Development of ultra-precision cutting method for composite material with thermosetting resin and electric conductor
| Project/Area Number |
21560111
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| Research Category |
Grant-in-Aid for Scientific Research (C)
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| Allocation Type | Single-year Grants |
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| Section | 一般 |
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| Research Field |
Production engineering/Processing studies
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| Research Institution | Saitama University |
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Principal Investigator |
HORIO Kenichiro 埼玉大学, 大学院・理工学研究科, 教授 (60201761)
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| Co-Investigator(Kenkyū-buntansha) |
KANEKO Jun'ichi 埼玉大学, 大学院・理工学研究科, 助教 (80375584)
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| Project Period (FY) |
2009 – 2011
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| Project Status |
Completed (Fiscal Year 2011)
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| Budget Amount *help |
¥4,680,000 (Direct Cost: ¥3,600,000、Indirect Cost: ¥1,080,000)
Fiscal Year 2011: ¥650,000 (Direct Cost: ¥500,000、Indirect Cost: ¥150,000)
Fiscal Year 2010: ¥1,690,000 (Direct Cost: ¥1,300,000、Indirect Cost: ¥390,000)
Fiscal Year 2009: ¥2,340,000 (Direct Cost: ¥1,800,000、Indirect Cost: ¥540,000)
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| Keywords | 切削 / ダイヤモンド工具 / 樹脂 / 半導体 / 熱硬化性樹脂 / 基板材料 |
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| Research Abstract |
This study deals development of a new precision cutting method for composite material with thermosetting resin and electric conductor. In manufacturing process of a large scale integrated circuit, a pasting process between two ceramic substrates with thermosetting resin is required. In this study, a new cutting method with single crystal diamond byte to realize high flatness of machined resin surfaces is developed.
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Report
(4 results)
Research Products
(4 results)
