High-Resolution Local Tactile Imaging with Integrated MEMS Technology

• Project/Area Number: 21360169
• Research Category: Grant-in-Aid for Scientific Research (B)
• Allocation Type: Single-year Grants
• Section: 一般
• Research Field: Electron device/Electronic equipment
• Research Institution: Kagawa University
• Principal Investigator: TAKAO Hidekuni 香川大学, 微細構造デバイス統合研究センター, 准教授 (40314091)
• Project Period (FY): 2009 – 2012
• Project Status: Completed (Fiscal Year 2012)
• Budget Amount: ¥17,550,000 (Direct Cost: ¥13,500,000、Indirect Cost: ¥4,050,000); Fiscal Year 2012: ¥2,730,000 (Direct Cost: ¥2,100,000、Indirect Cost: ¥630,000); Fiscal Year 2011: ¥3,380,000 (Direct Cost: ¥2,600,000、Indirect Cost: ¥780,000); Fiscal Year 2010: ¥6,370,000 (Direct Cost: ¥4,900,000、Indirect Cost: ¥1,470,000); Fiscal Year 2009: ¥5,070,000 (Direct Cost: ¥3,900,000、Indirect Cost: ¥1,170,000)
• Keywords: センシング / 触覚センサ / 集積化MEMS技術 / 3軸力覚 / 滑り検知 / 集積回路 / アレイセンサ

Research Abstract

In this study, a multi-functional integrated tactile imager device has been developed for high-resolution and local area tactile imaging applications. The device has realized sensing functions and sensitivities similar to human’s fingertip skin. Using the developed tactile imager device, 2-dimensional detection of tri-axis force distribution, detection of surface texture with roughness and softness of object surface have been realized as real-time tactile imaging system with PC software.

Research Products

• [Journal Article] A Post-CMOS Formation Process of High-Adhesiveness SU-8 Structures for Reliable Fabrication of Integrated MEMS sensors (2013)
  • Author(s): Y. Maeda, K. Terao, T. Suzuki, F. Shimokawa, H. Takao
  • Journal Title: Japanese Jouranal of Applied Physics
• [Journal Article] A Post-CMOS Formation Process of High-Adhesiveness SU-8 Structures for Reliable Fabrication of Integrated MEMS sensors (2013)
  • Author(s): Yusaku Maeda; Kyohei Terao; Takaaki Suzuki; Fusao Shimokawa; Hidekuni Takao
  • Journal Title: Japanese Jouranal of Applied Physics Volume: in print
  • Peer Reviewed
• [Journal Article] A Novel Integrated Tactile Image Sensor for Detection of Surface Friction and Hardness Using the Reference Plane Structure (2012)
  • Author(s): Y. Maeda; K. Terao; T. Suzuki; F. Shimokawa; H. Takao
  • Journal Title: Proc. IEEE Sensors2012 Conference Volume: 1 Pages: 40-43
  • Peer Reviewed
• [Journal Article] A Post-CMOS Process of High Adhesion SU-8 Structure to Apply to Sensor Device (2012)
  • Author(s): Y. Maeda; K. Terao; T. Suzuki; F. Shimokawa; H. Takao
  • Journal Title: Proc. 25th International Microprocesses and Nanotechnology Conference Volume: 1
  • Peer Reviewed
• [Journal Article] 皮膚感覚の超越をめざすシリコン集積化触覚イメージャー (2011)
  • Author(s): 高尾英邦
  • Journal Title: 電子情報通信学会誌 Volume: Vol. 94, No.6 Pages: 470-474
• [Journal Article] 小特集「五感」情報処理-生理的基盤とハードウェアに立脚したアプリケーションの展望-皮膚感覚の超越をめざすシリコン集積化触覚イメージャー (2011)
  • Author(s): 高尾英邦
  • Journal Title: 電子情報通信学会誌 Volume: 18 Pages: 470-474
  • Peer Reviewed
• [Journal Article] 皮膚感覚の超越を目指すシリコン集積化触覚イメージャ (2011)
  • Author(s): 高尾英邦
  • Journal Title: 電子情報通信学会誌 小特集:「五感」情報処理-生理的基盤とハードウェアに立脚したアプリケーションの展望 Volume: 6月号(出版中)
  • NAID: 110008662128
  • Peer Reviewed
• [Journal Article] A Versatile Integration Technology of SOI-MEMS/CMOS Devices Using Microbridge Interconnection Structures (2010)
  • Author(s): H. Takao, T. Ichikawa, T. Nakata, K. Sawada, M. Ishida
  • Journal Title: ASME/IEEE Journal of Microelectromechanical Systems Volume: Vol. 19, No. 4 Pages: 919-926
• [Journal Article] A Multifunctional Integrated Silicon Tactile Imager with Arrays of Strain and Temperature Sensors on Single Crystal Silicon Diaphragm (2010)
  • Author(s): H. Takao, M. Yawata, K. Sawada, M. Ishida
  • Journal Title: Sensors and Actuators A Physical Volume: Vol. 160 Pages: 69-77
• [Journal Article] A Multifunctional Integrated Silicon Tactile Imager with Arrays of Strain and Temperature Sensors on Single Crystal Silicon Diaphragm (2010)
  • Author(s): H.Takao, et al.
