: The 63rd Eelectronic Components and Technology Conference
  • Place of Presentation: Las Vegas, USA
  • Invited
• [Presentation] 3D Heterogeneous System Integration and New 3D LSIs
  • Author(s): Mitsumasa Koyanagi
  • Organizer: IEEE Symposium on VLSI Circuits Workshop
  • Place of Presentation: Kyoto
  • Invited
• [Presentation] Improvement of Device Performance in 3D Modules by Optimizing Mechanical Stress and Strain Fields
  • Author(s): Hideo Miura
  • Organizer: 2nd Annual World Congress of Emerging Info Tech 2013
  • Place of Presentation: Dalian, China
  • Invited
• [Presentation] 三次元LSIとヘテロインテグレーション
  • Author(s): 李康旭,福島誉史,田中徹,小柳光正
  • Organizer: 半導体・集積路技術シンポジウム
  • Place of Presentation: 東京
  • Invited
• [Presentation] 三次元ヘテロ集積化技術とスーパーチップ
  • Author(s): 小柳光正,福島誉史,李康旭,田中徹
  • Organizer: スマートプロセス学会電子デバイス実装研究委員会
  • Place of Presentation: 東京
  • Invited
• [Presentation] Evaluation of the Crystallographic Quality of Electroplated Copper Thin-Film Interconnections Embedded in a Silicon Substrate
  • Author(s): Ryosuke Furuya, Osamu Asai, Chuanhong Fan, Ken Suzuki, Hideo Miura
  • Organizer: ASME2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
  • Place of Presentation: Burlingame, California, USA
• [Presentation] 自己組織化による三次元集積化技術
  • Author(s): 小柳光正
  • Organizer: 自然から学ぶナノテクノロジーセミナー (物質・材料研究機構)
  • Place of Presentation: 筑波
  • Invited
• [Presentation] C2W三次元集積のための自己組織化静電仮接合の評価
  • Author(s): 橋口 日出登, 福島 誉史, 裵 志哲, 木野久志, 李 康旭, 田中 徹, 小柳 光正
  • Organizer: 2013秋季第74 回応用物理学会秋季学術講演会
  • Place of Presentation: 同志社大学京田辺キャンパス
• [Presentation] Self-Assembly and Electrostatic (SAE) Carrier Technology for Via-Last Backside-Via Multichip-to-Wafer 3D Integration
  • Author(s): Hideto Hashiguchi, Takafumi Fukushima, Jicheol Bea, Kang-Wook Lee, Tetsu Tanaka, and Mitsumasa Koyanagi
  • Organizer: 2013 International Conference on Solid State Materials and Devices(SSDM2013)
  • Place of Presentation: Hilton Fukuoka Sea Hawk, Fukuoka
• [Presentation] Self-Assembly Study to Precisely Align Dies Having Microbump Covered with Non-Conductive Film for Advanced Chip-to-Wafer 3D Integration
  • Author(s): Yuka Ito, Takafumi Fukushima, Kang-Wook Lee, Koji Choki, Tetsu Tanaka, and Mitsumasa Koyanagi
  • Organizer: 2013 International Conference on Solid State Materials and Devices(SSDM2013)
  • Place of Presentation: Hilton Fukuoka Sea Hawk, Fukuoka
• [Presentation] Micro-Texture Dependence of Mechanical Properties of Fine Metallic Bumps Used for Three-Dimensional Electronic Packaging
  • Author(s): Ken Suzuki, Ryosuke Furuya, Fumiaki Endo and Hideo Miura
  • Organizer: 2013 International Conference on Solid State Materials and Devices(SSDM2013)
  • Place of Presentation: Hilton Fukuoka Sea Hawk, Fukuoka
• [Presentation] Development of Via-Last 3D Integration Technologies Using a New Temporary Adhesive System
  • Author(s): T. Fukushima, J. Bea, M. Murugesan, K.-W. Lee, and M. Koyanagi
