Micro Milling of Sapphire
| Project/Area Number |
21560130
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| Research Category |
Grant-in-Aid for Scientific Research (C)
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| Allocation Type | Single-year Grants |
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| Section | 一般 |
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| Research Field |
Production engineering/Processing studies
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| Research Institution | Tokyo Denki University |
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Principal Investigator |
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| Project Period (FY) |
2009 – 2011
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| Project Status |
Completed (Fiscal Year 2011)
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| Budget Amount *help |
¥4,680,000 (Direct Cost: ¥3,600,000、Indirect Cost: ¥1,080,000)
Fiscal Year 2011: ¥780,000 (Direct Cost: ¥600,000、Indirect Cost: ¥180,000)
Fiscal Year 2010: ¥1,170,000 (Direct Cost: ¥900,000、Indirect Cost: ¥270,000)
Fiscal Year 2009: ¥2,730,000 (Direct Cost: ¥2,100,000、Indirect Cost: ¥630,000)
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| Keywords | サファイア / 切削 / エンドミル / 硬脆材料 / 脆性損傷 / 溶着 / マイクロ加工 / 切削力 / 異方性 |
|---|
| Research Abstract |
Micro cutting of sapphire is studied to manufacture micro devices used in special environments at extremely high pressures and/or temperatures. Because sapphire is a hexagonal crystal material, the cutting force and the critical cutting depth, the maximum depth in which crack-free surfaces are finished, depends on the crystal plane and the cutting direction with respect to the crystal axis. In milling of sapphire, brittle fracture and adhesion of the surface finish should be considered in determination of the cutting conditions. The adhesion of material is reduced by the decomposed process, in which the cutting depth is given incrementally.
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Report
(4 results)
Research Products
(4 results)