  • Journal Title: Sensors and Actuators A Volume: Vol.160 Pages: 69-77
  • Peer Reviewed
• [Journal Article] A Versatile Integration Technology of SOI-MEMS/CMOS Devices Using Microbridge Interconnection Structures (2010)
  • Author(s): H.Takao, et al.
  • Journal Title: ASME/IEEE Journal of Microelectromechanical Systems Volume: Vol.10 No.4 Pages: 919-926
  • Peer Reviewed
• [Journal Article] A Multifunctional Integrated Silicon Tactile Imager with Arrays of Strain and Temperature Sensors on Single Crystal Silicon Diaphragm (2010)
  • Author(s): 高尾英邦
  • Journal Title: Sensors and Actuators A (掲載決定)
  • Peer Reviewed
• [Journal Article] A Versatile Integration Technology of SOI-MEMS/CMOS Devices Using Microbridge Interconnection Structures (2010)
  • Author(s): 高尾英邦
  • Journal Title: ASME/IEEE Journal of Microelectromechanical Systems (掲載決定)
  • Peer Reviewed
• [Presentation] 材料判別能にむけた複合センサを集積するメッシュ状シリコン触覚イメージセンサ (2013)
  • Author(s): 高木優佑; 前田祐作; 寺尾京平; 鈴木孝明; 下川房男; 高尾英邦
  • Organizer: 平成25年電気学会全国大会
  • Place of Presentation: 名古屋大学
• [Presentation] 接触面から複数の触覚情報を取得する機能集積型皮膚感覚センサアレイの設計と製作 (2012)
  • Author(s): 前田祐作;高木優佑;寺尾京平;鈴木孝明;下川房男;高尾英邦
  • Organizer: 2012年春期第59回応用物理学関係連合講演会
  • Place of Presentation: 早稲田大学
  • Year and Date: 2012-03-16
• [Presentation] Ail-Flow Based Multifunctional Tactile Display Device with Multi-Jet Integrated Micro Venturi Nozzle Array (2012)
  • Author(s): M.Arai, K.Terao, T.Suzuki, F.Shimokawa, F.Oohira, H.Takao
  • Organizer: The 25th International Conference on Micro Electro Mechanical Systems (IEEE MEMS2012)
  • Place of Presentation: France, Paris
  • Year and Date: 2012-02-01
• [Presentation] A Novel Integrated Tactile Image Sensor for Detection of Surface Friction and Hardness Using the Reference Plane Structure (2012)
  • Author(s): Y. Maeda, K. Terao, T. Suzuki, F. Shimokawa, and H. Takao
  • Organizer: Proc. of IEEE Sensors2012 Conference
  • Place of Presentation: Taipei, Taiwan
• [Presentation] A Post-CMOS Process of High Adhesion SU-8 Structure to Apply to Sensor Device (2012)
  • Author(s): Y. Maeda, K. Terao, T. Suzuki, F. Shimokawa, and H. Takao
  • Organizer: Proc. of 25th International Microprocesses and Nanotechnology Conference (MNC2012)
  • Place of Presentation: Kobe, Japan
• [Presentation] Evaluation of Highly Sensitive C/V Converter with an Inverter for CMOS/MEMS Integration (2012)
  • Author(s): H. Takao, R. Kodama, H. Miyao, M. Ishida
  • Organizer: Proc. of World Automation Congress 2012(WAC2012)
  • Place of Presentation: Puert Varralta, Mexico
• [Presentation] 基準面を用いて物体表面から摩擦力および硬さ情報を取得する機能集積型皮膚感覚センサアレイ (2012)
  • Author(s): 前田祐作; 寺尾京平; 鈴木孝明; 下川房男; 高尾英邦
  • Organizer: 第29回「センサ・マイクロマシンと応用システム」シンポジウム
  • Place of Presentation: 北九州国際会議場
• [Presentation] 新機能創出にむけた集積化シリコンMEMS技術とその応用 (2012)
  • Author(s): 高尾英邦; 大平文和
  • Organizer: 第30回レーザセンシングシンポジウム
  • Place of Presentation: オリビアン小豆島
  • Invited