  • Organizer: IEEE International Conference on 3D System Integration (3D IC)
  • Place of Presentation: San Francisco, USA
• [Presentation] 3D Memory Chip Stacking by Multi-Layer Self-Assembly Technology, The IEEE International Conference on 3D System Integration (3D IC)
  • Author(s): T. Fukushima, J. Bea, M. Murugesan, H.-Y. Son, M.-S. Suh, K.-Y.Byun, N.-S. Kim, K.-W. Lee, and M. Koyanagi
  • Organizer: IEEE International Conference on 3D System Integration (3D IC)
  • Place of Presentation: San Francisco, USA
• [Presentation] 3DIC Activity at Tohoku University
  • Author(s): Mitsumasa Koyanagi
  • Organizer: IEEE International Conference on 3D System Integration (3D IC)
  • Place of Presentation: San Francisco, USA
  • Invited
• [Presentation] Effect of Microtexture in Electroplated Copper Thin Films on Their Thermal Conductivity
  • Author(s): Rittinon Pornvitoo, Osamu Asai, Ken Suzuki, Hideo Miura
  • Organizer: 15th International Conference on Electronic Materials and Packing
  • Place of Presentation: Seoul, Korea
• [Presentation] 3D Integration and Reliability Challenges
  • Author(s): Mitsumasa Koyanagi, Mariappan Murugesan, Kangwook Lee, Takafumi Fukushima, Tetsu Tanaka
  • Organizer: 224th Electrochemical Society (ECS) Meeting
  • Place of Presentation: San Francisco, USA
  • Invited
• [Presentation] 三次元集積化による超低消費電力化
  • Author(s): 小柳光正
  • Organizer: 第29回京都賞記念ワークショップ先端技術部門
  • Place of Presentation: 京都国際会館
  • Invited
• [Presentation] Heterogeneous 3D Integration - Technology Enabler toward Future Super-Chip (Plenary Talk)
  • Author(s): Mitsumasa Koyanagi
  • Organizer: IEEE International Electron Devices Meeting (IEDM) 2013
  • Place of Presentation: Washington D.C., USA
  • Invited
• [Presentation] Characterization and Reliability of 3-D LSI and SiP
  • Author(s): K-W Lee, M. Murugesan, J-C Bea, T. Fukushima, T. Tanaka, and M. Koyanagi
  • Organizer: IEEE International Electron Devices Meeting (IEDM) 2013
  • Place of Presentation: Washington D.C., USA
  • Invited
• [Presentation] シリコン導波路とMEMSアクチュエータの組み合わせによる光路制御 -;波長選択スイッチのためのMEMS可変マイクロリング-
  • Author(s): 羽根 一博, ホアンマン チュ
  • Organizer: 電子情報通信学会光エレクトロニクス研究会
  • Place of Presentation: 東京（機械振興会館）
• [Presentation] 3D System Module with Stacked Image Sensors, Stacked Memories and Stacked Processors on a Si Interposer
  • Author(s): Mitsumasa Koyanagi
  • Organizer: IEEE Solid-State Circuits Conference (ISSCC) 2014, 3D-Forum
  • Place of Presentation: San Francisco, USA
  • Invited
• [Presentation] Wafer-Level 3D Integration Technology Using Self-Assembly
  • Author(s): Takafumi Fukushima, Kang-Wook Lee, Tetsu Tanaka, and Mitsumasa Koyanagi
  • Organizer: MSPNEX (International Micro System Packaging Forum)2012
  • Place of Presentation: Seoul, Korea
  • Invited
• [Presentation] Self-Assembly-Based 3D Integration Technologies
  • Author(s): T. Fukushima, J. Bea, M. Murugesan, K.-W. Lee, T. Tanaka, and M. Koyanagi
