Study on molecular processing by using fullerenol for digital nano-patterning Study on molecular processing by using fullerenol for digital nano-patterning Study on molecular processing by using fullerenol for digital nano-patterning

• Project/Area Number: 21360064
• Research Category: Grant-in-Aid for Scientific Research (B)
• Allocation Type: Single-year Grants
• Section: 一般
• Research Field: Production engineering/Processing studies
• Research Institution: Osaka University
• Principal Investigator: TAKAYA Yasuhiro 大阪大学, 大学院・工学研究科, 教授 (70243178)
• Co-Investigator(Kenkyū-buntansha): HAYASHI Terutake 大阪大学, 大学院・工学研究科, 准教授 (00334011) ; MICHIHATA Masaki 大阪大学, 大学院・工学研究科, 助教 (70588855)
• Co-Investigator(Renkei-kenkyūsha): KOKUBO Ken 大阪大学, 大学院・工学研究科, 講師 (20304008)
• Project Period (FY): 2009 – 2011
• Project Status: Completed (Fiscal Year 2011)
• Budget Amount: ¥19,630,000 (Direct Cost: ¥15,100,000、Indirect Cost: ¥4,530,000); Fiscal Year 2011: ¥2,730,000 (Direct Cost: ¥2,100,000、Indirect Cost: ¥630,000); Fiscal Year 2010: ¥4,290,000 (Direct Cost: ¥3,300,000、Indirect Cost: ¥990,000); Fiscal Year 2009: ¥12,610,000 (Direct Cost: ¥9,700,000、Indirect Cost: ¥2,910,000)
• Keywords: 水酸化フラーレン / 加工機能性超微粒子 / ナノデジタルパターニング / 材料除去過程 / 分子加工原理 / 表面増強ラマン散乱法 / 加工現象計測・解析 / 超短パルスレーザー

Research Abstract

The material removal mechanisms with the chemical and mechanical effects in molecular revel was revealed by the Cu-CMP using the water-soluble fullerenol slurry and the optical surface measurement using in situ Raman analysis method that are originally developed in this study. Based on these fundamental knowledges, it is found that the controllability of chemical reactive effect by single fullerenol molecule makes it possible to achieve the digitally nano-controlled patterning process technique using a functional particle as a molecular machining tool.