• [Presentation] Evaluation of Highly Sensitive C/V Converter with an Inverter for CMOS/MEMS Integration (2012)
  • Author(s): H. Takao, R. Kodama, H. Miyao, M. Ishida
  • Organizer: World Automation Congress 2012 (WAC2012)
  • Place of Presentation: Puert Varralta
• [Presentation] MEMS/CMOS集積化技術の過去・現在・未来～デバイス技術と設計技術の変遷～ (2011)
  • Author(s): 高尾英邦
  • Organizer: デザインガイア2011-VLSI設計の新しい大地-
  • Place of Presentation: 日本,宮崎
  • Year and Date: 2011-11-28
• [Presentation] Flexible Silicon Triaxial Tactile Imager with Integrated 800μm-Pitch Sensor Pixel Structures on a Diaphragm (2011)
  • Author(s): H.Takao, H.Okada, M.Ishida, T.Suzuki, F.Oohira
  • Organizer: IEEE Sensors2011 Conference
  • Place of Presentation: Ireland, Limerick
  • Year and Date: 2011-10-29
• [Presentation] A Venturi-type Micro Mist Generator fabricated by MEMS Technology and its Application to Local Surface Cooling of Target Objects (2011)
  • Author(s): M.Arai, K.Terao, T.Suzuki, F.Shimokawa, F.Oohira, H.Takao
  • Organizer: 24th International Microprocesses and Nanotechnology Conference (MNC2011)
  • Place of Presentation: 日本,京都
  • Year and Date: 2011-10-25
• [Presentation] In-pixel type small-scale integrated C-V converter with chopper stabilized CMOS inverter (2011)
  • Author(s): R.Kodama, H.Miyao, M.Ishida, H.Takao
  • Organizer: 2011 International Conference on Solid State Devices and Materials (SSDM2011)
  • Place of Presentation: 日本,名古屋
  • Year and Date: 2011-09-29
• [Presentation] センサ・CMOS集積化技術★徹底解説 (2011)
  • Author(s): 高尾英邦
  • Organizer: Electronic Journal Technical Seminar
  • Place of Presentation: 東京,総評会館
  • Year and Date: 2011-07-25
• [Presentation] Zero Temperature Coefficient Gas-Seald Pressure Sensor Using Mechanical Temperature Compensation (2011)
  • Author(s): X.C.Hao, Y.G.Jiang, H.Takao, K.Maenaka, T.Fujita, K.Higuchi
  • Organizer: The 16th International Conference on Sensors, Actuators, and Microsystems (IEEE Transducers'11)
  • Place of Presentation: 中国,北京
  • Year and Date: 2011-06-06
• [Presentation] 集積化センサ技術とその実用例～そのポテンシャルを活かす回路と集積化の勘所～ (2011)
  • Author(s): 高尾英邦
  • Organizer: NEアカデミー
  • Place of Presentation: 東京,Biz新宿
  • Year and Date: 2011-04-27
• [Presentation] Flexible Silicon Triaxial Tactile Imager with Integrated 800μm-Pitch Sensor Pixel Structures on a Diaphragm (2011)
  • Author(s): H. Takao, H. Okada, M. Ishida, T. Suzuki, F. Oohira
  • Organizer: Proc. of IEEE Sensors2011 Conference
  • Place of Presentation: Limerick Ireland
• [Presentation] In-pixel type small-scale integrated "C-V converter with chopper stabilized CMOS inverter (2011)
  • Author(s): R. Kodama, H. Miyao, M. Ishida, and H. Takao
  • Organizer: Proc. of 2011 International Conference on Solid State Devices and Materials (SSDM2011)
  • Place of Presentation: Nagoya, Japan
• [Presentation] A Robust and Sensitive Silicon Tactile Imager with Individually Formed SU-8 Protective Layers on Piezoresistor Pixels (2010)
  • Author(s): H.Takao, et al.