  • Organizer: 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration
  • Place of Presentation: 東京大学（東京）
• [Presentation] Non-Conductive Film and Compression Molding Technology for Self-Assembly-Based 3D Integration
  • Author(s): T. Fukushima, Y. Ohara, J. Bea, M. Murugesan, K.-W. Lee, T. Tanaka, and M. Koyanagi
  • Organizer: IEEE 62nd Electronic Components and Technology Conference
  • Place of Presentation: San Diego, CA, USA
• [Presentation] Evaluation of the Crystallinity of Grain Boundaries of Electronic Copper Thin Films for Highly Reliable Interconnections
  • Author(s): Hideo Miura
  • Organizer: IEEE 62nd Electronic Components and Technology Conference
  • Place of Presentation: San Diego, CA, USA
• [Presentation] 先端三次元積層型LSIの技術動向と展望
  • Author(s): 福島誉史
  • Organizer: SEMI Forum Japan 2012 ：TSV/3次元積層化技術セミナー（１）－いよいよ量産へ、ここまで来たTSV技術－
  • Place of Presentation: グランキューブ大阪（大阪）
  • Invited
• [Presentation] Compound switch consisting of gap-variable silicon nanowire waveguide couplers
  • Author(s): Y.Akihama, Y.Munemasa, Y.Kanamori, K.Hane
  • Organizer: 17th Opto-Electronics and Communication Conf. (OECC2012)
  • Place of Presentation: Busan, Korea
• [Presentation] 光電子集積三次元LSIのための高効率光カップラの検討
  • Author(s): 乗木暁博，李康旭，裵 志哲, 福島誉史，田中徹，小柳光正
  • Organizer: 2012年第73回応用物理学会秋季学術講演会
  • Place of Presentation: 愛媛大学・松山大学（愛媛）
• [Presentation] Optoelectronic Heterogeneous Integration Technology, Using Reductant-Assisited Self-Assembly with Cu/Sn Microbump
  • Author(s): Yuka Ito, Takafumi Fukushima, Kang-Wook Lee, Koji Choki, Tetsu Tanaka, and Mitsumasa Koyanagi
  • Organizer: 2012 International Conference on Solid State Devices and Materials (SSDM 2012)
  • Place of Presentation: Kyoto International Conference Center（京都）
• [Presentation] Electrostatic Temporary Bonding Technology and TSV Formation for Reconfigured Wafer-to-Wafer 3D Integration
  • Author(s): Hideto Hashiguchi, Jichoel Bea, Yuki Ohara, Takafumi Fukushima, Kang-Wook Lee, Tetsu Tanaka, and Mitsumasa Koyanagi
  • Organizer: 2012 International Conference on Solid State Devices and Materials (SSDM 2012)
  • Place of Presentation: Kyoto International Conference Center（京都）
• [Presentation] 10μm-Pitch In-Au Microbump Interconnection by Chip Self-Assembly with Excimer Lamp Irradiation for 3D LSI Applications
  • Author(s): Takafumi Fukushima, Jichoel Bea, Mariappan Murugesan, Kang-Wook Lee, Tetsu Tanaka, and Mitsumasa Koyanagi
  • Organizer: 2012 International Conference on Solid State Devices and Materials (SSDM 2012)
  • Place of Presentation: Kyoto International Conference Center（京都）
• [Presentation] Grapho-Assembly Technology for Sub-Micron Accuracy 3D Chip Stacking with High-Density Through-Si Vias and Metal Microbumps
  • Author(s): Takafumi Fukushima, Masaki Onishi, Jichoel Bea, Sayuri Hioki, Mariappan Murugesan, Kang-Wook Lee, Tetsu Tanaka, and Mitsumasa Koyanagi