Research Products

• [Journal Article] Chemical mechanical polishing of patterned copper wafer surface using water-soluble fullerenol slurry (2011)
  • Author(s): Yasuhiro Takaya, Hirotaka Kishida, Terutake Hayashi, Masaki Michihata, Ken Kokubo
  • Journal Title: CIRP Annals-Manufacturing Technology Volume: Vol.60, Issue1 Pages: 567-570
• [Journal Article] Chemical mechanical polishing of patterend copper wafer surface using water-soluble fullerenol slurry (2011)
  • Author(s): Yasuhiro Takaya, Hirotaka Kishida, Terutake Hayashi, Masaki Michihata
  • Journal Title: Annals of the CIRP Volume: Vol.60 Pages: 567-570
  • Peer Reviewed
• [Journal Article] Performance of water-soluble fullerenol as novel functional molecular abrasive grain for polishing nanosurfaces (2009)
  • Author(s): Yasuhiro Takaya, Hideaki Tachika, Terutake Hayashi, Ken Kokubo, Keisuke Suzuki
  • Journal Title: The 59th CIRP general assembly, CIRP Annals. Manufacturing Technology Volume: Vol.58, Issue1 Pages: 495-498
• [Journal Article] 水酸化フラーレンスラリーを用いたCu-CMP加工法に関する研究-研磨特性の検証- (2009)
  • Author(s): 田近英之, 高谷裕浩, 林照剛, 田名田祐樹, 小久保研, 鈴木恵友
  • Journal Title: 精密工学会誌論文集,精密工学会誌 Volume: Vol.75, No.4 Pages: 489-495
  • NAID: 130000421625
• [Journal Article] 水酸化フラーレンスラリーを用いたCu-CMP加工に関する研究 (2009)
  • Author(s): 田近英之, 高谷裕浩, 林照剛, 田名田祐樹, 小久保研, 鈴木恵友
  • Journal Title: 精密工学会誌 Vol.75 No.4 Pages: 489-495
  • Peer Reviewed
• [Journal Article] Performance of water-soluble fullerenol as novel functional molecular abrasive grain for polishing nanosurfaces (2009)
  • Author(s): Yasuhiro Takaya, Hideaki Tachika, Terutake Hayashi, Ken Kokubo, Keisuke Suzuki
  • Journal Title: CIRP Annals 1巻 Pages: 495-498
  • Peer Reviewed
• [Presentation] 水酸化フラーレンを用いたCu-CMPにおける化学反応過程の解明(第一報)-In-situラマン分光分析装置の開発ー (2012)
  • Author(s): 鹿野和昌, 高谷裕浩, 林照剛, 道畑正岐, 小久保研
  • Organizer: 精密工学会, 2012年度精密工学会春季大会学術講演会講演論文集
  • Place of Presentation: 首都大学東京
  • Year and Date: 2012-03-15
• [Presentation] 水酸化フラーレンを用いたCu-CMPにおける化学反応過程の解明(第1報)-in-situラマン分光分析装置の開発- (2012)
  • Author(s): 鹿野和昌
  • Organizer: 2012年度精密工学会春季大会学術講演会
  • Place of Presentation: 首都大学東京南大沢キャンパス(東京都)
  • Year and Date: 2012-03-15
• [Presentation] In Situ Raman Analysis of Chemical Reaction for Copper CMP Using Water-soluble Fullerenol (2011)
  • Author(s): Kazumasa Kano, Yasuhiro Takaya, Terutake Hayashi, Masaki Michihata and Ken Kokubo
  • Organizer: Asian Symposium for Precision Engineering and Nanotechnology 2011
  • Place of Presentation: China, Hong Kong
  • Year and Date: 2011-11-17
• [Presentation] In situ Raman analysis of chemical reaction for copper CMP using water-soluble fullerenol (2011)
  • Author(s): Kazumasa Kano
  • Organizer: ASPEN 2011 4th International Conference of Asian Society for Precision Engineering and Nanotechnology
  • Place of Presentation: Hong Kong (China)
  • Year and Date: 2011-11-16
• [Presentation] 水酸化フラーレンを用いたCu-CMP加工に関する研究(第3報)-パターンウエハの研磨特製の評価- (2011)
  • Author(s): 岸田裕貴, 高谷裕浩, 林照剛, 道畑正岐, 小久保研
  • Organizer: 精密工学会春季大会学術講演会講演論文集
  • Place of Presentation: 東洋大学
• [Presentation] Weakly Copper-Fullerenol Layer on Chemical Mechanical Polishing Using Water Soluble Fullerenol (2010)
  • Author(s): Hirotaka kishida
  • Organizer: Proceedings of 25^<th> ASPE 2010 Annual Meeting
  • Place of Presentation: USA (Atlanta)
  • Year and Date: 2010-11-03
• [Presentation] Weakly Copper-Fullerenol Layer on Chemical Mechanical Polishing Using Water Soluble Fullerenol, Proc (2010)
  • Author(s): Hirotaka Kishida, Yasuhiro Takaya, Terutake Hayashi, Masaki Michihata, Ken Kokubo
  • Organizer: 2010 American Society for Precision Engineering(ASPE)
  • Place of Presentation: Atlanta, USA
  • Year and Date: 2010-11-02
• [Presentation] 水酸化フラーレンを用いたCu-CMP加工における表面反応層の形成 (2010)
  • Author(s): 岸田裕貴, 高谷裕浩, 林照剛, 道畑正岐, 小久保研
  • Organizer: 2010年度精密工学会秋季大会学術講演会講演論文集(JSPE)
  • Place of Presentation: 名古屋大学
  • Year and Date: 2010-09-27
• [Presentation] 水酸化フラーレンを用いたCu-CMP加工における表面反応層の形成 (2010)
  • Author(s): 岸田浩貴
  • Organizer: 2010年度精密工学会秋季大会学術講演会
  • Place of Presentation: 名古屋大学(名古屋)
  • Year and Date: 2010-09-27
• [Presentation] Verification of Generation and Removal Process of Surface Brittle Film, In Polishing Water Soluble Fullerenol, Proc (2010)
  • Author(s): Kazumasa Kano, Terutake Hayashi, Yasuhiro Takaya, Ken Kokubo
  • Organizer: 10th International Symposium on Measurement and Quality Control(ISMQC)
  • Place of Presentation: Osaka, Japan
  • Year and Date: 2010-09-08
• [Presentation] 水酸化フラーレンにおける脆性膜の生成および除去過程の検討 (2010)
  • Author(s): 鹿野和昌, 高谷裕浩, 林照剛
  • Organizer: 精密工学会2010年度関西地方定期学術講演会
  • Place of Presentation: 京都大学
  • Year and Date: 2010-05-28
• [Presentation] 水酸化フラーレンにおける脆性膜の生成および除去過程の検討 (2010)
  • Author(s): 鹿野和昌
  • Organizer: 精密工学会2010年度関西地方定期学術講演会
  • Place of Presentation: 京都大学(京都)
  • Year and Date: 2010-05-28
• [Presentation] Effect of Fullerene Poly-hydroxide on Cu-CMP Process (2009)
  • Author(s): Hirotaka Kishida, Terutake hayashi, Yasuhiro Takaya
  • Organizer: The 5th International Conference on Leading Edge Manufacturing in 21st
  • Place of Presentation: Century, Japan
  • Year and Date: 2009-12-03
• [Presentation] Effect of Fullerene Poly-hydroxide on Cu-CMP Process (2009)
  • Author(s): Hirotaka KISHIDA
  • Organizer: 3^rd International Conference of Asian Society for Precision Engineering and Nanotechnology
  • Place of Presentation: 大阪大学(大阪)
  • Year and Date: 2009-11-03
• [Presentation] Performance of water-soluble fullerenol as novel functional molecular abrasive grain for polishing nanosurfaces (2009)
  • Author(s): Yasuhiro Takaya, Hideaki Tachika, Terutake Hayashi, Ken Kokubo, Keisuke Suzuki
  • Organizer: The 59th CIRP general assembly
  • Place of Presentation: Boston, USA
  • Year and Date: 2009-08-26