  • Organizer: IEEE Sensors2010
  • Place of Presentation: アメリカ合衆国, ハワイ州ワイコロア
  • Year and Date: 2010-11-03
• [Presentation] 高耐圧CMOS技術を用いた集積化アクチュエータアレイ駆動回路の製作と評価 (2010)
  • Author(s): 小玉亮, 他
  • Organizer: 第2回集積化MEMSシンポジウム
  • Place of Presentation: くに びきメッセ(島根県)
  • Year and Date: 2010-10-15
• [Presentation] 画素内集積型CV変換回路を有する高感度微弱力センサアレイ (2010)
  • Author(s): 小玉亮, 他
  • Organizer: 第27回センサマイクロマシンと応用システムシンポジウム
  • Place of Presentation: 島根県立産業交流会館(島根県)
  • Year and Date: 2010-10-14
• [Presentation] 異種機能集積化におけるMEMS/CMOS設計技術 (2010)
  • Author(s): 高尾英邦
  • Organizer: 第71回応用物理学会学術講演会
  • Place of Presentation: 長崎大学(招待講演)
  • Year and Date: 2010-09-14
• [Presentation] 集積化センサ技術 (2010)
  • Author(s): 高尾英邦
  • Organizer: NEアカデミー
  • Place of Presentation: BIZ新宿(東京都)(招待講演)
  • Year and Date: 2010-09-01
• [Presentation] A Robust and Sensitive Silicon Tactile Imager with Individually Formed SU-8 Protective Layers on Piezoresistor Pixels (2010)
  • Author(s): H. Takao, H. Okada, M. Ishida, T. Terao, T. Suzuki, F. Oohira
  • Organizer: IEEE Sensors 2010 Conference
  • Place of Presentation: Hawaii, USA
• [Presentation] A Membrane Tyep Si-MEMS Tactile Imager with Fingerprint Structure for Realization of Slip Sensing Capability (2010)
  • Author(s): H. Okada, M. Yawata, M. Ishida, K. Sawada, H. Takao
  • Organizer: Proc. of The 23rd IEEE International Conference on Micro Electro Mechanical Systems (IEEE MEMS2010)
  • Place of Presentation: HongKong, China
• [Presentation] A Membrane Type Si-MEMS Tactile Imager with Fingerprint Structure for Realization of Slip Sensing Capability (2010)
  • Author(s): 高尾英邦
  • Organizer: The 23rd IEEE International Conference on Micro Electro Mechanical Systems (MEMS2010)
  • Place of Presentation: Hong Kong, China
• [Presentation] Three Dimensional Surface-Shape Tactile Imager with Fingertip-Size Silicon Integrated Sensor-Membrane (2009)
  • Author(s): 高尾英邦
  • Organizer: The 15th International Conference on Sensors, Actuators, and Microsystems (Transducers'09)
  • Place of Presentation: Denver, Colorado, USA
• [Book] 電気工学ハンドブック（第七版）10編第3章8節「集積化システムの製作プロセス」 (2013)
  • Author(s): 高尾英邦
  • Total Pages: 4
  • Publisher: 電気学会
• [Book] 異種機能集積化ハンドブック,担当箇所:第14 章 集積化 MEMS センサ実現のための回路設計 (2012)
  • Author(s): 高尾英邦
  • Publisher: CMC 出版
• [Book] Electronic Journal Archives (2011)
  • Author(s): 高尾英邦
  • Total Pages: 76
  • Publisher: 株式会社 電子ジャーナル
• [Book] Electronic Journal Archives No.186センサ・CMOS集積化技術★徹底解説 (2011)
  • Author(s): 高尾英邦
  • Total Pages: 76
  • Publisher: 株式会社電子ジャーナル
• [Book] 電気工学ハンドブック(第七版)10編第3章8節「集積化システムの製作プロセス」 (2011)
  • Author(s): 高尾英邦
  • Publisher: 電気学会(印刷中)
• [Patent(Industrial Property Rights)] 触覚センサ (2012)
  • Inventor(s): 高尾英邦
  • Industrial Property Rights Holder: 香川大学
  • Industrial Property Number: 2012-034357
  • Filing Date: 2012-02-20
• [Patent(Industrial Property Rights)] MEMS光学部品 (2012)
  • Inventor(s): 高尾英邦, 大平文和, 下川房男
  • Industrial Property Rights Holder: 香川大学
  • Industrial Property Number: 2012-042744
  • Filing Date: 2012-02-29