Development of ultra-precision cutting method for composite material with thermosetting resin and electric conductor

Research Project

Project/Area Number	21560111
Research Category	Grant-in-Aid for Scientific Research (C)
Allocation Type	Single-year Grants
Section	一般
Research Field	Production engineering/Processing studies
Research Institution	Saitama University
Principal Investigator	HORIO Kenichiro 埼玉大学, 大学院・理工学研究科, 教授 (60201761)
Co-Investigator(Kenkyū-buntansha)	KANEKO Jun'ichi 埼玉大学, 大学院・理工学研究科, 助教 (80375584)
Project Period (FY)	2009 – 2011
Project Status	Completed (Fiscal Year 2011)
Budget Amount *help	¥4,680,000 (Direct Cost: ¥3,600,000、Indirect Cost: ¥1,080,000) Fiscal Year 2011: ¥650,000 (Direct Cost: ¥500,000、Indirect Cost: ¥150,000) Fiscal Year 2010: ¥1,690,000 (Direct Cost: ¥1,300,000、Indirect Cost: ¥390,000) Fiscal Year 2009: ¥2,340,000 (Direct Cost: ¥1,800,000、Indirect Cost: ¥540,000)
Keywords	切削 / ダイヤモンド工具 / 樹脂 / 半導体 / 熱硬化性樹脂 / 基板材料
Research Abstract	This study deals development of a new precision cutting method for composite material with thermosetting resin and electric conductor. In manufacturing process of a large scale integrated circuit, a pasting process between two ceramic substrates with thermosetting resin is required. In this study, a new cutting method with single crystal diamond byte to realize high flatness of machined resin surfaces is developed.

Report

(4 results)