| Project/Area Number |
21550212
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| Research Category |
Grant-in-Aid for Scientific Research (C)
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| Allocation Type | Single-year Grants |
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| Section | 一般 |
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| Research Field |
Polymer/Textile materials
|
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| Research Institution | Toho University |
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Principal Investigator |
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| Project Period (FY) |
2009 – 2011
|
| Project Status |
Completed (Fiscal Year 2011)
|
| Budget Amount *help |
¥3,120,000 (Direct Cost: ¥2,400,000、Indirect Cost: ¥720,000)
Fiscal Year 2011: ¥910,000 (Direct Cost: ¥700,000、Indirect Cost: ¥210,000)
Fiscal Year 2010: ¥910,000 (Direct Cost: ¥700,000、Indirect Cost: ¥210,000)
Fiscal Year 2009: ¥1,300,000 (Direct Cost: ¥1,000,000、Indirect Cost: ¥300,000)
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| Keywords | 耐熱性絶縁材料 / フレキシブルプリント配線基板 / 低熱膨張係数 / 低吸湿膨張係数 / ポリエステルイミド / 高周波特性 / 誘電率 / 誘電正接 / 低吸水率 / 低弾性率 |
|---|
| Research Abstract |
Flexible printed circuit boards(FPC) are frequently used in various electronic devices such as mobile phones, TVs, cameras, personal computers. Recent trends to lightening, thinning, and miniaturizing for their devices also bring about strong demands toward further improved performances and functionalization of high-temperature polymeric materials used in FPCs, e. g., good dielectric properties at GHz ranges and excellent dimensional stability against thermal cycles and water absorption. The present research project successfully provided novel heat-resistant dielectric materials possessing excellent combined properties. The products obtained in this work are expected to be applied to various electronic devices.
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