| Budget Amount *help |
¥27,560,000 (Direct Cost: ¥21,200,000、Indirect Cost: ¥6,360,000)
Fiscal Year 2011: ¥3,120,000 (Direct Cost: ¥2,400,000、Indirect Cost: ¥720,000)
Fiscal Year 2010: ¥6,370,000 (Direct Cost: ¥4,900,000、Indirect Cost: ¥1,470,000)
Fiscal Year 2009: ¥18,070,000 (Direct Cost: ¥13,900,000、Indirect Cost: ¥4,170,000)
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| Research Abstract |
In order to investigate the plastic deformation mechanism in nano-components where a nano-thickness copper(Cu) film is sandwiched between a silicon(Si) substrate and silicon nitride(SiN) layer, we developed a bending specimen, of which understructure can be observed in-situ by means of a transmission electron microscope(TEM), and examined the plastic behavior of a Cu portion. TEM images exhibited that an initial plastic deformation took place near the interface edge(junction between the Cu/Si interface and the surface) in the Cu portion with a high critical resolved shear stress(400. 420 MPa). The TEM observation after the experiment indicated that stacking fault layers governed the plastic deformation in nano-scale region near the dissimilar interface.
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