The void and mechanism of heat conduction by thermal phonon in liquids
Project/Area Number |
21540382
|
Research Category |
Grant-in-Aid for Scientific Research (C)
|
Allocation Type | Single-year Grants |
Section | 一般 |
Research Field |
Mathematical physics/Fundamental condensed matter physics
|
Research Institution | Niigata University |
Principal Investigator |
|
Project Period (FY) |
2009 – 2011
|
Project Status |
Completed (Fiscal Year 2011)
|
Budget Amount *help |
¥3,900,000 (Direct Cost: ¥3,000,000、Indirect Cost: ¥900,000)
Fiscal Year 2011: ¥1,040,000 (Direct Cost: ¥800,000、Indirect Cost: ¥240,000)
Fiscal Year 2010: ¥650,000 (Direct Cost: ¥500,000、Indirect Cost: ¥150,000)
Fiscal Year 2009: ¥2,210,000 (Direct Cost: ¥1,700,000、Indirect Cost: ¥510,000)
|
Keywords | 物性基礎論 / 熱伝導率 / 分子動力学法 / 溶融塩 / フォノン / 空隙 / 単純液体 |
Research Abstract |
The mean free path of thermal carrier in liquid argon has successfully been expressed with number density and packing fraction on the basis of the evaluated results of the dependences of heat capacity, thermal conductivity, and sound velocity on temperature, number density, atomic mass, and packing fraction. The results of evaluation using the WCA potentials reveal that the origin of dependences of the calculated thermal conductivity of simple liquids and molten salts on temperature and packing fraction is traceable to the softness of repulsive part in the potentials.
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Report
(4 results)
Research Products
(38 results)