  • Organizer: 2012 International Conference on Solid State Devices and Materials (SSDM 2012)
  • Place of Presentation: Kyoto International Conference Center（京都）
• [Presentation] 3D Integration Technologies Based on Surface-Tension Driven Multi-Chip Self-Assembly Techniques
  • Author(s): Takafumi Fukushima, Kang Wook Lee, Jicheol Bea, Tetsu Tanaka, and Mitsumasa Koyanagi
  • Organizer: 222nd ECS Meeting: PRiME (Pacific Rim Meeting) 2012
  • Place of Presentation: Honolulu, Hawaii, USA
  • Invited
• [Presentation] エレクトロニクス実装における力学的信頼性の検討課題
  • Author(s): 三浦 英生
  • Organizer: 第2回新生デバイス実装研究会
  • Place of Presentation: アクア博多（福岡）
  • Invited
• [Presentation] Development of 3D Integration Technologies and Recent Challenges
  • Author(s): T. Fukushima, K.-W. Lee, T. Tanaka, and M. Koyanagi
  • Organizer: ADMETA Plus 2012 Advanced Metallization Conference 2012: 22nd Asian Session
  • Place of Presentation: 東京大学（東京）
  • Invited
• [Presentation] Heterogeneous 3D Integration Technology and New 3D LSIs
  • Author(s): M. Koyanagi, K-W Lee, T. Fukushima and T. Tanaka
  • Organizer: IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT2012)
  • Place of Presentation: Xi’an, China
  • Invited
• [Presentation] MICRO-TEXTURE DEPENDENCE OF THE STRENGTH OF FINE METALLIC BUMPS USED FOR ELECTRONIC PACKAGING
  • Author(s): Fumiaki Endo, Hideo Miura
  • Organizer: ASME 2012 International Mechanical Engineering Congress & Exposition, (IMECE2012)
  • Place of Presentation: Houston, TX, USA
• [Presentation] New Chip-to-Wafer 3D Integration Technology Using Hybrid Self-Assembly and Electrostatic Temporary Bonding
  • Author(s): T. Fukushima, H. Hashiguchi, J. Bea, Y. Ohara, M. Murugesan, K.-W. Lee, T. Tanaka, and M. Koyanagi
  • Organizer: 2012 IEEE International Electron Devices Meeting (IEDM)
  • Place of Presentation: San Francisco, CA, USA
• [Presentation] Effect of the Lattice Mismatch between Copper Thin-film Interconnection and Base Material on the Crystallinity of the Interconnection
  • Author(s): Chuanhong Fan, Hideo Miura
  • Organizer: IEEE 14th International Conference on Electronic Materials and Packaging (EMAP 2012)
  • Place of Presentation: Hong Kong, China
• [Presentation] 自己組織化静電仮接合を用いたC2W三次元集積化技術(Chip-to-Wafer 3D Integration Technology Using Chip Self-Assembly and Electrostatic Temporary Bonding)
  • Author(s): 橋口 日出登，福島 誉史，裵 志哲，Mariappan Murugesan，木野 久志，李 康旭，田中 徹，小柳 光正
  • Organizer: 2013年第60回応用物理学会春季学術講演会
  • Place of Presentation: 神奈川工科大学（神奈川）
• [Presentation] 光電子集積三次元LSIのための高効率光カップラの作製(Fabrication of Unidirectional Optical Coupler for Opto-Electronic 3-D LSI)
  • Author(s): 乗木暁博，李康旭，裵 志哲，福島誉史，田中徹，小柳光正
  • Organizer: 2013年第60回応用物理学会春季学術講演会
  • Place of Presentation: 神奈川工科大学（神奈川）
• [Book] Handbook of 3D Integration, Vol.3, 3D Process technology (2014)
  • Author(s): Mitsumasa Koyanagi, Tetsu Tanaka, 他
  • Total Pages: 280
  • Publisher: Wiley-VCH
• [Book] Handbook of 3D Integration Volume 3: 3D Process Technology, 執筆担当部分：Chapter 6.6, “Via Reveal and Backside Processing” (in press) (2014)
  • Author(s): Mitsumasa Koyanagi, Tetsu Tanaka
  • Total Pages: 280
  • Publisher: Wiley-VCH
• [Book] 破壊力学体系-壊れない製品設計に向けて-, 第12章2節 薄膜デバイスの信頼設計 (2012)
  • Author(s): 三浦英生, 他
  • Total Pages: 536
  • Publisher: 株式会社エヌ・ティー・エス
• [Book] 破壊力学大系-壊れない製品設計に向けて-:第12章2節薄膜デバイスの信頼設計 (2012)
  • Author(s): 三浦英生(分担執筆)
  • Publisher: 株式会社エヌ・ティー・エス
• [Book] Handbook of Wafer Bonding (2011)
  • Author(s): M.Koyanagi, 他
  • Total Pages: 450
  • Publisher: Wiley-VCH
• [Book] Handbook of Wafer Bonding (2011)
  • Author(s): M.Koyanagi(分担執筆)
  • Publisher: Wiley-VCH
• [Book] Untra-thin Chip Technology and Application, Chapter III-11, " 3D Technology Using Ultra-Thin Chips" (2010)
  • Author(s): M.Koyanagi, 他
  • Total Pages: 467
  • Publisher: Springer
• [Book] Untra-thin Chip Technology and Application (Editor : J.N.Burghartz), Chapter III-11, "3D-IC Technology Using Ultra-Thin Chips (2010)
  • Author(s): M.Koyanagi
  • Publisher: Springer
• [Book] Materials and technologies for 3-D Integration (2009)
  • Author(s): Mitsumasa Koyanagi(Co-editor/Author)
  • Total Pages: 273
  • Publisher: Material Research Society
• [Remarks] 三次元スーパーチップLSI 試作拠点 Global Integration Initiative(GINTI) ホームページ
• [Remarks] ①2014年3月28日23:00～23:30;世界を支える驚異の技術(ディスカバリー・ジャパン) 新聞報道等
• [Remarks] ②2013年10月9日; 東北大, 宮城に試作拠点開設,3次元LSI 試作を支援(半導体産業新聞) 新聞報道等
• [Remarks] ③2013年10月3日; 半導体の立体構造に挑む東北大の三次元LSI 拠点(日経産業新聞) 新聞報道等
• [Remarks] ④2013年9月25日; 3次元LSI試作拠点完成 多賀城東北大「半導体復権を目指す」(河北新報) 新聞報道等
• [Remarks] ⑤2013年9月24日;「東北の復興を象徴する3次元LSIの世界的拠点に」, 東北大が300mm対応の試作用ラインを公開(日経BP半導体) 新聞報道等
• [Remarks] ⑥2013年9月20日; GINTI 開所式テレビ報道(仙台放送、東日本放送) 新聞報道等
• [Remarks] ⑦2013年9月16日; 第2部<技術編>コストを下げて民生機器へ, TSVの青銅技術を革新, 液体の表面張力で位置合わせ(日経エレクトロニクス, p.51) 新聞報道等
• [Remarks] Global Integration Initiative (GINTI)
  • URL: http://www.ginti.niche.tohoku.ac.jp
• [Patent(Industrial Property Rights)] 半導体装置 (2014)
  • Inventor(s): 鈴木 拓、北村 康宏、浅見 一志、小柳 光正、福島 誉史、李 康旭
  • Industrial Property Rights Holder: 東北大学、㈱ デンソー
  • Industrial Property Rights Type: 特許
  • Industrial Property Number: 2014-053473
  • Filing Date: 2014-03-17
• [Patent(Industrial Property Rights)] 半導体装置 (2014)
  • Inventor(s): 鈴木拓、北村康宏、浅見一志、小柳光正、福島誉史、李康旭
  • Industrial Property Rights Holder: 東北大学、(株)デンソー
  • Industrial Property Rights Type: 特許
  • Industrial Property Number: 2014-053473
  • Filing Date: 2014-03-17
• [Patent(Industrial Property Rights)] チップ支持基板、チップ支持方法、三次元集積回路、アセンブリ装置及び三次元集積回路の製造方法 (2013)
  • Inventor(s): 小柳 光正、福島 誉史、田中 徹
  • Industrial Property Rights Holder: 東北大学
  • Industrial Property Rights Type: 特許
  • Filing Date: 2013-09-13
  • Overseas
• [Patent(Industrial Property Rights)] チップ支持基板、チップ支持方法、三次元集積回路、アセンブリ装置及び三次元集積回路の製造方法 (2013)
  • Inventor(s): 小柳光正、福島誉史、田中徹
  • Industrial Property Rights Holder: 東北大学
  • Industrial Property Rights Type: 特許
  • Filing Date: 2013-09-13
  • Overseas